The global electronic packaging materials market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 8.2 billion by 2030. The growth of this market is driven by the increasing demand for electronic products and the need for better quality packaging materials in order to meet stringent regulatory requirements.
Metal packages are expected to be the fastest-growing type of package material, with a CAGR of 5.8% from 2021-2030, followed by plastic packages (4%), ceramic packages (3%), and PCBs (1%). The fastest-growing application segment will be semiconductor & ICs, with a CAGR of 5%, followed by PCBs (4%) and other applications such as automotive electronics and medical devices (3%).
- The increasing demand for electronic devices is driving the growth of the Electronic Packaging Materials market.
- The increasing use of electronic devices in developing countries is also driving the growth of the Electronic Packaging Materials market.
- The growing need for lightweight and durable packaging materials to protect electronics from damage during transportation is also driving the growth of the Electronic Packaging Materials market.
- The rising demand for sustainable packaging materials to reduce environmental impact is also driving the growth of this market, as these materials are more environmentally friendly than traditional plastics and metals used in packaging electronics products such as smartphones, laptops, tablets, etc, which are made from non-renewable resources that take a long time to decompose or recycle into new products; hence they have a negative impact on environment by adding to landfills and polluting water bodies with toxic chemicals released during manufacturing process such as heavy metals like lead and mercury which can cause serious health problems if consumed by humans or animals over long periods of time.
- Increasing awareness about environmental issues among consumers has led them to prefer sustainable packaging materials over traditional plastics and metals used in packaging electronics products.
Industry Growth Insights published a new data on “Electronic Packaging Materials Market”. The research report is titled “Electronic Packaging Materials Market research by Types (Metal Packages, Plastic Packages, Ceramic Packages), By Applications (Semiconductor & IC, PCB, Others), By Players/Companies DowDuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Packaging Materials Market Research Report
By Type
Metal Packages, Plastic Packages, Ceramic Packages
By Application
Semiconductor & IC, PCB, Others
By Companies
DowDuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
242
Number of Tables & Figures
170
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Packaging Materials Market Report Segments:
The global Electronic Packaging Materials market is segmented on the basis of:
Types
Metal Packages, Plastic Packages, Ceramic Packages
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor & IC, PCB, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DowDuPont
- Evonik
- EPM
- Mitsubishi Chemical
- Sumitomo Chemical
- Mitsui High-tec
- Tanaka
- Shinko Electric Industries
- Panasonic
- Hitachi Chemical
- Kyocera Chemical
- Gore
- BASF
- Henkel
- AMETEK Electronic
- Toray
- Maruwa
- Leatec Fine Ceramics
- NCI
- Chaozhou Three-Circle
- Nippon Micrometal
- Toppan
- Dai Nippon Printing
- Possehl
- Ningbo Kangqiang
Highlights of The Electronic Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Metal Packages
- Plastic Packages
- Ceramic Packages
- By Application:
- Semiconductor & IC
- PCB
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic packaging materials are materials that are used to package electronic products. These materials can be used to protect the product, identify it, and provide information about it.
Some of the major companies in the electronic packaging materials market are DowDuPont, Evonik, EPM, Mitsubishi Chemical, Sumitomo Chemical, Mitsui High-tec, Tanaka, Shinko Electric Industries, Panasonic, Hitachi Chemical, Kyocera Chemical, Gore, BASF, Henkel, AMETEK Electronic, Toray, Maruwa, Leatec Fine Ceramics, NCI, Chaozhou Three-Circle, Nippon Micrometal, Toppan, Dai Nippon Printing, Possehl, Ningbo Kangqiang.
The electronic packaging materials market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Electronic Packaging Materials Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Electronic Packaging Materials Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Electronic Packaging Materials Market - Supply Chain
4.5. Global Electronic Packaging Materials Market Forecast
4.5.1. Electronic Packaging Materials Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Electronic Packaging Materials Market Size (000 Units) and Y-o-Y Growth
4.5.3. Electronic Packaging Materials Market Absolute $ Opportunity
5. Global Electronic Packaging Materials Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Electronic Packaging Materials Market Size and Volume Forecast by Type
5.3.1. Metal Packages
5.3.2. Plastic Packages
5.3.3. Ceramic Packages
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Electronic Packaging Materials Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Electronic Packaging Materials Market Size and Volume Forecast by Application
6.3.1. Semiconductor & IC
6.3.2. PCB
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Electronic Packaging Materials Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Electronic Packaging Materials Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Electronic Packaging Materials Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Electronic Packaging Materials Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Electronic Packaging Materials Demand Share Forecast, 2019-2026
9. North America Electronic Packaging Materials Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Electronic Packaging Materials Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Electronic Packaging Materials Market Size and Volume Forecast by Application
9.4.1. Semiconductor & IC
9.4.2. PCB
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Electronic Packaging Materials Market Size and Volume Forecast by Type
9.7.1. Metal Packages
9.7.2. Plastic Packages
9.7.3. Ceramic Packages
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Electronic Packaging Materials Demand Share Forecast, 2019-2026
10. Latin America Electronic Packaging Materials Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Electronic Packaging Materials Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Electronic Packaging Materials Market Size and Volume Forecast by Application
10.4.1. Semiconductor & IC
10.4.2. PCB
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Electronic Packaging Materials Market Size and Volume Forecast by Type
10.7.1. Metal Packages
10.7.2. Plastic Packages
10.7.3. Ceramic Packages
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Electronic Packaging Materials Demand Share Forecast, 2019-2026
11. Europe Electronic Packaging Materials Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Electronic Packaging Materials Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Electronic Packaging Materials Market Size and Volume Forecast by Application
11.4.1. Semiconductor & IC
11.4.2. PCB
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Electronic Packaging Materials Market Size and Volume Forecast by Type
11.7.1. Metal Packages
11.7.2. Plastic Packages
11.7.3. Ceramic Packages
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Electronic Packaging Materials Demand Share, 2019-2026
12. Asia Pacific Electronic Packaging Materials Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Electronic Packaging Materials Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Electronic Packaging Materials Market Size and Volume Forecast by Application
12.4.1. Semiconductor & IC
12.4.2. PCB
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Electronic Packaging Materials Market Size and Volume Forecast by Type
12.7.1. Metal Packages
12.7.2. Plastic Packages
12.7.3. Ceramic Packages
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Electronic Packaging Materials Demand Share, 2019-2026
13. Middle East & Africa Electronic Packaging Materials Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Electronic Packaging Materials Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Electronic Packaging Materials Market Size and Volume Forecast by Application
13.4.1. Semiconductor & IC
13.4.2. PCB
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Electronic Packaging Materials Market Size and Volume Forecast by Type
13.7.1. Metal Packages
13.7.2. Plastic Packages
13.7.3. Ceramic Packages
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Electronic Packaging Materials Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Electronic Packaging Materials Market: Market Share Analysis
14.2. Electronic Packaging Materials Distributors and Customers
14.3. Electronic Packaging Materials Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. DowDuPont
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Evonik
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. EPM
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Mitsubishi Chemical
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Sumitomo Chemical
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Mitsui High-tec
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tanaka
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Shinko Electric Industries
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Panasonic
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Hitachi Chemical
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Kyocera Chemical
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Gore
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. BASF
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Henkel
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. AMETEK Electronic
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Toray
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Maruwa
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Leatec Fine Ceramics
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. NCI
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Chaozhou Three-Circle
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
