Electrically conductive adhesives are used in the electronics industry to bond components together. They are also used for surface mounting and conformal coatings. Thermally conductive adhesives are used in the electronics industry to bond components together and for potting and encapsulation. UV curing adhesives are used in the electronics industry to bond components together, as well as for surface mounting, conformal coatings, potting and encapsulation.
- Increasing demand for smartphones and tablets has led to an increase in the production of these devices, which has also increased demand for adhesives used in their assembly process.
- Rising disposable income levels and increasing consumer spending on electronic products are also contributing factors that are driving growth in this market segment over the forecast period (2017-2022).
- Technological advancements have led to an increase in innovation and development of new products with improved features such as touch screens, high resolution displays, and more powerful processors that require better quality adhesives for their assembly process.
Industry Growth Insights published a new data on “Electronics Adhesive Market”. The research report is titled “Electronics Adhesive Market research by Types (Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other), By Applications (Surface Mounting, Conformal Coatings, Potting and Encapsulation, Other), By Players/Companies 3M, Cyberbond, Dow Chemical, Dow Corning, H.B. Fuller, Henkel, Hexion, Huntsman, ITW Performance Polymers, Jowat, LORD Corp, Mactac, Mapei, DELO Industrial Adhesives, Avery Dennison, Benson Polymers, BUHNEN (Germany), Master Bond, Drytac, Dymax, Pidilite Industries, Royal Adhesives and Sealants, Sika AG, Super Glue”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronics Adhesive Market Research Report
By Type
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
By Application
Surface Mounting, Conformal Coatings, Potting and Encapsulation, Other
By Companies
3M, Cyberbond, Dow Chemical, Dow Corning, H.B. Fuller, Henkel, Hexion, Huntsman, ITW Performance Polymers, Jowat, LORD Corp, Mactac, Mapei, DELO Industrial Adhesives, Avery Dennison, Benson Polymers, BUHNEN (Germany), Master Bond, Drytac, Dymax, Pidilite Industries, Royal Adhesives and Sealants, Sika AG, Super Glue
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Electronics Adhesive Market Report Segments:
The global Electronics Adhesive market is segmented on the basis of:
Types
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Surface Mounting, Conformal Coatings, Potting and Encapsulation, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- 3M
- Cyberbond
- Dow Chemical
- Dow Corning
- H.B. Fuller
- Henkel
- Hexion
- Huntsman
- ITW Performance Polymers
- Jowat
- LORD Corp
- Mactac
- Mapei
- DELO Industrial Adhesives
- Avery Dennison
- Benson Polymers
- BUHNEN (Germany)
- Master Bond
- Drytac
- Dymax
- Pidilite Industries
- Royal Adhesives and Sealants
- Sika AG
- Super Glue
Highlights of The Electronics Adhesive Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electrically Conductive Adhesives
- Thermally Conductive Adhesives
- UV Curing Adhesives
- Other
- By Application:
- Surface Mounting
- Conformal Coatings
- Potting and Encapsulation
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronics Adhesive Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronics adhesive is a type of adhesive that is used to attach electronic components and other small objects together. It is often used in the manufacturing process of electronics, as well as in repair and maintenance work.
Some of the major players in the electronics adhesive market are 3M, Cyberbond, Dow Chemical, Dow Corning, H.B. Fuller, Henkel, Hexion, Huntsman, ITW Performance Polymers, Jowat, LORD Corp, Mactac, Mapei, DELO Industrial Adhesives, Avery Dennison, Benson Polymers, BUHNEN (Germany), Master Bond, Drytac, Dymax, Pidilite Industries, Royal Adhesives and Sealants, Sika AG, Super Glue.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Electronics Adhesive Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Electronics Adhesive Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Electronics Adhesive Market - Supply Chain
4.5. Global Electronics Adhesive Market Forecast
4.5.1. Electronics Adhesive Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Electronics Adhesive Market Size (000 Units) and Y-o-Y Growth
4.5.3. Electronics Adhesive Market Absolute $ Opportunity
5. Global Electronics Adhesive Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Electronics Adhesive Market Size and Volume Forecast by Type
5.3.1. Electrically Conductive Adhesives
5.3.2. Thermally Conductive Adhesives
5.3.3. UV Curing Adhesives
5.3.4. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Electronics Adhesive Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Electronics Adhesive Market Size and Volume Forecast by Application
6.3.1. Surface Mounting
6.3.2. Conformal Coatings
6.3.3. Potting and Encapsulation
6.3.4. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Electronics Adhesive Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Electronics Adhesive Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Electronics Adhesive Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Electronics Adhesive Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Electronics Adhesive Demand Share Forecast, 2019-2026
9. North America Electronics Adhesive Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Electronics Adhesive Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Electronics Adhesive Market Size and Volume Forecast by Application
9.4.1. Surface Mounting
9.4.2. Conformal Coatings
9.4.3. Potting and Encapsulation
9.4.4. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Electronics Adhesive Market Size and Volume Forecast by Type
9.7.1. Electrically Conductive Adhesives
9.7.2. Thermally Conductive Adhesives
9.7.3. UV Curing Adhesives
9.7.4. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Electronics Adhesive Demand Share Forecast, 2019-2026
10. Latin America Electronics Adhesive Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Electronics Adhesive Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Electronics Adhesive Market Size and Volume Forecast by Application
10.4.1. Surface Mounting
10.4.2. Conformal Coatings
10.4.3. Potting and Encapsulation
10.4.4. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Electronics Adhesive Market Size and Volume Forecast by Type
10.7.1. Electrically Conductive Adhesives
10.7.2. Thermally Conductive Adhesives
10.7.3. UV Curing Adhesives
10.7.4. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Electronics Adhesive Demand Share Forecast, 2019-2026
11. Europe Electronics Adhesive Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Electronics Adhesive Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Electronics Adhesive Market Size and Volume Forecast by Application
11.4.1. Surface Mounting
11.4.2. Conformal Coatings
11.4.3. Potting and Encapsulation
11.4.4. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Electronics Adhesive Market Size and Volume Forecast by Type
11.7.1. Electrically Conductive Adhesives
11.7.2. Thermally Conductive Adhesives
11.7.3. UV Curing Adhesives
11.7.4. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Electronics Adhesive Demand Share, 2019-2026
12. Asia Pacific Electronics Adhesive Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Electronics Adhesive Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Electronics Adhesive Market Size and Volume Forecast by Application
12.4.1. Surface Mounting
12.4.2. Conformal Coatings
12.4.3. Potting and Encapsulation
12.4.4. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Electronics Adhesive Market Size and Volume Forecast by Type
12.7.1. Electrically Conductive Adhesives
12.7.2. Thermally Conductive Adhesives
12.7.3. UV Curing Adhesives
12.7.4. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Electronics Adhesive Demand Share, 2019-2026
13. Middle East & Africa Electronics Adhesive Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Electronics Adhesive Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Electronics Adhesive Market Size and Volume Forecast by Application
13.4.1. Surface Mounting
13.4.2. Conformal Coatings
13.4.3. Potting and Encapsulation
13.4.4. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Electronics Adhesive Market Size and Volume Forecast by Type
13.7.1. Electrically Conductive Adhesives
13.7.2. Thermally Conductive Adhesives
13.7.3. UV Curing Adhesives
13.7.4. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Electronics Adhesive Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Electronics Adhesive Market: Market Share Analysis
14.2. Electronics Adhesive Distributors and Customers
14.3. Electronics Adhesive Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. 3M
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Cyberbond
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Dow Chemical
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Dow Corning
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. H.B. Fuller
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Henkel
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Hexion
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Huntsman
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. ITW Performance Polymers
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Jowat
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. LORD Corp
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Mactac
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Mapei
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. DELO Industrial Adhesives
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Avery Dennison
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Benson Polymers
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. BUHNEN (Germany)
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Master Bond
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. Drytac
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Dymax
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
