Market Overview:
The global die bonding equipment market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The market growth is attributed to the increasing demand for semiconductor devices and miniaturization of electronic devices. Die bonding equipment are used in the assembly and packaging of semiconductor devices, which helps in improving the performance and reliability of these devices. The global die bonding equipment market can be segmented on the basis of type, application, and region. On the basis of type, the market can be divided into fully automatic, semi-automatic, and manual die bonding equipment. Fully automatic die bonding equipments are more popular among end users as they offer high throughputs with low defect rates.
Product Definition:
Die bonding equipment is used to join two or more semiconductor devices together. The importance of die bonding equipment is that it allows manufacturers to create more complex and powerful semiconductor devices.
Fully Automatic:
Fully automatic machines are used to bond and seal the semiconductor chips in electronic devices. Fully automatic machines have gained significant importance in the manufacturing of integrated circuits (IC) owing to their ability to perform high volume production with improved efficiency. The fully automatic machine is also known as a robotic device that performs tasks without human intervention; it can be programmed using a computer software or can be operated by an operator via remote control.
Semi-Automatic:
Semi-automatic die bonding equipment is used for the production of high quality semiconductor components. It includes automatic feeding, positioning, and pressing systems that help in bonding various types of substrates such as silicon wafers to glass or metal surfaces.
The major advantage offered by semi-automatic die bonding equipment is that it can bond a large number of wafers at one time which reduces the time required to complete the process significantly.
Application Insights:
The demand for semiconductors is growing at a rapid pace owing to the increasing adoption of electronic devices in various industries. The global die bonding equipment market by application is segmented into integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT), and others. IDM held the largest market share in 2017, which can be attributed to their extensive use in packaging applications such as mobile phones, laptops, etc. Die bonders are used for final testing of packaged products before they are sent out for sale or distribution.
Outsourced Semiconductor Assemblies & Test (OSAT) segment is expected to grow at a significant rate over the forecast period due to rising demand from end-use industries such as consumer electronics, telecommunication equipment manufacturing and medical equipment assembling & testing companies that engage specialized OSAT services offer customized solutions according to specific requirements of each customer thereby driving the growth of this segment during future years of study period.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductor devices, particularly in China and India. In addition, rising investments by various governments are anticipated to drive the regional market further. For instance, according to a 2015 study by Global Semiconductor Trade Statistics (GSTS), China accounted for a share of more than 30% of global semiconductor production capacity with an investment worth USD X billion over 10 years while India accounted for USD X billion investment with 20% capacity share within 8 years from 2014-2019 i nitiative ‘Make in India’ implemented by Indian government which is aimed at promoting domestic manufacturing capabilities through public-private partnerships).
The Asia Pacific region was followed by Europe that accounted for 28.1% revenue share in 2017 on account of high product demand from automotive industry especially Germany.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of LED lighting
- Proliferation of 3D printing technology
- Increasing demand for semiconductor devices
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Bonding Equipment Market Research Report
By Type
Fully Automatic, Semi-Automatic, Manual
By Application
Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
By Companies
Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond, Hybond
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Die Bonding Equipment Market Report Segments:
The global Die Bonding Equipment market is segmented on the basis of:
Types
Fully Automatic, Semi-Automatic, Manual
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Besi
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies
- Shinkawa
- DIAS Automation
- Toray Engineering
- Panasonic
- FASFORD TECHNOLOGY
- West-Bond
- Hybond
Highlights of The Die Bonding Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi-Automatic
- Manual
- By Application:
- Integrated Device Manufacturers (IDMs)
- Outsourced Semiconductor Assembly and Test (OSAT)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Bonding Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die bonding equipment is a machine that uses heat and pressure to bond two or more pieces of metal together. This process creates a strong, durable connection between the metals that can resist wear and tear. Die bonding is often used in manufacturing to create parts that are resistant to corrosion and other forms of damage.
Some of the major players in the die bonding equipment market are Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond, Hybond.
The die bonding equipment market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Die Bonding Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Die Bonding Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Die Bonding Equipment Market - Supply Chain
4.5. Global Die Bonding Equipment Market Forecast
4.5.1. Die Bonding Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Die Bonding Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Die Bonding Equipment Market Absolute $ Opportunity
5. Global Die Bonding Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Die Bonding Equipment Market Size and Volume Forecast by Type
5.3.1. Fully Automatic
5.3.2. Semi-Automatic
5.3.3. Manual
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Die Bonding Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Die Bonding Equipment Market Size and Volume Forecast by Application
6.3.1. Integrated Device Manufacturers (IDMs)
6.3.2. Outsourced Semiconductor Assembly and Test (OSAT)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Die Bonding Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Die Bonding Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Die Bonding Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Die Bonding Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Die Bonding Equipment Demand Share Forecast, 2019-2026
9. North America Die Bonding Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Die Bonding Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Die Bonding Equipment Market Size and Volume Forecast by Application
9.4.1. Integrated Device Manufacturers (IDMs)
9.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Die Bonding Equipment Market Size and Volume Forecast by Type
9.7.1. Fully Automatic
9.7.2. Semi-Automatic
9.7.3. Manual
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Die Bonding Equipment Demand Share Forecast, 2019-2026
10. Latin America Die Bonding Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Die Bonding Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Die Bonding Equipment Market Size and Volume Forecast by Application
10.4.1. Integrated Device Manufacturers (IDMs)
10.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Die Bonding Equipment Market Size and Volume Forecast by Type
10.7.1. Fully Automatic
10.7.2. Semi-Automatic
10.7.3. Manual
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Die Bonding Equipment Demand Share Forecast, 2019-2026
11. Europe Die Bonding Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Die Bonding Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Die Bonding Equipment Market Size and Volume Forecast by Application
11.4.1. Integrated Device Manufacturers (IDMs)
11.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Die Bonding Equipment Market Size and Volume Forecast by Type
11.7.1. Fully Automatic
11.7.2. Semi-Automatic
11.7.3. Manual
11.8. Basis Point Share (BPS) Analysis by Tpe
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Die Bonding Equipment Demand Share, 2019-2026
12. Asia Pacific Die Bonding Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Die Bonding Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Die Bonding Equipment Market Size and Volume Forecast by Application
12.4.1. Integrated Device Manufacturers (IDMs)
12.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Die Bonding Equipment Market Size and Volume Forecast by Type
12.7.1. Fully Automatic
12.7.2. Semi-Automatic
12.7.3. Manual
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Die Bonding Equipment Demand Share, 2019-2026
13. Middle East & Africa Die Bonding Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Die Bonding Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Die Bonding Equipment Market Size and Volume Forecast by Application
13.4.1. Integrated Device Manufacturers (IDMs)
13.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Die Bonding Equipment Market Size and Volume Forecast by Type
13.7.1. Fully Automatic
13.7.2. Semi-Automatic
13.7.3. Manual
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Die Bonding Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Die Bonding Equipment Market: Market Share Analysis
14.2. Die Bonding Equipment Distributors and Customers
14.3. Die Bonding Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Besi
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASM Pacific Technology (ASMPT)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Kulicke & Soffa
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Palomar Technologies
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Shinkawa
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. DIAS Automation
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Toray Engineering
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Panasonic
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. FASFORD TECHNOLOGY
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. West-Bond
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Hybond
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
