Market Overview:
The global automotive power module packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for electric vehicles (EVs) and hybrid electric vehicles (HEVs). The other type segment is expected to grow at the highest CAGR during the forecast period, owing to the increasing demand for SiC modules and GaN modules. The battery electric vehicle (BEV) segment is expected to hold a major share of the global automotive power module packaging market in 2018. This can be attributed to government initiatives across various countries towards promoting EVs.
Product Definition:
The automotive power module packaging is a type of packaging that is used to protect and house the power modules. The importance of this type of packaging is that it helps to protect the modules from damage, which can occur during shipping or while in use.
Intelligent Power Module:
Intelligent power module is a smart and intelligent electronic device used in automotive power modules. It helps to manage the electric energy efficiently by controlling various functions such as voltage, current, load factor, phase angle and frequency of the battery. The growing demand for hybrid vehicles along with increasing awareness regarding efficient usage of electricity is expected to drive the market growth over the forecast period.
The global intelligent power module packaging market size was valued at USD 1.96 billion in 2015.
SiC Module:
The Silicon Carbide (SiC) module is a power device that helps in storing energy. It is mainly used for automotive applications such as start-stop systems, battery management systems, and electric power steering. The growing demand for lightweight vehicles along with stringent government regulations to reduce carbon emissions across the globe has led to an increase in the usage of SiC modules over the past few years.
Application Insights:
Automotive power module packaging is carried out in a way to protect the modules from physical and electrical damage. The other application segment includes fuel cell vehicles, which use direct current (DC) electric motors. DC electric motors are compact and consume less power than their AC counterparts; as a result, they generate lower heat and do not require cooling systems for the vehicle occupants.
Battery electric vehicles or BEVs are expected to witness significant growth over the forecast period owing to various government initiatives such as Low-Emission Vehicle Program in China, Clean Air Program in Europe, etc., that have resulted in increasing sales of battery-operated cars across regions worldwide.
Regional Analysis:
Asia Pacific region accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The regional growth can be attributed to rising sales of passenger cars and light commercial vehicles in countries such as China, India, Japan, South Korea, Thailand among others. In addition, increasing government initiatives such as “Make in India†are expected to boost automobile production which will further drive the market demand for APM packaging solution providers across this region.
Europe is anticipated to witness significant growth over the next eight years owing to stringent emission norms implemented by various governments across this region coupled with growing consumer awareness regarding fuel economy of automobiles.
Growth Factors:
- Increasing demand for electric vehicles: The automotive power module packaging market is expected to grow at a significant rate in the coming years, owing to the increasing demand for electric vehicles. This is because electric vehicles are more energy-efficient and environment-friendly as compared to traditional gasoline or diesel-powered cars.
- Rising disposable income of consumers: Another key growth driver for the automotive power module packaging market is the rising disposable income of consumers, which has led to an increase in their purchasing power. This has resulted in an increase in demand for luxury cars and SUVs, which require advanced and sophisticated power modules.
- Technological advancements: The automotive industry is constantly evolving with new technological advancements being made every day. This has led to a rise in the number of high-end cars that are equipped with advanced features such as autonomous driving, lane departure warning systems, etc., all of which require sophisticated power modules that need to be packaged securely and efficiently.
Scope Of The Report
Report Attributes
Report Details
Report Title
Automotive Power Module Packaging Market Research Report
By Type
Intelligent Power Module, SiC Module, GaN Module, Other, Automotive Power Module Packagin
By Application
Battery Electric Vehicles (BEV), Plug-in Hybrid Electric Vehicles (PHEV)
By Companies
Amkor Technology, Kulicke and Soffa Industries, Infineon Technologies, STMicroelectronics, Fuji Electric, Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC, Starpower Semiconductor, Bosch, Toyota, Mitsubishi, Automotive Power Module Packagin
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
240
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global Automotive Power Module Packaging Market Report Segments:
The global Automotive Power Module Packaging market is segmented on the basis of:
Types
Intelligent Power Module, SiC Module, GaN Module, Other, Automotive Power Module Packagin
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Battery Electric Vehicles (BEV), Plug-in Hybrid Electric Vehicles (PHEV)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- Kulicke and Soffa Industries
- Infineon Technologies
- STMicroelectronics
- Fuji Electric
- Toshiba Electronic Device & Storage Corporation
- Semikron
- STATS ChipPAC
- Starpower Semiconductor
- Bosch
- Toyota
- Mitsubishi
- Automotive Power Module Packagin
Highlights of The Automotive Power Module Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Intelligent Power Module
- SiC Module
- GaN Module
- Other
- Automotive Power Module Packagin
- By Application:
- Battery Electric Vehicles (BEV)
- Plug-in Hybrid Electric Vehicles (PHEV)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Automotive Power Module Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Automotive power module packaging is a type of electronic equipment packaging that is used to protect and organize electronic components within an automotive system. Automotive power module packaging typically includes a housing, which encloses the electronics and provides protection from environmental elements. The housing also allows for easy installation and removal of the components, as well as access to all necessary connections.
Some of the key players operating in the automotive power module packaging market are Amkor Technology, Kulicke and Soffa Industries, Infineon Technologies, STMicroelectronics, Fuji Electric, Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC, Starpower Semiconductor, Bosch, Toyota, Mitsubishi, Automotive Power Module Packagin.
The automotive power module packaging market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Automotive Power Module Packaging Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Automotive Power Module Packaging Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Automotive Power Module Packaging Market - Supply Chain
4.5. Global Automotive Power Module Packaging Market Forecast
4.5.1. Automotive Power Module Packaging Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Automotive Power Module Packaging Market Size (000 Units) and Y-o-Y Growth
4.5.3. Automotive Power Module Packaging Market Absolute $ Opportunity
5. Global Automotive Power Module Packaging Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Automotive Power Module Packaging Market Size and Volume Forecast by Type
5.3.1. Intelligent Power Module
5.3.2. SiC Module
5.3.3. GaN Module
5.3.4. Other
5.3.5. Automotive Power Module Packagin
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Automotive Power Module Packaging Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Automotive Power Module Packaging Market Size and Volume Forecast by Application
6.3.1. Battery Electric Vehicles (BEV)
6.3.2. Plug-in Hybrid Electric Vehicles (PHEV)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Automotive Power Module Packaging Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Automotive Power Module Packaging Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Automotive Power Module Packaging Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Automotive Power Module Packaging Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Automotive Power Module Packaging Demand Share Forecast, 2019-2026
9. North America Automotive Power Module Packaging Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Automotive Power Module Packaging Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Automotive Power Module Packaging Market Size and Volume Forecast by Application
9.4.1. Battery Electric Vehicles (BEV)
9.4.2. Plug-in Hybrid Electric Vehicles (PHEV)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Automotive Power Module Packaging Market Size and Volume Forecast by Type
9.7.1. Intelligent Power Module
9.7.2. SiC Module
9.7.3. GaN Module
9.7.4. Other
9.7.5. Automotive Power Module Packagin
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Automotive Power Module Packaging Demand Share Forecast, 2019-2026
10. Latin America Automotive Power Module Packaging Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Automotive Power Module Packaging Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Automotive Power Module Packaging Market Size and Volume Forecast by Application
10.4.1. Battery Electric Vehicles (BEV)
10.4.2. Plug-in Hybrid Electric Vehicles (PHEV)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Automotive Power Module Packaging Market Size and Volume Forecast by Type
10.7.1. Intelligent Power Module
10.7.2. SiC Module
10.7.3. GaN Module
10.7.4. Other
10.7.5. Automotive Power Module Packagin
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Automotive Power Module Packaging Demand Share Forecast, 2019-2026
11. Europe Automotive Power Module Packaging Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Automotive Power Module Packaging Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Automotive Power Module Packaging Market Size and Volume Forecast by Application
11.4.1. Battery Electric Vehicles (BEV)
11.4.2. Plug-in Hybrid Electric Vehicles (PHEV)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Automotive Power Module Packaging Market Size and Volume Forecast by Type
11.7.1. Intelligent Power Module
11.7.2. SiC Module
11.7.3. GaN Module
11.7.4. Other
11.7.5. Automotive Power Module Packagin
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Automotive Power Module Packaging Demand Share, 2019-2026
12. Asia Pacific Automotive Power Module Packaging Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Automotive Power Module Packaging Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Automotive Power Module Packaging Market Size and Volume Forecast by Application
12.4.1. Battery Electric Vehicles (BEV)
12.4.2. Plug-in Hybrid Electric Vehicles (PHEV)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Automotive Power Module Packaging Market Size and Volume Forecast by Type
12.7.1. Intelligent Power Module
12.7.2. SiC Module
12.7.3. GaN Module
12.7.4. Other
12.7.5. Automotive Power Module Packagin
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Automotive Power Module Packaging Demand Share, 2019-2026
13. Middle East & Africa Automotive Power Module Packaging Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Automotive Power Module Packaging Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Automotive Power Module Packaging Market Size and Volume Forecast by Application
13.4.1. Battery Electric Vehicles (BEV)
13.4.2. Plug-in Hybrid Electric Vehicles (PHEV)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Automotive Power Module Packaging Market Size and Volume Forecast by Type
13.7.1. Intelligent Power Module
13.7.2. SiC Module
13.7.3. GaN Module
13.7.4. Other
13.7.5. Automotive Power Module Packagin
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Automotive Power Module Packaging Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Automotive Power Module Packaging Market: Market Share Analysis
14.2. Automotive Power Module Packaging Distributors and Customers
14.3. Automotive Power Module Packaging Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Amkor Technology
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Kulicke and Soffa Industries
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Infineon Technologies
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. STMicroelectronics
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Fuji Electric
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Toshiba Electronic Device & Storage Corporation
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Semikron
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. STATS ChipPAC
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Starpower Semiconductor
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Bosch
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Toyota
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Mitsubishi
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Automotive Power Module Packagin
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
