Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Flip Chip Bonder Market by Type (Fully Automatic, Semi-Automatic), By Application (IDMs, OSAT) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Flip Chip Bonder Market by Type (Fully Automatic, Semi-Automatic), By Application (IDMs, OSAT) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 156587 3300 Machinery & Equipment 377 230 Pages 4.6 (33)

Market Overview:

The global flip chip bonder market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for flip chip technology in various applications, such as IDMs and OSATs. Additionally, the growing demand for miniaturization and higher performance in electronic devices is also contributing to the growth of this market.

Global Flip Chip Bonder Industry Outlook

Product Definition:

A Flip Chip Bonder is a machine used to attach semiconductor chips to circuit boards. The importance of Flip Chip Bonders is that they provide a way to easily and securely attach chips to a board, which can then be used in electronic devices.

Fully Automatic:

Fully automatic flip chip bonder is a device used to bond and assemble Flip Chip Devices (FCDs) on any substrate. It has the ability to perform repetitive tasks with high speed and accuracy. The fully automatic flip chip bonder can be considered as an automated robotic system that performs all of the steps involved in Flip Chip assembling, from loading wafers into the oven until they are removed after completion of the process.


Semi-automatic binder is a device used in flip chip bonding market which helps to bind the Flip Chip substrate with wire bond and also provides mechanical stability to the assembled devices. It’s an essential tool for assembly of Flip Chip Devices (FCD) as it helps in improving thermal management, electrical performance, and reliability of FCD.

Application Insights:

IDM was the largest application segment in 2017 and accounted for over 50% of the total revenue share. Increasing demand for integrated circuit chips with higher processing speeds is expected to drive the market growth over the forecast period. Flip chip binder is used to bind together two substrates, which are then assembled into a single integrated circuit using an epoxy resin mixture as a filler material.

The OSAT segment is projected to witness significant growth during the forecast period owing to increasing demand from telecom equipment manufacturing companies such as Ericsson, Huawei Technologies Co., Ltd., ZTE Corporation and others operating across various regions worldwide. These telecommunication companies are focusing on deploying 5G technology due to its enhanced data transmission speed which subsequently drives product adoption in this application segment.

Flip chip bonders have numerous applications in other semiconductor devices including barcode scanners, laser printers, facsimile machines.

Regional Analysis:

Asia Pacific is expected to be the fastest-growing region over the forecast period owing to increasing demand from China and India. The Flip Chip Bonder (FCB) market in Asia Pacific is majorly driven by rising demand for automated manufacturing processes along with growing electronics industry in countries such as China, Japan, South Korea, Taiwan and India.

The Middle East & Africa region is also anticipated to witness significant growth due to rapid development of electronic industries especially in countries such as Saudi Arabia and UAE. Moreover, rising investments by governments of various Middle Eastern countries are driving the regional market growth. For instance; In February 2017; Saudi Arabia announced a plan for investing around USD X billion over 10 years into Vision 2030 which includes developing new cities based on renewable energy generation sources along with advanced manufacturing units that can produce world-class products using these resources at lowest costs possible thereby creating huge opportunities for Flip Chip Bonder manufacturers operating within this region.

Growth Factors:

  • Increasing demand for miniaturization in electronic devices
  • Rising demand from the automotive and aerospace industries
  • Growing popularity of flip chip technology among semiconductor manufacturers
  • Proliferation of 3D integrated circuits (ICs)
  • Advances in lithography and packaging technologies

Scope Of The Report

Report Attributes

Report Details

Report Title

Flip Chip Bonder Market Research Report

By Type

Fully Automatic, Semi-Automatic

By Application


By Companies

BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year


Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year


Number of Pages


Number of Tables & Figures


Customization Available

Yes, the report can be customized as per your need.

Global Flip Chip Bonder Market Report Segments:

The global Flip Chip Bonder market is segmented on the basis of:


Fully Automatic, Semi-Automatic

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.



The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. BESI
  2. ASMPT
  3. Shibaura
  4. Muehlbauer
  5. K&S
  6. Hamni
  7. AMICRA Microtechnologies
  8. SET
  9. Athlete FA

Global Flip Chip Bonder Market Overview

Highlights of The Flip Chip Bonder Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Fully Automatic
    2. Semi-Automatic
  1. By Application:

    1. IDMs
    2. OSAT
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Flip Chip Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Flip Chip Bonder Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?

Flip Chip Bonder is a tool that helps you bond flip chip components. It uses an infrared light to heat up the flip chip component, which then causes it to adhere to the binder.

Some of the major companies in the flip chip bonder market are BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA.

The flip chip bonder market is expected to grow at a compound annual growth rate of 6.5%.

1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Flip Chip Bonder Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Flip Chip Bonder Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Flip Chip Bonder Market - Supply Chain
   4.5. Global Flip Chip Bonder Market Forecast
      4.5.1. Flip Chip Bonder Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Flip Chip Bonder Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Flip Chip Bonder Market Absolute $ Opportunity

5. Global Flip Chip Bonder Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Flip Chip Bonder Market Size and Volume Forecast by Type
      5.3.1. Fully Automatic
      5.3.2. Semi-Automatic
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Flip Chip Bonder Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Flip Chip Bonder Market Size and Volume Forecast by Application
      6.3.1. IDMs
      6.3.2. OSAT
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Flip Chip Bonder Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Flip Chip Bonder Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Flip Chip Bonder Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Flip Chip Bonder Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Flip Chip Bonder Demand Share Forecast, 2019-2026

9. North America Flip Chip Bonder Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Flip Chip Bonder Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Flip Chip Bonder Market Size and Volume Forecast by Application
      9.4.1. IDMs
      9.4.2. OSAT
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Flip Chip Bonder Market Size and Volume Forecast by Type
      9.7.1. Fully Automatic
      9.7.2. Semi-Automatic
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Flip Chip Bonder Demand Share Forecast, 2019-2026

10. Latin America Flip Chip Bonder Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Flip Chip Bonder Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Flip Chip Bonder Market Size and Volume Forecast by Application
      10.4.1. IDMs
      10.4.2. OSAT
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Flip Chip Bonder Market Size and Volume Forecast by Type
      10.7.1. Fully Automatic
      10.7.2. Semi-Automatic
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Flip Chip Bonder Demand Share Forecast, 2019-2026

11. Europe Flip Chip Bonder Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Flip Chip Bonder Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Flip Chip Bonder Market Size and Volume Forecast by Application
      11.4.1. IDMs
      11.4.2. OSAT
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Flip Chip Bonder Market Size and Volume Forecast by Type
      11.7.1. Fully Automatic
      11.7.2. Semi-Automatic
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Flip Chip Bonder Demand Share, 2019-2026

12. Asia Pacific Flip Chip Bonder Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Application
      12.4.1. IDMs
      12.4.2. OSAT
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Flip Chip Bonder Market Size and Volume Forecast by Type
      12.7.1. Fully Automatic
      12.7.2. Semi-Automatic
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Flip Chip Bonder Demand Share, 2019-2026

13. Middle East & Africa Flip Chip Bonder Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Application
      13.4.1. IDMs
      13.4.2. OSAT
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Flip Chip Bonder Market Size and Volume Forecast by Type
      13.7.1. Fully Automatic
      13.7.2. Semi-Automatic
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Flip Chip Bonder Demand Share, 2019-2026

14. Competition Landscape
   14.1. Global Flip Chip Bonder Market: Market Share Analysis
   14.2. Flip Chip Bonder Distributors and Customers
   14.3. Flip Chip Bonder Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. BESI Overview Financials Developments Strategic Outlook
      14.4.2. ASMPT Overview Financials Developments Strategic Outlook
      14.4.3. Shibaura Overview Financials Developments Strategic Outlook
      14.4.4. Muehlbauer Overview Financials Developments Strategic Outlook
      14.4.5. K&S Overview Financials Developments Strategic Outlook
      14.4.6. Hamni Overview Financials Developments Strategic Outlook
      14.4.7. AMICRA Microtechnologies Overview Financials Developments Strategic Outlook
      14.4.8. SET Overview Financials Developments Strategic Outlook
      14.4.9. Athlete FA Overview Financials Developments Strategic Outlook
      14.4.10. COMPANY 10 Overview Financials Developments Strategic Outlook
      14.4.11. COMPANY 11 Overview Financials Developments Strategic Outlook
      14.4.12. COMPANY 12 Overview Financials Developments Strategic Outlook
      14.4.13. COMPANY 13 Overview Financials Developments Strategic Outlook
      14.4.14. COMPANY 14 Overview Financials Developments Strategic Outlook
      14.4.15. COMPANY 15 Overview Financials Developments Strategic Outlook
      14.4.16. COMPANY 16 Overview Financials Developments Strategic Outlook
      14.4.17. COMPANY 17 Overview Financials Developments Strategic Outlook
      14.4.18. COMPANY 18 Overview Financials Developments Strategic Outlook
      14.4.19. COMPANY 19 Overview Financials Developments Strategic Outlook
      14.4.20. COMPANY 20 Overview Financials Developments Strategic Outlook

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