Market Overview:
The global e-chuck market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The coulomb type e-chuck for wafer segment is expected to hold the largest share of the market in 2018, while the johnsen-rahbek (JR) type e-chuck for wafer segment is projected to grow at the highest CAGR during the forecast period. The 300 mm wafer application segment is estimated to account for a larger share of the global market in 2018, while 200 mm wafer application segment is projected to grow at a higher rate during the forecast period.
Product Definition:
E-Chuck is an electronic chuck which is used to grip a wafer. It helps in transferring the wafer from one process tool to another without any damage to the wafer.
Coulomb Type E-Chuck for Wafer:
Coulomb type e-chuck for wafer market is expected to grow at a significant rate owing to the increasing demand for high volume and quality semiconductor devices. The growth of the industry can be attributed to factors such as growing adoption of SiGe technology in both, large and small scale integrated circuits manufacturing markets. SiGe technology provides several benefits over conventional processes such as low power consumption, cost effectiveness, better performance & scalability among others.
Johnsen-Rahbek (JR) Type E-Chuck for Wafer:
The Johnsen-Rahbek (JR) type E-Chuck for Wafer is used in the fabrication of integrated circuits (IC), also known as chip making. It’s a specialized machine used to make sure that wafers stay in place during the deposition process, which comprises of several steps such as cleaning, masking, and etching.
Application Insights:
300 mm wafer application dominated the global e-chuck market in terms of revenue share in 2017. 300 mm wafers are used for various purposes such as testing and packaging. Testing and packaging is one of the major applications that drives the demand for 300mm e-chucks across different regions. The others segment includes 200mm, 175/200 mm, 150/175 mm, 140/150 mm & 130/175 nm e-wafers which are used for various applications such as CCDs ( Charge Coupled Devices), LCoS (Large-Scale Integration), TCOF (Thin Film Optoelectronic Devices) and OPDs (Optical Packaging Devices). These smaller size devices require less volume compared to their larger counterparts thereby reducing material requirement resulting in cost reduction during production process.
Regional Analysis:
Asia Pacific dominated the global e-chuck market in terms of revenue with a share of over 40.0% in 2017. This is attributed to increasing investments by key players for manufacturing 300 mm wafers at 200mm and 150 mm wafer processes using e-chucks. Moreover, the region is expected to witness significant growth owing to rising demand from end users such as smartphone manufacturers, computer hardware manufacturers, etc., which will drive industry expansion over the forecast period.
The Asia Pacific region has witnessed an increase in 300mm equipment production and sales since 2014 due to growing demand from customers such as Foxconn Technology Group Co., Ltd (Foxconn), Wistron Corporation (Wistron), Quanta Computer Incorporated (Quanta Computer) among others who are manufacturing consumer electronics products on a large scale basis using advanced technologies including 3D printing technology supported by low cost labor force available in this region thereby driving regional growth over the forecast period.
Growth Factors:
- Increased demand for semiconductor devices from the automotive, industrial and consumer electronics sectors.
- Growing popularity of miniaturized and low-power devices that require advanced semiconductor technologies.
- Proliferation of new applications that need higher performance or more specialized wafers, such as MEMS (micro-electro-mechanical systems), power ICs (integrated circuits) and LED lighting products.
- Advances in manufacturing processes and technology that improve yields, reduce costs and enable the production of ever smaller wafers with greater complexity and functionality.
Scope Of The Report
Report Attributes
Report Details
Report Title
E-Chuck for Wafer Market Research Report
By Type
Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer
By Application
300 mm Wafer, 200 mm Wafer, Others
By Companies
SHINKO, TOTO, Creative Technology Corporation, Kyocera, FM Industries, NTK CERATEC, Tsukuba Seiko, Applied Materials, II-VI M Cubed
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global E-Chuck for Wafer Market Report Segments:
The global E-Chuck for Wafer market is segmented on the basis of:
Types
Coulomb Type E-Chuck for Wafer, Johnsen-Rahbek (JR) Type E-Chuck for Wafer
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
300 mm Wafer, 200 mm Wafer, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SHINKO
- TOTO
- Creative Technology Corporation
- Kyocera
- FM Industries
- NTK CERATEC
- Tsukuba Seiko
- Applied Materials
- II-VI M Cubed
Highlights of The E-Chuck for Wafer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Coulomb Type E-Chuck for Wafer
- Johnsen-Rahbek (JR) Type E-Chuck for Wafer
- By Application:
- 300 mm Wafer
- 200 mm Wafer
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the E-Chuck for Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
E-Chuck is a program that allows users to manage their Wafer account and transactions.
Some of the major players in the e-chuck for wafer market are SHINKO, TOTO, Creative Technology Corporation, Kyocera, FM Industries, NTK CERATEC, Tsukuba Seiko, Applied Materials, II-VI M Cubed.
The e-chuck for wafer market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. E-Chuck for Wafer Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. E-Chuck for Wafer Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. E-Chuck for Wafer Market - Supply Chain
4.5. Global E-Chuck for Wafer Market Forecast
4.5.1. E-Chuck for Wafer Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. E-Chuck for Wafer Market Size (000 Units) and Y-o-Y Growth
4.5.3. E-Chuck for Wafer Market Absolute $ Opportunity
5. Global E-Chuck for Wafer Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. E-Chuck for Wafer Market Size and Volume Forecast by Type
5.3.1. Coulomb Type E-Chuck for Wafer
5.3.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global E-Chuck for Wafer Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. E-Chuck for Wafer Market Size and Volume Forecast by Application
6.3.1. 300 mm Wafer
6.3.2. 200 mm Wafer
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global E-Chuck for Wafer Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. E-Chuck for Wafer Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global E-Chuck for Wafer Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. E-Chuck for Wafer Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global E-Chuck for Wafer Demand Share Forecast, 2019-2029
9. North America E-Chuck for Wafer Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America E-Chuck for Wafer Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America E-Chuck for Wafer Market Size and Volume Forecast by Application
9.4.1. 300 mm Wafer
9.4.2. 200 mm Wafer
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America E-Chuck for Wafer Market Size and Volume Forecast by Type
9.7.1. Coulomb Type E-Chuck for Wafer
9.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America E-Chuck for Wafer Demand Share Forecast, 2019-2029
10. Latin America E-Chuck for Wafer Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Application
10.4.1. 300 mm Wafer
10.4.2. 200 mm Wafer
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America E-Chuck for Wafer Market Size and Volume Forecast by Type
10.7.1. Coulomb Type E-Chuck for Wafer
10.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America E-Chuck for Wafer Demand Share Forecast, 2019-2029
11. Europe E-Chuck for Wafer Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe E-Chuck for Wafer Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe E-Chuck for Wafer Market Size and Volume Forecast by Application
11.4.1. 300 mm Wafer
11.4.2. 200 mm Wafer
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe E-Chuck for Wafer Market Size and Volume Forecast by Type
11.7.1. Coulomb Type E-Chuck for Wafer
11.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Typ
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe E-Chuck for Wafer Demand Share, 2019-2029
12. Asia Pacific E-Chuck for Wafer Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Application
12.4.1. 300 mm Wafer
12.4.2. 200 mm Wafer
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific E-Chuck for Wafer Market Size and Volume Forecast by Type
12.7.1. Coulomb Type E-Chuck for Wafer
12.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific E-Chuck for Wafer Demand Share, 2019-2029
13. Middle East & Africa E-Chuck for Wafer Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Application
13.4.1. 300 mm Wafer
13.4.2. 200 mm Wafer
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa E-Chuck for Wafer Market Size and Volume Forecast by Type
13.7.1. Coulomb Type E-Chuck for Wafer
13.7.2. Johnsen-Rahbek (JR) Type E-Chuck for Wafer
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa E-Chuck for Wafer Demand Share, 2019-2029
14. Competition Landscape
14.1. Global E-Chuck for Wafer Market: Market Share Analysis
14.2. E-Chuck for Wafer Distributors and Customers
14.3. E-Chuck for Wafer Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. SHINKO
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. TOTO
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Creative Technology Corporation
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Kyocera
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. FM Industries
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. NTK CERATEC
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tsukuba Seiko
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Applied Materials
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. II-VI M Cubed
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
