Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Dicing Die Attach Film Market by Type (Conductive Type, Non-Conductive Type, ), By Application (Semiconductors, Electronic Components, Other, ) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Dicing Die Attach Film Market by Type (Conductive Type, Non-Conductive Type, ), By Application (Semiconductors, Electronic Components, Other, ) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 144684 3300 Chemical & Material 377 230 Pages 4.8 (41)
                                          

The global dicing die attach film market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market is driven by the increasing demand for semiconductors and electronic components in various industries such as automotive, aerospace & defense, and consumer electronics. The demand for these products is expected to increase due to their use in various applications such as smartphones, tablets, laptops, and televisions among others. The conductive type segment accounted for the largest share of the global dicing die attach film market in 2018 owing to its high demand from semiconductor manufacturers across different regions such as North America and Asia Pacific. This segment is also projected to grow at a higher CAGR during the forecast period due to its high usage in manufacturing electronic components which are used in various industries such as automotive, aerospace & defense among others.

  1. The demand for dice is increasing due to the increase in the number of board games and card games.
  2. The demand for dice is also increasing due to the increase in the number of people who are interested in playing these games.
  3. The demand for dice is also increasing due to the increase in popularity of gambling, which requires a die as one of its components.
  4. The demand for dice is also increasing due to an increased interest among children and adults alike on learning how to play these games, which requires a die as one of its components.
  5. Dice are used by many people as a form of divination.

Industry Growth Insights published a new data on “Dicing Die Attach Film Market”. The research report is titled “Dicing Die Attach Film Market research by Types (Conductive Type, Non-Conductive Type, ), By Applications (Semiconductors, Electronic Components, Other, ), By Players/Companies Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX”.

Scope Of The Report

Report Attributes

Report Details

Report Title

Dicing Die Attach Film Market Research Report

By Type

Conductive Type, Non-Conductive Type,

By Application

Semiconductors, Electronic Components, Other,

By Companies

Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

230

Number of Tables & Figures

161

Customization Available

Yes, the report can be customized as per your need.


Global Dicing Die Attach Film Industry Outlook


Global Dicing Die Attach Film Market Report Segments:

The global Dicing Die Attach Film market is segmented on the basis of:

Types

Conductive Type, Non-Conductive Type,

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Semiconductors, Electronic Components, Other,

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Henkel Adhesives
  2. Furukawa
  3. AI Technology, Inc.
  4. Nitto
  5. Hitachi Chemical
  6. LINTEC Corporation
  7. THAI HIBEX

Global Dicing Die Attach Film Market Overview


Highlights of The Dicing Die Attach Film Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Conductive Type
    2. Non-Conductive Type
  1. By Application:

    1. Semiconductors
    2. Electronic Components
    3. Other
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Dicing Die Attach Film Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

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Global Dicing Die Attach Film Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Dicing die attach film is a type of adhesive film that is used to adhere two pieces of die cut material together. It can be used in a variety of applications, such as manufacturing and packaging.

Some of the major companies in the dicing die attach film market are Henkel Adhesives, Furukawa, AI Technology, Inc., Nitto, Hitachi Chemical, LINTEC Corporation, THAI HIBEX.

                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Dicing Die Attach Film Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Dicing Die Attach Film Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Dicing Die Attach Film Market - Supply Chain
   4.5. Global Dicing Die Attach Film Market Forecast
      4.5.1. Dicing Die Attach Film Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Dicing Die Attach Film Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Dicing Die Attach Film Market Absolute $ Opportunity

5. Global Dicing Die Attach Film Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Dicing Die Attach Film Market Size and Volume Forecast by Type
      5.3.1. Conductive Type
      5.3.2. Non-Conductive Type
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Dicing Die Attach Film Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Dicing Die Attach Film Market Size and Volume Forecast by Application
      6.3.1. Semiconductors
      6.3.2. Electronic Components
      6.3.3. Other
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Dicing Die Attach Film Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Dicing Die Attach Film Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Dicing Die Attach Film Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Dicing Die Attach Film Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Dicing Die Attach Film Demand Share Forecast, 2019-2026

9. North America Dicing Die Attach Film Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Dicing Die Attach Film Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Dicing Die Attach Film Market Size and Volume Forecast by Application
      9.4.1. Semiconductors
      9.4.2. Electronic Components
      9.4.3. Other
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Dicing Die Attach Film Market Size and Volume Forecast by Type
      9.7.1. Conductive Type
      9.7.2. Non-Conductive Type
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Dicing Die Attach Film Demand Share Forecast, 2019-2026

10. Latin America Dicing Die Attach Film Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Application
      10.4.1. Semiconductors
      10.4.2. Electronic Components
      10.4.3. Other
    10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Dicing Die Attach Film Market Size and Volume Forecast by Type
      10.7.1. Conductive Type
      10.7.2. Non-Conductive Type
    10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Dicing Die Attach Film Demand Share Forecast, 2019-2026

11. Europe Dicing Die Attach Film Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Dicing Die Attach Film Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Dicing Die Attach Film Market Size and Volume Forecast by Application
      11.4.1. Semiconductors
      11.4.2. Electronic Components
      11.4.3. Other
    11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Dicing Die Attach Film Market Size and Volume Forecast by Type
      11.7.1. Conductive Type
      11.7.2. Non-Conductive Type
    11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Dicing Die Attach Film Demand Share, 2019-2026

12. Asia Pacific Dicing Die Attach Film Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Application
      12.4.1. Semiconductors
      12.4.2. Electronic Components
      12.4.3. Other
    12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Dicing Die Attach Film Market Size and Volume Forecast by Type
      12.7.1. Conductive Type
      12.7.2. Non-Conductive Type
    12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Dicing Die Attach Film Demand Share, 2019-2026

13. Middle East & Africa Dicing Die Attach Film Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Application
      13.4.1. Semiconductors
      13.4.2. Electronic Components
      13.4.3. Other
    13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Dicing Die Attach Film Market Size and Volume Forecast by Type
      13.7.1. Conductive Type
      13.7.2. Non-Conductive Type
    13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Dicing Die Attach Film Demand Share, 2019-2026

14. Competition Landscape
   14.1. Global Dicing Die Attach Film Market: Market Share Analysis
   14.2. Dicing Die Attach Film Distributors and Customers
   14.3. Dicing Die Attach Film Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. Henkel Adhesives
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. Furukawa
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. AI Technology, Inc.
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Nitto
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. Hitachi Chemical
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. LINTEC Corporation
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. THAI HIBEX
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. COMPANY8
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. COMPANY9
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. COMPANY 10
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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