The global epoxy based thermal conductive adhesives market is expected to grow at a CAGR of 6.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for thermal conductive adhesives in various applications such as battery thermal, heat sink, IC packaging heat conduction, LED lighting thermal and thermal material potting. The growing demand for these products in various applications is expected to drive the growth of this market during the forecast period.
The global epoxy based thermal conductive adhesives market by type can be segmented into isotropic and anisotropic types. The isotropic type accounted for a share of over 50% in 2017 and is expected to maintain its dominance throughout the forecast period owing to its high performance properties such as low viscosity and high dielectric strength which make it suitable for use in various applications such as battery thermal, heat sink, IC packaging heat conduction and LED lighting thermal among others.
- Increasing demand for thermal conductive adhesives in the electronics industry is one of the major factors driving growth in this market.
- The increasing use of epoxy based thermal conductive adhesives in various industries such as automotive, aerospace and defense, and construction is also driving growth in this market.
- Increasing demand for high-performance epoxy based thermal conductive adhesives from emerging economies such as China and India is also driving growth in this market.
- Increasing use of epoxy based thermal conductive adhesives for heat dissipation purposes will drive growth in this market.
Industry Growth Insights published a new data on “Epoxy Based Thermal Conductive Adhesives Market”. The research report is titled “Epoxy Based Thermal Conductive Adhesives Market research by Types (Isotropic, Anisotropic), By Applications (Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting), By Players/Companies Henkel AG & Co. KGaA, H.B. Fuller, 3M Company, Permabond Engineering Adhesives, Masterbond, Creative Materials Inc., Panacol-Elosol GmbH, DOW Corning, Polytec PT GmbH, Lord Corporation, MG Chemicals, Protavic America, Inc., Aremco, Cast-Coat, Inc., Nagase America Corporation”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Epoxy Based Thermal Conductive Adhesives Market Research Report
By Type
Isotropic, Anisotropic
By Application
Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting
By Companies
Henkel AG & Co. KGaA, H.B. Fuller, 3M Company, Permabond Engineering Adhesives, Masterbond, Creative Materials Inc., Panacol-Elosol GmbH, DOW Corning, Polytec PT GmbH, Lord Corporation, MG Chemicals, Protavic America, Inc., Aremco, Cast-Coat, Inc., Nagase America Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Epoxy Based Thermal Conductive Adhesives Market Report Segments:
The global Epoxy Based Thermal Conductive Adhesives market is segmented on the basis of:
Types
Isotropic, Anisotropic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel AG & Co. KGaA
- H.B. Fuller
- 3M Company
- Permabond Engineering Adhesives
- Masterbond
- Creative Materials Inc.
- Panacol-Elosol GmbH
- DOW Corning
- Polytec PT GmbH
- Lord Corporation
- MG Chemicals
- Protavic America, Inc.
- Aremco
- Cast-Coat, Inc.
- Nagase America Corporation
Highlights of The Epoxy Based Thermal Conductive Adhesives Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Isotropic
- Anisotropic
- By Application:
- Battery Thermal
- Heat Sink
- IC Packaging Heat Conduction
- LED Lighting Thermal
- Thermal Material Potting
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Epoxy Based Thermal Conductive Adhesives Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Epoxy based thermal conductive adhesives are a type of adhesive that use epoxy resin as the adhesive. Epoxy based adhesives are often used to attach metal parts together, and they have high thermal conductivity which makes them good choices for attaching heat sensitive components to other components.
Some of the major companies in the epoxy based thermal conductive adhesives market are Henkel AG & Co. KGaA, H.B. Fuller, 3M Company, Permabond Engineering Adhesives, Masterbond, Creative Materials Inc., Panacol-Elosol GmbH, DOW Corning, Polytec PT GmbH, Lord Corporation, MG Chemicals, Protavic America, Inc., Aremco, Cast-Coat, Inc., Nagase America Corporation.
The epoxy based thermal conductive adhesives market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Epoxy Based Thermal Conductive Adhesives Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Epoxy Based Thermal Conductive Adhesives Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Epoxy Based Thermal Conductive Adhesives Market - Supply Chain
4.5. Global Epoxy Based Thermal Conductive Adhesives Market Forecast
4.5.1. Epoxy Based Thermal Conductive Adhesives Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Epoxy Based Thermal Conductive Adhesives Market Size (000 Units) and Y-o-Y Growth
4.5.3. Epoxy Based Thermal Conductive Adhesives Market Absolute $ Opportunity
5. Global Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Type
5.3.1. Isotropic
5.3.2. Anisotropic
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
6.3.1. Battery Thermal
6.3.2. Heat Sink
6.3.3. IC Packaging Heat Conduction
6.3.4. LED Lighting Thermal
6.3.5. Thermal Material Potting
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Epoxy Based Thermal Conductive Adhesives Demand Share Forecast, 2019-2029
9. North America Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
9.4.1. Battery Thermal
9.4.2. Heat Sink
9.4.3. IC Packaging Heat Conduction
9.4.4. LED Lighting Thermal
9.4.5. Thermal Material Potting
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Type
9.7.1. Isotropic
9.7.2. Anisotropic
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Epoxy Based Thermal Conductive Adhesives Demand Share Forecast, 2019-2029
10. Latin America Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
10.4.1. Battery Thermal
10.4.2. Heat Sink
10.4.3. IC Packaging Heat Conduction
10.4.4. LED Lighting Thermal
10.4.5. Thermal Material Potting
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Type
10.7.1. Isotropic
10.7.2. Anisotropic
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Epoxy Based Thermal Conductive Adhesives Demand Share Forecast, 2019-2029
11. Europe Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
11.4.1. Battery Thermal
11.4.2. Heat Sink
11.4.3. IC Packaging Heat Conduction
11.4.4. LED Lighting Thermal
11.4.5. Thermal Material Potting
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Epoxy Based Thermal Conductive dhesives Market Size and Volume Forecast by Type
11.7.1. Isotropic
11.7.2. Anisotropic
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Epoxy Based Thermal Conductive Adhesives Demand Share, 2019-2029
12. Asia Pacific Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
12.4.1. Battery Thermal
12.4.2. Heat Sink
12.4.3. IC Packaging Heat Conduction
12.4.4. LED Lighting Thermal
12.4.5. Thermal Material Potting
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Type
12.7.1. Isotropic
12.7.2. Anisotropic
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Epoxy Based Thermal Conductive Adhesives Demand Share, 2019-2029
13. Middle East & Africa Epoxy Based Thermal Conductive Adhesives Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Application
13.4.1. Battery Thermal
13.4.2. Heat Sink
13.4.3. IC Packaging Heat Conduction
13.4.4. LED Lighting Thermal
13.4.5. Thermal Material Potting
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Epoxy Based Thermal Conductive Adhesives Market Size and Volume Forecast by Type
13.7.1. Isotropic
13.7.2. Anisotropic
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Epoxy Based Thermal Conductive Adhesives Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Epoxy Based Thermal Conductive Adhesives Market: Market Share Analysis
14.2. Epoxy Based Thermal Conductive Adhesives Distributors and Customers
14.3. Epoxy Based Thermal Conductive Adhesives Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Henkel AG & Co. KGaA
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. H.B. Fuller
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. 3M Company
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Permabond Engineering Adhesives
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Masterbond
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Creative Materials Inc.
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Panacol-Elosol GmbH
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. DOW Corning
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Polytec PT GmbH
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Lord Corporation
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. MG Chemicals
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Protavic America, Inc.
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Aremco
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Cast-Coat, Inc.
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Nagase America Corporation
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
