Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Fan-out Wafer Level Packaging Market by Type (Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others), By Application (Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Fan-out Wafer Level Packaging Market by Type (Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others), By Application (Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 131779 3300 Electronics & Semiconductor 377 231 Pages 4.7 (35)
                                          

The global market for wafer level packaging is expected to grow at a CAGR of 5.5% from 2021 to 2030. The growth in the market is attributed to the increasing demand for semiconductor devices, which are used in various applications such as wireless connectivity, analog and mixed ICs, logic and memory ICs, MEMS and sensors, CMOS image sensors. The demand for these devices is expected to increase due to the growing need for high-performance electronics in various industries such as automotive electronics, aerospace & defense electronics, industrial automation & control systems (IACS), consumer electronics (CE), healthcare equipment and medical imaging equipment. The global wafer level packaging market by type includes bump pitch 0.4mm and bump pitch 0.35mm with a share of 45% each in 2018. The bump pitch 0.4mm segment accounted for more than half of the total revenue generated by this type owing to its wide usage across different applications such as wireless connectivity, analog and mixed ICs, MEMS and sensors among others while the bump pitch 0.35mm segment accounted for less than half of the total revenue generated by this type owing to its limited usage across different applications such as wireless connectivity among others.

Some Of The Growth Factors Of This Market:

  1. The increasing demand for high-performance and low-power devices is driving the growth of the fan-out wafer level packaging market.
  2. The increasing need for miniaturization in electronics is also driving the growth of this market.
  3. The growing demand for smartphones, tablets, and other mobile devices is also a major factor that will drive the growth of this market in future years.
  4. Increasing use of 3D integrated circuits (ICs) in consumer electronics products such as smartphones, tablets, and laptops will also fuel the growth of this market over the forecast period.
  5. Increasing adoption of fan-out wafer level packaging technology by semiconductor manufacturers to reduce their manufacturing costs.

Industry Growth Insights published a new data on “Fan-out Wafer Level Packaging Market”. The research report is titled “Fan-out Wafer Level Packaging Market research by Types (Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others), By Applications (Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors), By Players/Companies STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, Ultratech”.

Scope Of The Report

Report Attributes

Report Details

Report Title

Fan-out Wafer Level Packaging Market Research Report

By Type

Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others

By Application

Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors

By Companies

STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, Ultratech

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

231

Number of Tables & Figures

162

Customization Available

Yes, the report can be customized as per your need.


Global Fan-out Wafer Level Packaging Industry Outlook


Global Fan-out Wafer Level Packaging Market Report Segments:

The global Fan-out Wafer Level Packaging market is segmented on the basis of:

Types

Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. STATS ChipPAC
  2. TSMC
  3. Texas Instruments
  4. Rudolph Technologies
  5. SEMES
  6. SUSS MicroTec
  7. STMicroelectronics
  8. Ultratech

Global Fan-out Wafer Level Packaging Market Overview


Highlights of The Fan-out Wafer Level Packaging Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Bump Pitch 0.4mm
    2. Bump Pitch 0.35mm
    3. Others
  1. By Application:

    1. Analog and Mixed IC
    2. Wireless Connectivity
    3. Misc, Logic and Memory IC
    4. MEMS and Sensors
    5. CMOS Image Sensors
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Fan-out Wafer Level Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Fan-out Wafer Level Packaging Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available
                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Fan-out Wafer Level Packaging Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Fan-out Wafer Level Packaging Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Fan-out Wafer Level Packaging Market - Supply Chain
   4.5. Global Fan-out Wafer Level Packaging Market Forecast
      4.5.1. Fan-out Wafer Level Packaging Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Fan-out Wafer Level Packaging Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Fan-out Wafer Level Packaging Market Absolute $ Opportunity

5. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
      5.3.1. Bump Pitch 0.4mm
      5.3.2. Bump Pitch 0.35mm
      5.3.3. Others
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      6.3.1. Analog and Mixed IC
      6.3.2. Wireless Connectivity
      6.3.3. Misc, Logic and Memory IC
      6.3.4. MEMS and Sensors
      6.3.5. CMOS Image Sensors
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029

9. North America Fan-out Wafer Level Packaging Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      9.4.1. Analog and Mixed IC
      9.4.2. Wireless Connectivity
      9.4.3. Misc, Logic and Memory IC
      9.4.4. MEMS and Sensors
      9.4.5. CMOS Image Sensors
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
      9.7.1. Bump Pitch 0.4mm
      9.7.2. Bump Pitch 0.35mm
      9.7.3. Others
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029

10. Latin America Fan-out Wafer Level Packaging Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      10.4.1. Analog and Mixed IC
      10.4.2. Wireless Connectivity
      10.4.3. Misc, Logic and Memory IC
      10.4.4. MEMS and Sensors
      10.4.5. CMOS Image Sensors
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
      10.7.1. Bump Pitch 0.4mm
      10.7.2. Bump Pitch 0.35mm
      10.7.3. Others
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029

11. Europe Fan-out Wafer Level Packaging Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      11.4.1. Analog and Mixed IC
      11.4.2. Wireless Connectivity
      11.4.3. Misc, Logic and Memory IC
      11.4.4. MEMS and Sensors
      11.4.5. CMOS Image Sensors
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Tpe
      11.7.1. Bump Pitch 0.4mm
      11.7.2. Bump Pitch 0.35mm
      11.7.3. Others
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Fan-out Wafer Level Packaging Demand Share, 2019-2029

12. Asia Pacific Fan-out Wafer Level Packaging Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      12.4.1. Analog and Mixed IC
      12.4.2. Wireless Connectivity
      12.4.3. Misc, Logic and Memory IC
      12.4.4. MEMS and Sensors
      12.4.5. CMOS Image Sensors
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
      12.7.1. Bump Pitch 0.4mm
      12.7.2. Bump Pitch 0.35mm
      12.7.3. Others
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Fan-out Wafer Level Packaging Demand Share, 2019-2029

13. Middle East & Africa Fan-out Wafer Level Packaging Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
      13.4.1. Analog and Mixed IC
      13.4.2. Wireless Connectivity
      13.4.3. Misc, Logic and Memory IC
      13.4.4. MEMS and Sensors
      13.4.5. CMOS Image Sensors
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
      13.7.1. Bump Pitch 0.4mm
      13.7.2. Bump Pitch 0.35mm
      13.7.3. Others
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Fan-out Wafer Level Packaging Demand Share, 2019-2029

14. Competition Landscape
   14.1. Global Fan-out Wafer Level Packaging Market: Market Share Analysis
   14.2. Fan-out Wafer Level Packaging Distributors and Customers
   14.3. Fan-out Wafer Level Packaging Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. STATS ChipPAC
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. TSMC
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. Texas Instruments
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Rudolph Technologies
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. SEMES
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. SUSS MicroTec
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. STMicroelectronics
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Ultratech
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. COMPANY9
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. COMPANY 10
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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