Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Electro-Deposited (ED) Copper Foil Market by Type (HTE Copper Foil, STD Copper Foil, DSTF Copper Foil), By Application (Copper Clad Laminate, Printed Circuit Boards) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Electro-Deposited (ED) Copper Foil Market by Type (HTE Copper Foil, STD Copper Foil, DSTF Copper Foil), By Application (Copper Clad Laminate, Printed Circuit Boards) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 189122 3300 Chemical & Material 377 232 Pages 4.8 (34)
                                          

The global ElectrDeposited (ED) Copper Foil market is expected to grow at a CAGR of 3.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market can be attributed to the increasing demand for copper in various applications such as printed circuit boards and copper clad laminate, which are used in various industries such as automotive, aerospace and defense, consumer electronics and electrical & electronics. The HTE Copper Foil segment accounted for the largest share of the global ElectrDeposited (ED) Copper Foil market in 2017 owing to its high demand from end-use industries such as automotive, aerospace and defense, consumer electronics and electrical & electronics. Asia Pacific was estimated to account for the largest share of the global ElectrDeposited (ED) Copper Foil market in 2017 due to increased investments by companies operating in this region on research & development activities related with ED copper foil production technologies that have led them towards developing new products with improved properties over conventional products. Copper is used in various electronic devices such as smartphones, laptops and tablets due to its excellent electrical and thermal conductivity properties which are essential for these devices' performance and functionality.

Some Of The Growth Factors Of This Market:

  1. The increasing demand for copper in the automotive industry is also driving this market's growth as it has been found that copper can be used as an effective heat shield material which helps reduce vehicle weight and fuel consumption while improving safety features such as airbags and seat belts due to its excellent thermal conductivity properties which help dissipate heat away from passengers during accidents or collisions with other vehicles or objects on the roadways.
  2. Increasing use of renewable energy sources such as solar power will also drive this market's growth over the forecast period owing to their high efficiency levels when compared with traditional fossil fuels like coal or natural gas which are not only expensive but also contribute significantly towards greenhouse gas emissions that cause global warming effects on Earth's climate system leading to adverse environmental conditions like extreme weather events, droughts, floods etc, thereby affecting human life adversely.

Industry Growth Insights published a new data on “Electro-Deposited (ED) Copper Foil Market”. The research report is titled “Electro-Deposited (ED) Copper Foil Market research by Types (HTE Copper Foil, STD Copper Foil, DSTF Copper Foil), By Applications (Copper Clad Laminate, Printed Circuit Boards), By Players/Companies Circuit Foil, Rogers Corp., PFC Flexible Circuits, Goettle, Suzhou Fukuda Metal, Anhui Tonglguan Mechinery, Linbao WASON Copper Foil, Suiwa High Technology Electronic Industries”.

Scope Of The Report

Report Attributes

Report Details

Report Title

Electro-Deposited (ED) Copper Foil Market Research Report

By Type

HTE Copper Foil, STD Copper Foil, DSTF Copper Foil

By Application

Copper Clad Laminate, Printed Circuit Boards

By Companies

Circuit Foil, Rogers Corp., PFC Flexible Circuits, Goettle, Suzhou Fukuda Metal, Anhui Tonglguan Mechinery, Linbao WASON Copper Foil, Suiwa High Technology Electronic Industries

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

232

Number of Tables & Figures

163

Customization Available

Yes, the report can be customized as per your need.


Global Electro-Deposited (ED) Copper Foil Industry Outlook


Global Electro-Deposited (ED) Copper Foil Market Report Segments:

The global Electro-Deposited (ED) Copper Foil market is segmented on the basis of:

Types

HTE Copper Foil, STD Copper Foil, DSTF Copper Foil

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Copper Clad Laminate, Printed Circuit Boards

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Circuit Foil
  2. Rogers Corp.
  3. PFC Flexible Circuits
  4. Goettle
  5. Suzhou Fukuda Metal
  6. Anhui Tonglguan Mechinery
  7. Linbao WASON Copper Foil
  8. Suiwa High Technology Electronic Industries

Global Electro-Deposited (ED) Copper Foil Market Overview


Highlights of The Electro-Deposited (ED) Copper Foil Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. HTE Copper Foil
    2. STD Copper Foil
    3. DSTF Copper Foil
  1. By Application:

    1. Copper Clad Laminate
    2. Printed Circuit Boards
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Electro-Deposited (ED) Copper Foil Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Electro-Deposited (ED) Copper Foil Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


ED copper foil is a type of copper foil that has been electro-deposited. This means that the copper has been deposited on an electrode by an electric current.

Some of the major players in the electro-deposited (ed) copper foil market are Circuit Foil, Rogers Corp., PFC Flexible Circuits, Goettle, Suzhou Fukuda Metal, Anhui Tonglguan Mechinery, Linbao WASON Copper Foil, Suiwa High Technology Electronic Industries.

The electro-deposited (ed) copper foil market is expected to register a CAGR of 3.5%.

                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Electro-Deposited (ED) Copper Foil Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Electro-Deposited (ED) Copper Foil Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Electro-Deposited (ED) Copper Foil Market - Supply Chain
   4.5. Global Electro-Deposited (ED) Copper Foil Market Forecast
      4.5.1. Electro-Deposited (ED) Copper Foil Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Electro-Deposited (ED) Copper Foil Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Electro-Deposited (ED) Copper Foil Market Absolute $ Opportunity

5. Global Electro-Deposited (ED) Copper Foil Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      5.3.1. HTE Copper Foil
      5.3.2. STD Copper Foil
      5.3.3. DSTF Copper Foil
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Electro-Deposited (ED) Copper Foil Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      6.3.1. Copper Clad Laminate
      6.3.2. Printed Circuit Boards
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Electro-Deposited (ED) Copper Foil Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Electro-Deposited (ED) Copper Foil Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Electro-Deposited (ED) Copper Foil Demand Share Forecast, 2019-2026

9. North America Electro-Deposited (ED) Copper Foil Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      9.4.1. Copper Clad Laminate
      9.4.2. Printed Circuit Boards
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      9.7.1. HTE Copper Foil
      9.7.2. STD Copper Foil
      9.7.3. DSTF Copper Foil
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Electro-Deposited (ED) Copper Foil Demand Share Forecast, 2019-2026

10. Latin America Electro-Deposited (ED) Copper Foil Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      10.4.1. Copper Clad Laminate
      10.4.2. Printed Circuit Boards
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      10.7.1. HTE Copper Foil
      10.7.2. STD Copper Foil
      10.7.3. DSTF Copper Foil
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Electro-Deposited (ED) Copper Foil Demand Share Forecast, 2019-2026

11. Europe Electro-Deposited (ED) Copper Foil Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      11.4.1. Copper Clad Laminate
      11.4.2. Printed Circuit Boards
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      11.7.1. HTE Copper Foil
      11.7.2. STD Copper Foil
      11.7.3. DSTF Copper Fil
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Electro-Deposited (ED) Copper Foil Demand Share, 2019-2026

12. Asia Pacific Electro-Deposited (ED) Copper Foil Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      12.4.1. Copper Clad Laminate
      12.4.2. Printed Circuit Boards
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      12.7.1. HTE Copper Foil
      12.7.2. STD Copper Foil
      12.7.3. DSTF Copper Foil
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Electro-Deposited (ED) Copper Foil Demand Share, 2019-2026

13. Middle East & Africa Electro-Deposited (ED) Copper Foil Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Application
      13.4.1. Copper Clad Laminate
      13.4.2. Printed Circuit Boards
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Electro-Deposited (ED) Copper Foil Market Size and Volume Forecast by Type
      13.7.1. HTE Copper Foil
      13.7.2. STD Copper Foil
      13.7.3. DSTF Copper Foil
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Electro-Deposited (ED) Copper Foil Demand Share, 2019-2026

14. Competition Landscape
   14.1. Global Electro-Deposited (ED) Copper Foil Market: Market Share Analysis
   14.2. Electro-Deposited (ED) Copper Foil Distributors and Customers
   14.3. Electro-Deposited (ED) Copper Foil Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. Circuit Foil
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. Rogers Corp.
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. PFC Flexible Circuits
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Goettle
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. Suzhou Fukuda Metal
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. Anhui Tonglguan Mechinery
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. Linbao WASON Copper Foil
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Suiwa High Technology Electronic Industries
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. COMPANY9
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. COMPANY 10
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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