The global metal electronic packaging materials market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 3.2 billion by 2030. The growth of this market is driven by the increasing demand for high-performance and low-cost electronics products, which in turn drives the demand for metal electronic packaging materials. The substrate material segment accounted for the largest share of this market in 2018, followed by wiring material and sealing material segments. The semiconductor & IC application segment accounted for the largest share of this market in 2018, followed by PCB application segment. North America was estimated to account for the largest share of this market in 2018, followed by Europe and Asia Pacific respectively.
Some Of The Growth Factors Of This Market:
- Metal electronic packaging materials are used in various applications such as printed circuit boards (PCBs), connectors, semiconductors, and other components that are used in consumer electronics devices such as smartphones and tablets among others.
Industry Growth Insights published a new data on “Metal Electronic Packaging Materials Market”. The research report is titled “Metal Electronic Packaging Materials Market research by Types (Substrate Material, Wiring Material, Sealing Material, Interlayer Dielectric Material, Other Materials), By Applications (Semiconductor & IC, PCB, Others), By Players/Companies DuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Metal Electronic Packaging Materials Market Research Report
By Type
Substrate Material, Wiring Material, Sealing Material, Interlayer Dielectric Material, Other Materials
By Application
Semiconductor & IC, PCB, Others
By Companies
DuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
246
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Metal Electronic Packaging Materials Market Report Segments:
The global Metal Electronic Packaging Materials market is segmented on the basis of:
Types
Substrate Material, Wiring Material, Sealing Material, Interlayer Dielectric Material, Other Materials
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor & IC, PCB, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DuPont
- Evonik
- EPM
- Mitsubishi Chemical
- Sumitomo Chemical
- Mitsui High-tec
- Tanaka
- Shinko Electric Industries
- Panasonic
- Hitachi Chemical
- Kyocera Chemical
- Gore
- BASF
- Henkel
- AMETEK Electronic
- Toray
- Maruwa
- Leatec Fine Ceramics
- NCI
- Chaozhou Three-Circle
- Nippon Micrometal
- Toppan
- Dai Nippon Printing
- Possehl
- Ningbo Kangqiang
Highlights of The Metal Electronic Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Substrate Material
- Wiring Material
- Sealing Material
- Interlayer Dielectric Material
- Other Materials
- By Application:
- Semiconductor & IC
- PCB
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Metal Electronic Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Metal electronic packaging materials are made from a variety of metals, including aluminum, brass, copper, and stainless steel. They are often used to create boxes and other packaging for electronics products. Metal electronic packaging materials can be heat-sealed or glued together to create custom packages for your products.
Some of the major players in the metal electronic packaging materials market are DuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang.
The metal electronic packaging materials market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Metal Electronic Packaging Materials Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Metal Electronic Packaging Materials Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Metal Electronic Packaging Materials Market - Supply Chain
4.5. Global Metal Electronic Packaging Materials Market Forecast
4.5.1. Metal Electronic Packaging Materials Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Metal Electronic Packaging Materials Market Size (000 Units) and Y-o-Y Growth
4.5.3. Metal Electronic Packaging Materials Market Absolute $ Opportunity
5. Global Metal Electronic Packaging Materials Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
5.3.1. Substrate Material
5.3.2. Wiring Material
5.3.3. Sealing Material
5.3.4. Interlayer Dielectric Material
5.3.5. Other Materials
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Metal Electronic Packaging Materials Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
6.3.1. Semiconductor & IC
6.3.2. PCB
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Metal Electronic Packaging Materials Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Metal Electronic Packaging Materials Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Metal Electronic Packaging Materials Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Metal Electronic Packaging Materials Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Metal Electronic Packaging Materials Demand Share Forecast, 2019-2026
9. North America Metal Electronic Packaging Materials Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Metal Electronic Packaging Materials Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
9.4.1. Semiconductor & IC
9.4.2. PCB
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
9.7.1. Substrate Material
9.7.2. Wiring Material
9.7.3. Sealing Material
9.7.4. Interlayer Dielectric Material
9.7.5. Other Materials
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Metal Electronic Packaging Materials Demand Share Forecast, 2019-2026
10. Latin America Metal Electronic Packaging Materials Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Metal Electronic Packaging Materials Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
10.4.1. Semiconductor & IC
10.4.2. PCB
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
10.7.1. Substrate Material
10.7.2. Wiring Material
10.7.3. Sealing Material
10.7.4. Interlayer Dielectric Material
10.7.5. Other Materials
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Metal Electronic Packaging Materials Demand Share Forecast, 2019-2026
11. Europe Metal Electronic Packaging Materials Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Metal Electronic Packaging Materials Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
11.4.1. Semiconductor & IC
11.4.2. PCB
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
11.7.1. Substrate Material
11.7.2.Wiring Material
11.7.3. Sealing Material
11.7.4. Interlayer Dielectric Material
11.7.5. Other Materials
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Metal Electronic Packaging Materials Demand Share, 2019-2026
12. Asia Pacific Metal Electronic Packaging Materials Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Metal Electronic Packaging Materials Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
12.4.1. Semiconductor & IC
12.4.2. PCB
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
12.7.1. Substrate Material
12.7.2. Wiring Material
12.7.3. Sealing Material
12.7.4. Interlayer Dielectric Material
12.7.5. Other Materials
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Metal Electronic Packaging Materials Demand Share, 2019-2026
13. Middle East & Africa Metal Electronic Packaging Materials Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Metal Electronic Packaging Materials Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Metal Electronic Packaging Materials Market Size and Volume Forecast by Application
13.4.1. Semiconductor & IC
13.4.2. PCB
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Metal Electronic Packaging Materials Market Size and Volume Forecast by Type
13.7.1. Substrate Material
13.7.2. Wiring Material
13.7.3. Sealing Material
13.7.4. Interlayer Dielectric Material
13.7.5. Other Materials
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Metal Electronic Packaging Materials Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Metal Electronic Packaging Materials Market: Market Share Analysis
14.2. Metal Electronic Packaging Materials Distributors and Customers
14.3. Metal Electronic Packaging Materials Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. DuPont
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Evonik
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. EPM
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Mitsubishi Chemical
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Sumitomo Chemical
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Mitsui High-tec
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tanaka
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Shinko Electric Industries
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Panasonic
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Hitachi Chemical
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Kyocera Chemical
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Gore
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. BASF
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Henkel
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. AMETEK Electronic
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Toray
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Maruwa
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Leatec Fine Ceramics
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. NCI
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Chaozhou Three-Circle
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook