The global market for wafer level packaging is expected to grow at a CAGR of 5.5% from 2021 to 2030. The growth in the market is attributed to the increasing demand for semiconductor devices, which are used in various applications such as wireless connectivity, analog and mixed ICs, logic and memory ICs, MEMS and sensors, CMOS image sensors. The demand for these devices is expected to increase due to the growing need for high-performance electronics in various industries such as automotive electronics, aerospace & defense electronics, industrial automation & control systems (IACS), consumer electronics (CE), healthcare equipment and medical imaging equipment. The global wafer level packaging market by type includes bump pitch 0.4mm and bump pitch 0.35mm with a share of 45% each in 2018. The bump pitch 0.4mm segment accounted for more than half of the total revenue generated by this type owing to its wide usage across different applications such as wireless connectivity, analog and mixed ICs, MEMS and sensors among others while the bump pitch 0.35mm segment accounted for less than half of the total revenue generated by this type owing to its limited usage across different applications such as wireless connectivity among others.
Some Of The Growth Factors Of This Market:
- The increasing demand for high-performance and low-power devices is driving the growth of the fan-out wafer level packaging market.
- The increasing need for miniaturization in electronics is also driving the growth of this market.
- The growing demand for smartphones, tablets, and other mobile devices is also a major factor that will drive the growth of this market in future years.
- Increasing use of 3D integrated circuits (ICs) in consumer electronics products such as smartphones, tablets, and laptops will also fuel the growth of this market over the forecast period.
- Increasing adoption of fan-out wafer level packaging technology by semiconductor manufacturers to reduce their manufacturing costs.
Industry Growth Insights published a new data on “Fan-out Wafer Level Packaging Market”. The research report is titled “Fan-out Wafer Level Packaging Market research by Types (Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others), By Applications (Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors), By Players/Companies STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, Ultratech”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Fan-out Wafer Level Packaging Market Research Report
By Type
Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others
By Application
Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors
By Companies
STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, Ultratech
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
231
Number of Tables & Figures
162
Customization Available
Yes, the report can be customized as per your need.
Global Fan-out Wafer Level Packaging Market Report Segments:
The global Fan-out Wafer Level Packaging market is segmented on the basis of:
Types
Bump Pitch 0.4mm, Bump Pitch 0.35mm, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Analog and Mixed IC, Wireless Connectivity, Misc, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- STATS ChipPAC
- TSMC
- Texas Instruments
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- STMicroelectronics
- Ultratech
Highlights of The Fan-out Wafer Level Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Bump Pitch 0.4mm
- Bump Pitch 0.35mm
- Others
- By Application:
- Analog and Mixed IC
- Wireless Connectivity
- Misc, Logic and Memory IC
- MEMS and Sensors
- CMOS Image Sensors
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Fan-out Wafer Level Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Fan-out Wafer Level Packaging is a type of packaging in which multiple wafers are packaged together on a single substrate. The wafers are typically small, thin pieces of semiconductor material that must be carefully handled and transported to avoid damage. Fan-out packaging allows these delicate pieces to be packaged in a way that minimizes the number of individual packages needed, reducing the overall shipping and handling costs.
Some of the major companies in the fan-out wafer level packaging market are STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, Ultratech.
The fan-out wafer level packaging market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Fan-out Wafer Level Packaging Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Fan-out Wafer Level Packaging Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Fan-out Wafer Level Packaging Market - Supply Chain
4.5. Global Fan-out Wafer Level Packaging Market Forecast
4.5.1. Fan-out Wafer Level Packaging Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Fan-out Wafer Level Packaging Market Size (000 Units) and Y-o-Y Growth
4.5.3. Fan-out Wafer Level Packaging Market Absolute $ Opportunity
5. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
5.3.1. Bump Pitch 0.4mm
5.3.2. Bump Pitch 0.35mm
5.3.3. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
6.3.1. Analog and Mixed IC
6.3.2. Wireless Connectivity
6.3.3. Misc, Logic and Memory IC
6.3.4. MEMS and Sensors
6.3.5. CMOS Image Sensors
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Fan-out Wafer Level Packaging Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Fan-out Wafer Level Packaging Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029
9. North America Fan-out Wafer Level Packaging Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
9.4.1. Analog and Mixed IC
9.4.2. Wireless Connectivity
9.4.3. Misc, Logic and Memory IC
9.4.4. MEMS and Sensors
9.4.5. CMOS Image Sensors
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
9.7.1. Bump Pitch 0.4mm
9.7.2. Bump Pitch 0.35mm
9.7.3. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029
10. Latin America Fan-out Wafer Level Packaging Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
10.4.1. Analog and Mixed IC
10.4.2. Wireless Connectivity
10.4.3. Misc, Logic and Memory IC
10.4.4. MEMS and Sensors
10.4.5. CMOS Image Sensors
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
10.7.1. Bump Pitch 0.4mm
10.7.2. Bump Pitch 0.35mm
10.7.3. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Fan-out Wafer Level Packaging Demand Share Forecast, 2019-2029
11. Europe Fan-out Wafer Level Packaging Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
11.4.1. Analog and Mixed IC
11.4.2. Wireless Connectivity
11.4.3. Misc, Logic and Memory IC
11.4.4. MEMS and Sensors
11.4.5. CMOS Image Sensors
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Fan-out Wafer Level Packaging Market Size and Volume Forecast by Tpe
11.7.1. Bump Pitch 0.4mm
11.7.2. Bump Pitch 0.35mm
11.7.3. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Fan-out Wafer Level Packaging Demand Share, 2019-2029
12. Asia Pacific Fan-out Wafer Level Packaging Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
12.4.1. Analog and Mixed IC
12.4.2. Wireless Connectivity
12.4.3. Misc, Logic and Memory IC
12.4.4. MEMS and Sensors
12.4.5. CMOS Image Sensors
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
12.7.1. Bump Pitch 0.4mm
12.7.2. Bump Pitch 0.35mm
12.7.3. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Fan-out Wafer Level Packaging Demand Share, 2019-2029
13. Middle East & Africa Fan-out Wafer Level Packaging Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Application
13.4.1. Analog and Mixed IC
13.4.2. Wireless Connectivity
13.4.3. Misc, Logic and Memory IC
13.4.4. MEMS and Sensors
13.4.5. CMOS Image Sensors
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Fan-out Wafer Level Packaging Market Size and Volume Forecast by Type
13.7.1. Bump Pitch 0.4mm
13.7.2. Bump Pitch 0.35mm
13.7.3. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Fan-out Wafer Level Packaging Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Fan-out Wafer Level Packaging Market: Market Share Analysis
14.2. Fan-out Wafer Level Packaging Distributors and Customers
14.3. Fan-out Wafer Level Packaging Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. STATS ChipPAC
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. TSMC
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Texas Instruments
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Rudolph Technologies
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. SEMES
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. SUSS MicroTec
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. STMicroelectronics
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Ultratech
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook