Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global E-Chuck for Wafer Market by Type (Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer), By Application (300 mm Wafer, 200 mm Wafer, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global E-Chuck for Wafer Market by Type (Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer), By Application (300 mm Wafer, 200 mm Wafer, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 129893 3300 Electronics & Semiconductor 377 249 Pages 4.9 (42)
                                          

Market Overview:


The global e-chuck market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The coulomb type e-chuck for wafer segment is expected to hold the largest share of the market in 2018, while the johnsen-rahbek (JR) type e-chuck for wafer segment is projected to grow at the highest CAGR during the forecast period. The 300 mm wafer application segment is estimated to account for a larger share of the global market in 2018, while 200 mm wafer application segment is projected to grow at a higher rate during the forecast period.


Global E-Chuck for Wafer Industry Outlook


Product Definition:


E-Chuck is an electronic chuck which is used to grip a wafer. It helps in transferring the wafer from one process tool to another without any damage to the wafer.


Coulomb Type E-Chuck for Wafer:


Coulomb type e-chuck for wafer market is expected to grow at a significant rate owing to the increasing demand for high volume and quality semiconductor devices. The growth of the industry can be attributed to factors such as growing adoption of SiGe technology in both, large and small scale integrated circuits manufacturing markets. SiGe technology provides several benefits over conventional processes such as low power consumption, cost effectiveness, better performance & scalability among others.


Johnsen-Rahbek (JR) Type E-Chuck for Wafer:


The Johnsen-Rahbek (JR) type E-Chuck for Wafer is used in the fabrication of integrated circuits (IC), also known as chip making. It’s a specialized machine used to make sure that wafers stay in place during the deposition process, which comprises of several steps such as cleaning, masking, and etching.


Application Insights:


300 mm wafer application dominated the global e-chuck market in terms of revenue share in 2017. 300 mm wafers are used for various purposes such as testing and packaging. Testing and packaging is one of the major applications that drives the demand for 300mm e-chucks across different regions. The others segment includes 200mm, 175/200 mm, 150/175 mm, 140/150 mm & 130/175 nm e-wafers which are used for various applications such as CCDs ( Charge Coupled Devices), LCoS (Large-Scale Integration), TCOF (Thin Film Optoelectronic Devices) and OPDs (Optical Packaging Devices). These smaller size devices require less volume compared to their larger counterparts thereby reducing material requirement resulting in cost reduction during production process.


Regional Analysis:


Asia Pacific dominated the global e-chuck market in terms of revenue with a share of over 40.0% in 2017. This is attributed to increasing investments by key players for manufacturing 300 mm wafers at 200mm and 150 mm wafer processes using e-chucks. Moreover, the region is expected to witness significant growth owing to rising demand from end users such as smartphone manufacturers, computer hardware manufacturers, etc., which will drive industry expansion over the forecast period.


The Asia Pacific region has witnessed an increase in 300mm equipment production and sales since 2014 due to growing demand from customers such as Foxconn Technology Group Co., Ltd (Foxconn), Wistron Corporation (Wistron), Quanta Computer Incorporated (Quanta Computer) among others who are manufacturing consumer electronics products on a large scale basis using advanced technologies including 3D printing technology supported by low cost labor force available in this region thereby driving regional growth over the forecast period.


Growth Factors:


  • Increased demand for semiconductor devices from the automotive, industrial and consumer electronics sectors.
  • Growing popularity of miniaturized and low-power devices that require advanced semiconductor technologies.
  • Proliferation of new applications that need higher performance or more specialized wafers, such as MEMS (micro-electro-mechanical systems), power ICs (integrated circuits) and LED lighting products.
  • Advances in manufacturing processes and technology that improve yields, reduce costs and enable the production of ever smaller wafers with greater complexity and functionality.

Scope Of The Report

Report Attributes

Report Details

Report Title

E-Chuck for Wafer Market Research Report

By Type

Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer

By Application

300 mm Wafer, 200 mm Wafer, Others

By Companies

SHINKO, TOTO, Creative Technology Corporation, Kyocera, FM Industries, NTK CERATEC, Tsukuba Seiko, Applied Materials, II-VI M Cubed

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

249

Number of Tables & Figures

175

Customization Available

Yes, the report can be customized as per your need.


Global E-Chuck for Wafer Market Report Segments:

The global E-Chuck for Wafer market is segmented on the basis of:

Types

Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

300 mm Wafer, 200 mm Wafer, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. SHINKO
  2. TOTO
  3. Creative Technology Corporation
  4. Kyocera
  5. FM Industries
  6. NTK CERATEC
  7. Tsukuba Seiko
  8. Applied Materials
  9. II-VI M Cubed

Global E-Chuck for Wafer Market Overview


Highlights of The E-Chuck for Wafer Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Coulomb Type E-Chuck for Wafer
    2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
  1. By Application:

    1. 300 mm Wafer
    2. 200 mm Wafer
    3. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the E-Chuck for Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global E-Chuck for Wafer Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available
                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. E-Chuck for Wafer Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. E-Chuck for Wafer Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. E-Chuck for Wafer Market - Supply Chain
   4.5. Global E-Chuck for Wafer Market Forecast
      4.5.1. E-Chuck for Wafer Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. E-Chuck for Wafer Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. E-Chuck for Wafer Market Absolute $ Opportunity

5. Global E-Chuck for Wafer Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. E-Chuck for Wafer Market Size and Volume Forecast by Type
      5.3.1. Coulomb Type E-Chuck for Wafer
      5.3.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global E-Chuck for Wafer Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. E-Chuck for Wafer Market Size and Volume Forecast by Application
      6.3.1. 300 mm Wafer
      6.3.2. 200 mm Wafer
      6.3.3. Others
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global E-Chuck for Wafer Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. E-Chuck for Wafer Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global E-Chuck for Wafer Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. E-Chuck for Wafer Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global E-Chuck for Wafer Demand Share Forecast, 2019-2029

9. North America E-Chuck for Wafer Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America E-Chuck for Wafer Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America E-Chuck for Wafer Market Size and Volume Forecast by Application
      9.4.1. 300 mm Wafer
      9.4.2. 200 mm Wafer
      9.4.3. Others
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America E-Chuck for Wafer Market Size and Volume Forecast by Type
      9.7.1. Coulomb Type E-Chuck for Wafer
      9.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America E-Chuck for Wafer Demand Share Forecast, 2019-2029

10. Latin America E-Chuck for Wafer Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Application
      10.4.1. 300 mm Wafer
      10.4.2. 200 mm Wafer
      10.4.3. Others
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Type
      10.7.1. Coulomb Type E-Chuck for Wafer
      10.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America E-Chuck for Wafer Demand Share Forecast, 2019-2029

11. Europe E-Chuck for Wafer Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe E-Chuck for Wafer Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe E-Chuck for Wafer Market Size and Volume Forecast by Application
      11.4.1. 300 mm Wafer
      11.4.2. 200 mm Wafer
      11.4.3. Others
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe E-Chuck for Wafer Market Size and Volume Forecast by Type
      11.7.1. Coulomb Type E-Chuck for Wafer
      11.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Typ
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe E-Chuck for Wafer Demand Share, 2019-2029

12. Asia Pacific E-Chuck for Wafer Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Application
      12.4.1. 300 mm Wafer
      12.4.2. 200 mm Wafer
      12.4.3. Others
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Type
      12.7.1. Coulomb Type E-Chuck for Wafer
      12.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific E-Chuck for Wafer Demand Share, 2019-2029

13. Middle East & Africa E-Chuck for Wafer Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Application
      13.4.1. 300 mm Wafer
      13.4.2. 200 mm Wafer
      13.4.3. Others
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Type
      13.7.1. Coulomb Type E-Chuck for Wafer
      13.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa E-Chuck for Wafer Demand Share, 2019-2029

14. Competition Landscape
   14.1. Global E-Chuck for Wafer Market: Market Share Analysis
   14.2. E-Chuck for Wafer Distributors and Customers
   14.3. E-Chuck for Wafer Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. SHINKO
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. TOTO
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. Creative Technology Corporation
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Kyocera
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. FM Industries
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. NTK CERATEC
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. Tsukuba Seiko
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Applied Materials
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. II-VI M Cubed
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. COMPANY 10
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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