Market Overview:
The global electrostatic discharge (ESD) foam packaging market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for ESD foam packaging in electrical and electronics, manufacturing, automobile, aerospace, defense and military applications. In addition, the growing awareness about ESD protection among consumers is also propelling the growth of this market. However, volatility in prices of raw materials used in manufacturing ESD foam packaging may restrain the growth of this market to some extent during the forecast period. Based on type, metal foams are expected to lead the global electrostatic discharge (ESD) foam packaging market during 2018-2030 due their excellent properties such as high thermal conductivity and low weight. On account of these benefits over traditional materials such as plastics and metals used for ESD protection purposes; metal foams are increasingly being adopted by various industries across different regions globally.
Product Definition:
ESD foam packaging is a type of foam that is used to protect electronic devices from electrostatic discharge. This type of foam is made up of small, individual cells that create an airtight seal. When the device is placed in the foam, it creates an insulating barrier between the device and any potential static electricity.
Metal:
Metal is an excellent electrically conductive material owing to which metal-based ESD foam packaging has been gaining importance in recent years. Various metals have been used for the production of ESD protective packaging, including aluminum, copper, and stainless steel. The choice of metal largely depends on the end-use application as some materials are better suited for high temperature applications while others are better at protecting against low temperature applications.
Conductive:
Conductive is a special type of insulation material that allows electric current to flow through it without being fried. It can be used in various applications such as ESD foam packaging. The conductive materials are classified into two broad categories, namely organic and inorganic, with the latter further divided into carbon nanotubes (CNT), carbon fibers, graphene and others.
Application Insights:
ESD foam packaging is used in a wide range of applications including electrical and electronics, manufacturing, automobile, aerospace and defense/military. The electrical and electronics application segment accounted for the largest market share in 2017 owing to the high reliability requirements of electronic products. In addition, growing demand for consumer durables such as refrigerators & freezers coupled with rising disposable income levels is expected to drive product demand over the forecast period.
The manufacturing application segment is also expected to grow at a significant rate during the study period owing to its extensive use in industrial machinery components as well as construction equipment among other machines that require ESD protection foams. In addition, rapid industrialization along with urbanization has led to an increase in workplace accidents due largely without failure by human error or machine malfunction which can lead directly into damage or destruction of property resulting directly into increased demand foams over recent years.
Regional Analysis:
North America dominated the global market in 2017. The region is expected to witness a considerable growth rate of 7.8% over the forecast period, owing to rapid technological advancements and high disposable income of consumers and businesses in countries such as the U.S., Canada, and Mexico.
Growth Factors:
- Increasing demand for ESD foam packaging from the electronics industry as it protects sensitive electronic components from electrostatic discharge and damage
- Rising demand for lightweight and durable ESD foam packaging solutions in order to reduce shipping costs
- Growing popularity of ESD foam packaging among consumers due to its superior protection against damage and scratches
- Proliferation of online shopping resulting in an increase in the number of shipments that require ESD protection
- Development of new technologies that require more sensitive electronic components, which will drive the need for more reliable ESD foam packaging
Scope Of The Report
Report Attributes
Report Details
Report Title
Electrostatic Discharge (ESD) Foam Packaging Market Research Report
By Type
Metal, Conductive, Dissipative Polymer
By Application
Electrical and Electronics, Manufacturing, Automobile, Aerospace, Defense and Military, Otehrs
By Companies
Botron Company, Inc., Helios Packaging, Nefab AB, Electrotek Static Controls Pvt. Ltd., Statclean Technology (S) Pte Ltd., Tekins Limited, GWP Group Limited, Conductive Containers, Inc., Elcom U.K. Ltd.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
237
Number of Tables & Figures
166
Customization Available
Yes, the report can be customized as per your need.
Global Electrostatic Discharge (ESD) Foam Packaging Market Report Segments:
The global Electrostatic Discharge (ESD) Foam Packaging market is segmented on the basis of:
Types
Metal, Conductive, Dissipative Polymer
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electrical and Electronics, Manufacturing, Automobile, Aerospace, Defense and Military, Otehrs
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Botron Company, Inc.
- Helios Packaging
- Nefab AB
- Electrotek Static Controls Pvt. Ltd.
- Statclean Technology (S) Pte Ltd.
- Tekins Limited
- GWP Group Limited
- Conductive Containers, Inc.
- Elcom U.K. Ltd.
Highlights of The Electrostatic Discharge (ESD) Foam Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Metal
- Conductive
- Dissipative Polymer
- By Application:
- Electrical and Electronics
- Manufacturing
- Automobile
- Aerospace
- Defense and Military
- Otehrs
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electrostatic Discharge (ESD) Foam Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electrostatic discharge (ESD) foam packaging is a type of packaging that uses an electrostatic charge to keep food and other objects from coming into contact. The charge is created by rubbing two pieces of foam together, and it can be very powerful. This type of packaging is used to protect products from moisture, dust, and other contaminants.
Some of the major companies in the electrostatic discharge (esd) foam packaging market are Botron Company, Inc., Helios Packaging, Nefab AB, Electrotek Static Controls Pvt. Ltd., Statclean Technology (S) Pte Ltd., Tekins Limited, GWP Group Limited, Conductive Containers, Inc., Elcom U.K. Ltd..
The electrostatic discharge (esd) foam packaging market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Electrostatic Discharge (ESD) Foam Packaging Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Electrostatic Discharge (ESD) Foam Packaging Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Electrostatic Discharge (ESD) Foam Packaging Market - Supply Chain
4.5. Global Electrostatic Discharge (ESD) Foam Packaging Market Forecast
4.5.1. Electrostatic Discharge (ESD) Foam Packaging Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Electrostatic Discharge (ESD) Foam Packaging Market Size (000 Units) and Y-o-Y Growth
4.5.3. Electrostatic Discharge (ESD) Foam Packaging Market Absolute $ Opportunity
5. Global Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
5.3.1. Metal
5.3.2. Conductive
5.3.3. Dissipative Polymer
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
6.3.1. Electrical and Electronics
6.3.2. Manufacturing
6.3.3. Automobile
6.3.4. Aerospace
6.3.5. Defense and Military
6.3.6. Otehrs
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Electrostatic Discharge (ESD) Foam Packaging Demand Share Forecast, 2019-2026
9. North America Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
9.4.1. Electrical and Electronics
9.4.2. Manufacturing
9.4.3. Automobile
9.4.4. Aerospace
9.4.5. Defense and Military
9.4.6. Otehrs
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
9.7.1. Metal
9.7.2. Conductive
9.7.3. Dissipative Polymer
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Electrostatic Discharge (ESD) Foam Packaging Demand Share Forecast, 2019-2026
10. Latin America Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
10.4.1. Electrical and Electronics
10.4.2. Manufacturing
10.4.3. Automobile
10.4.4. Aerospace
10.4.5. Defense and Military
10.4.6. Otehrs
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
10.7.1. Metal
10.7.2. Conductive
10.7.3. Dissipative Polymer
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Electrostatic Discharge (ESD) Foam Packaging Demand Share Forecast, 2019-2026
11. Europe Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
11.4.1. Electrical and Electronics
11.4.2. Manufacturing
11.4.3. Automobile
11.4.4. Aerospace
11.4.5. Defense and Military
11.4.6. Otehrs
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
11.7.1. Metal
11.7.2. Conductive
11.7.3. Dissipative Polymer
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Electrostatic Discharge (ESD) Foam Packaging Demand Share, 2019-2026
12. Asia Pacific Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
12.4.1. Electrical and Electronics
12.4.2. Manufacturing
12.4.3. Automobile
12.4.4. Aerospace
12.4.5. Defense and Military
12.4.6. Otehrs
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
12.7.1. Metal
12.7.2. Conductive
12.7.3. Dissipative Polymer
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Electrostatic Discharge (ESD) Foam Packaging Demand Share, 2019-2026
13. Middle East & Africa Electrostatic Discharge (ESD) Foam Packaging Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Application
13.4.1. Electrical and Electronics
13.4.2. Manufacturing
13.4.3. Automobile
13.4.4. Aerospace
13.4.5. Defense and Military
13.4.6. Otehrs
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Electrostatic Discharge (ESD) Foam Packaging Market Size and Volume Forecast by Type
13.7.1. Metal
13.7.2. Conductive
13.7.3. Dissipative Polymer
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Electrostatic Discharge (ESD) Foam Packaging Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Electrostatic Discharge (ESD) Foam Packaging Market: Market Share Analysis
14.2. Electrostatic Discharge (ESD) Foam Packaging Distributors and Customers
14.3. Electrostatic Discharge (ESD) Foam Packaging Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Botron Company, Inc.
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Helios Packaging
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Nefab AB
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Electrotek Static Controls Pvt. Ltd.
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Statclean Technology (S) Pte Ltd.
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Tekins Limited
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. GWP Group Limited
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Conductive Containers, Inc.
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Elcom U.K. Ltd.
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook