Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Ball Grid Array (BGA) Packages Market by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA), By Application (OEM, Aftermarket) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Ball Grid Array (BGA) Packages Market by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA), By Application (OEM, Aftermarket) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 152950 3300 Electronics & Semiconductor 377 243 Pages 4.8 (49) 
                                          

                                                                                       
Industry Growth Insights published a new data on “Ball Grid Array (BGA) Packages Market”. The research report is titled “Ball Grid Array (BGA) Packages Market research by Types (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA), By Applications (OEM, Aftermarket), By Players/Companies Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co., STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, Intel, Corintech Ltd, Integrated Circuit Engineering Corporation”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Ball Grid Array (BGA) Packages Market Research Report
By Type
Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA
By Application
OEM, Aftermarket
By Companies
Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co., STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, Intel, Corintech Ltd, Integrated Circuit Engineering Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
243
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.

Global Ball Grid Array (BGA) Packages Industry Outlook


Global Ball Grid Array (BGA) Packages Market Report Segments:
The global Ball Grid Array (BGA) Packages market is segmented on the basis of:
Types
Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
OEM, Aftermarket
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
  1. Amkor Technology
  2. TriQuint Semiconductor Inc.
  3. Jiangsu Changjiang Electronics Technology Co.
  4. STATS ChipPAC Ltd.
  5. ASE Group
  6. Advanced Semiconductor Engineering, Inc.
  7. PARPRO
  8. Intel
  9. Corintech Ltd
  10. Integrated Circuit Engineering Corporation

Global Ball Grid Array (BGA) Packages Market Overview


Highlights of The Ball Grid Array (BGA) Packages Market Report:
  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:
    1. Molded Array Process BGA
    2. Thermally Enhanced BGA
    3. Package on Package (PoP) BGA
    4. Micro BGA
  1. By Application:
    1. OEM
    2. Aftermarket
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Ball Grid Array (BGA) Packages Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Ball Grid Array (BGA) Packages Market Statistics

8 Reasons to Buy This Report
  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


What is Ball Grid Array (BGA) Packages?

Ball Grid Array (BGA) packages are a type of computer chip package that uses balls to hold the chips in place. The balls are held in place by small pins that pass through them. This design makes it possible to pack more chips into a single package than traditional chip packages.

Some of the major players in the ball grid array (bga) packages market are Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co., STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, Intel, Corintech Ltd, Integrated Circuit Engineering Corporation. 

                                            

                                               
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Ball Grid Array (BGA) Packages Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Ball Grid Array (BGA) Packages Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Ball Grid Array (BGA) Packages Market - Supply Chain
   4.5. Global Ball Grid Array (BGA) Packages Market Forecast
      4.5.1. Ball Grid Array (BGA) Packages Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Ball Grid Array (BGA) Packages Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Ball Grid Array (BGA) Packages Market Absolute $ Opportunity

5. Global Ball Grid Array (BGA) Packages Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      5.3.1. Molded Array Process BGA
      5.3.2. Thermally Enhanced BGA
      5.3.3. Package on Package (PoP) BGA
      5.3.4. Micro BGA
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Ball Grid Array (BGA) Packages Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      6.3.1. OEM
      6.3.2. Aftermarket
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Ball Grid Array (BGA) Packages Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Ball Grid Array (BGA) Packages Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Ball Grid Array (BGA) Packages Demand Share Forecast, 2019-2026

9. North America Ball Grid Array (BGA) Packages Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      9.4.1. OEM
      9.4.2. Aftermarket
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      9.7.1. Molded Array Process BGA
      9.7.2. Thermally Enhanced BGA
      9.7.3. Package on Package (PoP) BGA
      9.7.4. Micro BGA
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Ball Grid Array (BGA) Packages Demand Share Forecast, 2019-2026

10. Latin America Ball Grid Array (BGA) Packages Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      10.4.1. OEM
      10.4.2. Aftermarket
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      10.7.1. Molded Array Process BGA
      10.7.2. Thermally Enhanced BGA
      10.7.3. Package on Package (PoP) BGA
      10.7.4. Micro BGA
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Ball Grid Array (BGA) Packages Demand Share Forecast, 2019-2026

11. Europe Ball Grid Array (BGA) Packages Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      11.4.1. OEM
      11.4.2. Aftermarket
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      11.7.1. Molded Array Process BGA
      11.7.2. Thermally Enhanced BGA
      11.7.3. Package on Package (PoP) BGA
      11.7.4. Micro BGA
   11.8. Basis Point Shar (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Ball Grid Array (BGA) Packages Demand Share, 2019-2026

12. Asia Pacific Ball Grid Array (BGA) Packages Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      12.4.1. OEM
      12.4.2. Aftermarket
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      12.7.1. Molded Array Process BGA
      12.7.2. Thermally Enhanced BGA
      12.7.3. Package on Package (PoP) BGA
      12.7.4. Micro BGA
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Ball Grid Array (BGA) Packages Demand Share, 2019-2026

13. Middle East & Africa Ball Grid Array (BGA) Packages Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Application
      13.4.1. OEM
      13.4.2. Aftermarket
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Ball Grid Array (BGA) Packages Market Size and Volume Forecast by Type
      13.7.1. Molded Array Process BGA
      13.7.2. Thermally Enhanced BGA
      13.7.3. Package on Package (PoP) BGA
      13.7.4. Micro BGA
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Ball Grid Array (BGA) Packages Demand Share, 2019-2026

14. Competition Landscape
   14.1. Global Ball Grid Array (BGA) Packages Market: Market Share Analysis
   14.2. Ball Grid Array (BGA) Packages Distributors and Customers
   14.3. Ball Grid Array (BGA) Packages Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. Amkor Technology
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. TriQuint Semiconductor Inc.
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. Jiangsu Changjiang Electronics Technology Co.
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. STATS ChipPAC Ltd.
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. ASE Group
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. Advanced Semiconductor Engineering, Inc.
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. PARPRO
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Intel
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. Corintech Ltd
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. Integrated Circuit Engineering Corporation
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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