Market Overview:
The global flip chip bonder market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for flip chip technology in various applications, such as IDMs and OSATs. Additionally, the growing demand for miniaturization and higher performance in electronic devices is also contributing to the growth of this market.
Product Definition:
A Flip Chip Bonder is a machine used to attach semiconductor chips to circuit boards. The importance of Flip Chip Bonders is that they provide a way to easily and securely attach chips to a board, which can then be used in electronic devices.
Fully Automatic:
Fully automatic flip chip bonder is a device used to bond and assemble Flip Chip Devices (FCDs) on any substrate. It has the ability to perform repetitive tasks with high speed and accuracy. The fully automatic flip chip bonder can be considered as an automated robotic system that performs all of the steps involved in Flip Chip assembling, from loading wafers into the oven until they are removed after completion of the process.
Semi-Automatic:
Semi-automatic binder is a device used in flip chip bonding market which helps to bind the Flip Chip substrate with wire bond and also provides mechanical stability to the assembled devices. It’s an essential tool for assembly of Flip Chip Devices (FCD) as it helps in improving thermal management, electrical performance, and reliability of FCD.
Application Insights:
IDM was the largest application segment in 2017 and accounted for over 50% of the total revenue share. Increasing demand for integrated circuit chips with higher processing speeds is expected to drive the market growth over the forecast period. Flip chip binder is used to bind together two substrates, which are then assembled into a single integrated circuit using an epoxy resin mixture as a filler material.
The OSAT segment is projected to witness significant growth during the forecast period owing to increasing demand from telecom equipment manufacturing companies such as Ericsson, Huawei Technologies Co., Ltd., ZTE Corporation and others operating across various regions worldwide. These telecommunication companies are focusing on deploying 5G technology due to its enhanced data transmission speed which subsequently drives product adoption in this application segment.
Flip chip bonders have numerous applications in other semiconductor devices including barcode scanners, laser printers, facsimile machines.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period owing to increasing demand from China and India. The Flip Chip Bonder (FCB) market in Asia Pacific is majorly driven by rising demand for automated manufacturing processes along with growing electronics industry in countries such as China, Japan, South Korea, Taiwan and India.
The Middle East & Africa region is also anticipated to witness significant growth due to rapid development of electronic industries especially in countries such as Saudi Arabia and UAE. Moreover, rising investments by governments of various Middle Eastern countries are driving the regional market growth. For instance; In February 2017; Saudi Arabia announced a plan for investing around USD X billion over 10 years into Vision 2030 which includes developing new cities based on renewable energy generation sources along with advanced manufacturing units that can produce world-class products using these resources at lowest costs possible thereby creating huge opportunities for Flip Chip Bonder manufacturers operating within this region.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of flip chip technology among semiconductor manufacturers
- Proliferation of 3D integrated circuits (ICs)
- Advances in lithography and packaging technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Flip Chip Bonder Market Research Report
By Type
Fully Automatic, Semi-Automatic
By Application
IDMs, OSAT
By Companies
BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Flip Chip Bonder Market Report Segments:
The global Flip Chip Bonder market is segmented on the basis of:
Types
Fully Automatic, Semi-Automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDMs, OSAT
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BESI
- ASMPT
- Shibaura
- Muehlbauer
- K&S
- Hamni
- AMICRA Microtechnologies
- SET
- Athlete FA
Highlights of The Flip Chip Bonder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi-Automatic
- By Application:
- IDMs
- OSAT
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Flip Chip Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Flip Chip Bonder is a tool that helps you bond flip chip components. It uses an infrared light to heat up the flip chip component, which then causes it to adhere to the binder.
Some of the major companies in the flip chip bonder market are BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA.
The flip chip bonder market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Flip Chip Bonder Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Flip Chip Bonder Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Flip Chip Bonder Market - Supply Chain
4.5. Global Flip Chip Bonder Market Forecast
4.5.1. Flip Chip Bonder Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Flip Chip Bonder Market Size (000 Units) and Y-o-Y Growth
4.5.3. Flip Chip Bonder Market Absolute $ Opportunity
5. Global Flip Chip Bonder Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Flip Chip Bonder Market Size and Volume Forecast by Type
5.3.1. Fully Automatic
5.3.2. Semi-Automatic
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Flip Chip Bonder Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Flip Chip Bonder Market Size and Volume Forecast by Application
6.3.1. IDMs
6.3.2. OSAT
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Flip Chip Bonder Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Flip Chip Bonder Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Flip Chip Bonder Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Flip Chip Bonder Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Flip Chip Bonder Demand Share Forecast, 2019-2026
9. North America Flip Chip Bonder Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Flip Chip Bonder Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Flip Chip Bonder Market Size and Volume Forecast by Application
9.4.1. IDMs
9.4.2. OSAT
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Flip Chip Bonder Market Size and Volume Forecast by Type
9.7.1. Fully Automatic
9.7.2. Semi-Automatic
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Flip Chip Bonder Demand Share Forecast, 2019-2026
10. Latin America Flip Chip Bonder Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Flip Chip Bonder Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Flip Chip Bonder Market Size and Volume Forecast by Application
10.4.1. IDMs
10.4.2. OSAT
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Flip Chip Bonder Market Size and Volume Forecast by Type
10.7.1. Fully Automatic
10.7.2. Semi-Automatic
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Flip Chip Bonder Demand Share Forecast, 2019-2026
11. Europe Flip Chip Bonder Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Flip Chip Bonder Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Flip Chip Bonder Market Size and Volume Forecast by Application
11.4.1. IDMs
11.4.2. OSAT
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Flip Chip Bonder Market Size and Volume Forecast by Type
11.7.1. Fully Automatic
11.7.2. Semi-Automatic
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Flip Chip Bonder Demand Share, 2019-2026
12. Asia Pacific Flip Chip Bonder Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Application
12.4.1. IDMs
12.4.2. OSAT
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Type
12.7.1. Fully Automatic
12.7.2. Semi-Automatic
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Flip Chip Bonder Demand Share, 2019-2026
13. Middle East & Africa Flip Chip Bonder Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Application
13.4.1. IDMs
13.4.2. OSAT
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Type
13.7.1. Fully Automatic
13.7.2. Semi-Automatic
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Flip Chip Bonder Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Flip Chip Bonder Market: Market Share Analysis
14.2. Flip Chip Bonder Distributors and Customers
14.3. Flip Chip Bonder Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. BESI
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASMPT
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Shibaura
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Muehlbauer
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. K&S
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hamni
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. AMICRA Microtechnologies
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. SET
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Athlete FA
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
