The global dicing die attach film market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market is driven by the increasing demand for semiconductors and electronic components in various industries such as automotive, aerospace & defense, and consumer electronics. The demand for these products is expected to increase due to their use in various applications such as smartphones, tablets, laptops, and televisions among others.
The conductive type segment accounted for the largest share of the global dicing die attach film market in 2018 owing to its high demand from semiconductor manufacturers across different regions such as North America and Asia Pacific. This segment is also projected to grow at a higher CAGR during the forecast period due to its high usage in manufacturing electronic components which are used in various industries such as automotive, aerospace & defense among others.
- The demand for dice is increasing due to the increase in the number of board games and card games.
- The demand for dice is also increasing due to the increase in the number of people who are interested in playing these games.
- The demand for dice is also increasing due to the increase in popularity of gambling, which requires a die as one of its components.
- The demand for dice is also increasing due to an increased interest among children and adults alike on learning how to play these games, which requires a die as one of its components.
- Dice are used by many people as a form of divination.
Industry Growth Insights published a new data on “Dicing Die Attach Film Market”. The research report is titled “Dicing Die Attach Film Market research by Types (Conductive Type, Non-Conductive Type, ), By Applications (Semiconductors, Electronic Components, Other, ), By Players/Companies Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Dicing Die Attach Film Market Research Report
By Type
Conductive Type, Non-Conductive Type,
By Application
Semiconductors, Electronic Components, Other,
By Companies
Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Dicing Die Attach Film Market Report Segments:
The global Dicing Die Attach Film market is segmented on the basis of:
Types
Conductive Type, Non-Conductive Type,
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductors, Electronic Components, Other,
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel Adhesives
- Furukawa
- AI Technology, Inc.
- Nitto
- Hitachi Chemical
- LINTEC Corporation
- THAI HIBEX
Highlights of The Dicing Die Attach Film Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Conductive Type
- Non-Conductive Type
- By Application:
- Semiconductors
- Electronic Components
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Dicing Die Attach Film Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Dicing die attach film is a type of adhesive film that is used to adhere two pieces of die cut material together. It can be used in a variety of applications, such as manufacturing and packaging.
Some of the major companies in the dicing die attach film market are Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX.
The dicing die attach film market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Dicing Die Attach Film Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Dicing Die Attach Film Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Dicing Die Attach Film Market - Supply Chain
4.5. Global Dicing Die Attach Film Market Forecast
4.5.1. Dicing Die Attach Film Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Dicing Die Attach Film Market Size (000 Units) and Y-o-Y Growth
4.5.3. Dicing Die Attach Film Market Absolute $ Opportunity
5. Global Dicing Die Attach Film Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Dicing Die Attach Film Market Size and Volume Forecast by Type
5.3.1. Conductive Type
5.3.2. Non-Conductive Type
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Dicing Die Attach Film Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Dicing Die Attach Film Market Size and Volume Forecast by Application
6.3.1. Semiconductors
6.3.2. Electronic Components
6.3.3. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Dicing Die Attach Film Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Dicing Die Attach Film Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Dicing Die Attach Film Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Dicing Die Attach Film Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Dicing Die Attach Film Demand Share Forecast, 2019-2026
9. North America Dicing Die Attach Film Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Dicing Die Attach Film Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Dicing Die Attach Film Market Size and Volume Forecast by Application
9.4.1. Semiconductors
9.4.2. Electronic Components
9.4.3. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Dicing Die Attach Film Market Size and Volume Forecast by Type
9.7.1. Conductive Type
9.7.2. Non-Conductive Type
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Dicing Die Attach Film Demand Share Forecast, 2019-2026
10. Latin America Dicing Die Attach Film Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Application
10.4.1. Semiconductors
10.4.2. Electronic Components
10.4.3. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Type
10.7.1. Conductive Type
10.7.2. Non-Conductive Type
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Dicing Die Attach Film Demand Share Forecast, 2019-2026
11. Europe Dicing Die Attach Film Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Dicing Die Attach Film Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Dicing Die Attach Film Market Size and Volume Forecast by Application
11.4.1. Semiconductors
11.4.2. Electronic Components
11.4.3. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Dicing Die Attach Film Market Size and Volume Forecast by Type
11.7.1. Conductive Type
11.7.2. Non-Conductive Type
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Dicing Die Attach Film Demand Share, 2019-2026
12. Asia Pacific Dicing Die Attach Film Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Application
12.4.1. Semiconductors
12.4.2. Electronic Components
12.4.3. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Type
12.7.1. Conductive Type
12.7.2. Non-Conductive Type
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Dicing Die Attach Film Demand Share, 2019-2026
13. Middle East & Africa Dicing Die Attach Film Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Application
13.4.1. Semiconductors
13.4.2. Electronic Components
13.4.3. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Type
13.7.1. Conductive Type
13.7.2. Non-Conductive Type
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Dicing Die Attach Film Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Dicing Die Attach Film Market: Market Share Analysis
14.2. Dicing Die Attach Film Distributors and Customers
14.3. Dicing Die Attach Film Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Henkel Adhesives
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Furukawa
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. AI Technology, Inc.
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Nitto
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Hitachi Chemical
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. LINTEC Corporation
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. THAI HIBEX
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
