The global beam wafer inspection systems market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for semiconductor devices in various industries such as communication devices, consumer electronic equipment, automotive products and industrial applications. The demand for semiconductor devices has increased due to their use in various industries such as communication devices, consumer electronic equipment, automotive products and industrial applications.
The global beam wafer inspection systems market by type is segmented into resolving power 1nm, resolving power 10nm and resolving power 50nm. Resolving power 1nm accounted for the largest share of the global beam wafer inspection systems market in 2017 owing to its high resolution capability which enables it to detect defects on a very small scale. Resolving power 10nm accounted for the second-largest share of this market owing to its high resolution capability which enables it to detect defects on a medium scale while resolving power 50nm accounted for the third-largest share owing its low cost per unit area and ability to detect defects on large scales with low resolutions.
Some Of The Growth Factors Of This Market:
- Increasing demand for semiconductor devices in the automotive industry is driving the growth of the E-Beam Wafer Inspection Systems market.
- The increasing demand for high performance and low power consumption devices is also driving the growth of this market.
- Increasing adoption of 3D integrated circuits in various industries such as aerospace, defense, and medical are also driving the growth of this market.
- Growing need for high throughput inspection systems with higher resolution.
Industry Growth Insights published a new data on “E-Beam Wafer Inspection Systems Market”. The research report is titled “E-Beam Wafer Inspection Systems Market research by Types (Resolving Power 1nm, Resolving Power 10nm, Resolving Power 50nm, Other), By Applications (Communication Devices, Consumer Electronic Equipment, Automotive Products, Industrial, Other), By Players/Companies Applied Materials, ASML Holding, KLA-Tencor, Lam Research, Hermes Microvision Inc, Hitachi High-Technologies, Integrated Device Technology, STMicroelectronics, GlobalFoundries, Semiconductor Manufacturing International, Taiwan Semiconductor Manufacturing, NXP Semiconductors N.V., Renesas Electronics”.
Scope Of The Report
Report Attributes
Report Details
Report Title
E-Beam Wafer Inspection Systems Market Research Report
By Type
Resolving Power 1nm, Resolving Power 10nm, Resolving Power 50nm, Other
By Application
Communication Devices, Consumer Electronic Equipment, Automotive Products, Industrial, Other
By Companies
Applied Materials, ASML Holding, KLA-Tencor, Lam Research, Hermes Microvision Inc, Hitachi High-Technologies, Integrated Device Technology, STMicroelectronics, GlobalFoundries, Semiconductor Manufacturing International, Taiwan Semiconductor Manufacturing, NXP Semiconductors N.V., Renesas Electronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
244
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global E-Beam Wafer Inspection Systems Market Report Segments:
The global E-Beam Wafer Inspection Systems market is segmented on the basis of:
Types
Resolving Power 1nm, Resolving Power 10nm, Resolving Power 50nm, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication Devices, Consumer Electronic Equipment, Automotive Products, Industrial, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Applied Materials
- ASML Holding
- KLA-Tencor
- Lam Research
- Hermes Microvision Inc
- Hitachi High-Technologies
- Integrated Device Technology
- STMicroelectronics
- GlobalFoundries
- Semiconductor Manufacturing International
- Taiwan Semiconductor Manufacturing
- NXP Semiconductors N.V.
- Renesas Electronics
Highlights of The E-Beam Wafer Inspection Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Resolving Power 1nm
- Resolving Power 10nm
- Resolving Power 50nm
- Other
- By Application:
- Communication Devices
- Consumer Electronic Equipment
- Automotive Products
- Industrial
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the E-Beam Wafer Inspection Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
E-beam wafer inspection systems are used to inspect semiconductor wafers using a high-energy electron beam. The system uses a detector to image the surface of the wafer and determines if any defects or flaws exist.
Some of the major companies in the e-beam wafer inspection systems market are Applied Materials, ASML Holding, KLA-Tencor, Lam Research, Hermes Microvision Inc, Hitachi High-Technologies, Integrated Device Technology, STMicroelectronics, GlobalFoundries, Semiconductor Manufacturing International, Taiwan Semiconductor Manufacturing, NXP Semiconductors N.V., Renesas Electronics.
The e-beam wafer inspection systems market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. E-Beam Wafer Inspection Systems Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. E-Beam Wafer Inspection Systems Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. E-Beam Wafer Inspection Systems Market - Supply Chain
4.5. Global E-Beam Wafer Inspection Systems Market Forecast
4.5.1. E-Beam Wafer Inspection Systems Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. E-Beam Wafer Inspection Systems Market Size (000 Units) and Y-o-Y Growth
4.5.3. E-Beam Wafer Inspection Systems Market Absolute $ Opportunity
5. Global E-Beam Wafer Inspection Systems Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
5.3.1. Resolving Power 1nm
5.3.2. Resolving Power 10nm
5.3.3. Resolving Power 50nm
5.3.4. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global E-Beam Wafer Inspection Systems Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
6.3.1. Communication Devices
6.3.2. Consumer Electronic Equipment
6.3.3. Automotive Products
6.3.4. Industrial
6.3.5. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global E-Beam Wafer Inspection Systems Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global E-Beam Wafer Inspection Systems Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global E-Beam Wafer Inspection Systems Demand Share Forecast, 2019-2026
9. North America E-Beam Wafer Inspection Systems Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
9.4.1. Communication Devices
9.4.2. Consumer Electronic Equipment
9.4.3. Automotive Products
9.4.4. Industrial
9.4.5. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
9.7.1. Resolving Power 1nm
9.7.2. Resolving Power 10nm
9.7.3. Resolving Power 50nm
9.7.4. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America E-Beam Wafer Inspection Systems Demand Share Forecast, 2019-2026
10. Latin America E-Beam Wafer Inspection Systems Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
10.4.1. Communication Devices
10.4.2. Consumer Electronic Equipment
10.4.3. Automotive Products
10.4.4. Industrial
10.4.5. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
10.7.1. Resolving Power 1nm
10.7.2. Resolving Power 10nm
10.7.3. Resolving Power 50nm
10.7.4. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America E-Beam Wafer Inspection Systems Demand Share Forecast, 2019-2026
11. Europe E-Beam Wafer Inspection Systems Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
11.4.1. Communication Devices
11.4.2. Consumer Electronic Equipment
11.4.3. Automotive Products
11.4.4. Industrial
11.4.5. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
11.7.1. Resolving Power 1nm
11.7.2. Resolving Power 10nm
11.7.3. Resolving Power 50nm
11.7.4. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe E-Beam Wafer Inspection Systems Demand Share, 2019-2026
12. Asia Pacific E-Beam Wafer Inspection Systems Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
12.4.1. Communication Devices
12.4.2. Consumer Electronic Equipment
12.4.3. Automotive Products
12.4.4. Industrial
12.4.5. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
12.7.1. Resolving Power 1nm
12.7.2. Resolving Power 10nm
12.7.3. Resolving Power 50nm
12.7.4. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific E-Beam Wafer Inspection Systems Demand Share, 2019-2026
13. Middle East & Africa E-Beam Wafer Inspection Systems Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Application
13.4.1. Communication Devices
13.4.2. Consumer Electronic Equipment
13.4.3. Automotive Products
13.4.4. Industrial
13.4.5. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa E-Beam Wafer Inspection Systems Market Size and Volume Forecast by Type
13.7.1. Resolving Power 1nm
13.7.2. Resolving Power 10nm
13.7.3. Resolving Power 50nm
13.7.4. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa E-Beam Wafer Inspection Systems Demand Share, 2019-2026
14. Competition Landscape
14.1. Global E-Beam Wafer Inspection Systems Market: Market Share Analysis
14.2. E-Beam Wafer Inspection Systems Distributors and Customers
14.3. E-Beam Wafer Inspection Systems Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Applied Materials
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASML Holding
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. KLA-Tencor
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Lam Research
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Hermes Microvision Inc
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hitachi High-Technologies
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Integrated Device Technology
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. STMicroelectronics
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. GlobalFoundries
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Semiconductor Manufacturing International
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Taiwan Semiconductor Manufacturing
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. NXP Semiconductors N.V.
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Renesas Electronics
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
