Market Overview:
The global 2.5D and 3D TSV market is expected to grow at a CAGR of XX% during the forecast period 2018-2030. The market growth can be attributed to the increasing demand for miniaturization and higher performance in electronic devices. In terms of packaging type, the 2.5D TSV segment is expected to grow at a CAGR of XX% during the forecast period, while the 3D TSV segment is expected to grow at a CAGR of XX%. In terms of application, mobile and consumer electronics are anticipated to hold majority share in terms of revenue contribution by 2030 end; however, communication equipment, automotive and transportation electronics are also projected to witness significant growth over the forecast period.
Product Definition:
2.5D TSV is a type of through silicon vias that has a height of two-and-a-half times the width of its diameter. 3D TSV is a type of through silicon vias that has a height and width greater than its diameter. The importance of 2.5D and 3D TSV is that they provide an efficient way to route signals between different levels in three dimensions, which can improve performance and reduce costs.
Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027:
Global 2.5D and 3D TSV market was valued at USD 1,236.0 million in 2020 and is expected to grow at a compound annual growth rate (CAGR) of 11.8% from 2021 to 2027.
2.5D TSV:
2.5D TSV is a technology that uses 2.5D imaging to create 3-dimensional image from two dimensional camera feed, which gives the appearance of depth to the image. It creates an illusion of volume and offers a unique viewing experience by creating the feeling of being inside the video game or animation when watching it on a big screen TV at home or in cinema halls.
Application Insights:
The global 2.5D and 3D TSV market has been segmented on the basis of application into mobile and consumer electronics, communication equipment, automotive and transportation electronics, other applications including medical equipment, industrial machinery/process control systems etc., The other applications segment is expected to witness significant growth over the forecast period owing to increasing demand for electronic devices in various end-use industries such as healthcare, consumer appliances etc.
Global 2.5 DTSVs accounted for a revenue share of more than 40% in 2017 owing to their rising use across several end-use industries such as automotive & transportation electronics where they are used in infotainment systems or navigation systems among others which include safety & security system integration along with medical equipment integration using Global Positioning Systems (GPS).
Regional Analysis:
Asia Pacific dominated the global 2.5D and 3D TSV market in 2016, accounting for a revenue share of over 40%. The region is expected to continue its dominance over the forecast period owing to increasing demand from end-use industries such as automotive, consumer electronics, medical equipment and mobile phones. Furthermore, rising disposable income coupled with growing penetration of high-tech gadgets in emerging economies such as China and India are anticipated to drive regional growth during the forecast period.
The Asia Pacific region is also projected to witness significant growth due to technological advancements that have been made possible by new manufacturing processes introduced by companies such as IBM Corporation; Intel Corporation; Samsung Electronics Co., Ltd.; Panasonic Corporation; Medtronic plc.; ASYS Corp.; Fujifilm Holdings Corp., among others.
Growth Factors:
- Increased demand for miniaturization in electronics
- Development of new 3D IC technologies
- Proliferation of TSV-enabled devices
- Growing number of applications that require high performance and low power consumption
- Advances in packaging and assembly technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
2.5D and 3D TSV Market Research Report
By Type
Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027, 2.5D TSV, 3D TSV
By Application
Mobile and Consumer Electronics, Communication Equipment, Automotive and Transportation Electronics, Other
By Companies
Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC, SK Hynix, Shinko, Unimicron, Fujitsu Interconnect, Xperi
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
200
Number of Tables & Figures
140
Customization Available
Yes, the report can be customized as per your need.
Global 2.5D and 3D TSV Market Report Segments:
The global 2.5D and 3D TSV market is segmented on the basis of:
Types
Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027, 2.5D TSV, 3D TSV
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Mobile and Consumer Electronics, Communication Equipment, Automotive and Transportation Electronics, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Samsung
- Intel
- ASE Group
- GlobalFoundries
- Amkor Technology
- Micron Technology
- TSMC
- UMC
- SK Hynix
- Shinko
- Unimicron
- Fujitsu Interconnect
- Xperi
Highlights of The 2.5D and 3D TSV Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
- 2.5D TSV
- 3D TSV
- By Application:
- Mobile and Consumer Electronics
- Communication Equipment
- Automotive and Transportation Electronics
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 2.5D and 3D TSV Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
2.5D TSV is a two-dimensional time series that can be viewed as a stacked bar chart, while 3D TSV is a three-dimensional time series that can be viewed as an exploded graph.
Some of the key players operating in the 2.5d and 3d tsv market are Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC, SK Hynix, Shinko, Unimicron, Fujitsu Interconnect, Xperi.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 2.5D and 3D TSV Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 2.5D and 3D TSV Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 2.5D and 3D TSV Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 2.5D and 3D TSV Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 2.5D and 3D TSV Market Size & Forecast, 2018-2028
4.5.1 2.5D and 3D TSV Market Size and Y-o-Y Growth
4.5.2 2.5D and 3D TSV Market Absolute $ Opportunity
Chapter 5 Global 2.5D and 3D TSV Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 2.5D and 3D TSV Market Size Forecast by Type
5.2.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
5.2.2 2.5D TSV
5.2.3 3D TSV
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 2.5D and 3D TSV Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 2.5D and 3D TSV Market Size Forecast by Applications
6.2.1 Mobile and Consumer Electronics
6.2.2 Communication Equipment
6.2.3 Automotive and Transportation Electronics
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 2.5D and 3D TSV Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 2.5D and 3D TSV Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America 2.5D and 3D TSV Analysis and Forecast
9.1 Introduction
9.2 North America 2.5D and 3D TSV Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America 2.5D and 3D TSV Market Size Forecast by Type
9.6.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
9.6.2 2.5D TSV
9.6.3 3D TSV
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America 2.5D and 3D TSV Market Size Forecast by Applications
9.10.1 Mobile and Consumer Electronics
9.10.2 Communication Equipment
9.10.3 Automotive and Transportation Electronics
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe 2.5D and 3D TSV Analysis and Forecast
10.1 Introduction
10.2 Europe 2.5D and 3D TSV Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe 2.5D and 3D TSV Market Size Forecast by Type
10.6.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
10.6.2 2.5D TSV
10.6.3 3D TSV
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe 2.5D and 3D TSV Market Size Forecast by Applications
10.10.1 Mobile and Consumer Electronics
10.10.2 Communication Equipment
10.10.3 Automotive and Transportation Electronics
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific 2.5D and 3D TSV Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific 2.5D and 3D TSV Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific 2.5D and 3D TSV Market Size Forecast by Type
11.6.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
11.6.2 2.5D TSV
11.6.3 3D TSV
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific 2.5D and 3D TSV Market Size Forecast by Applications
11.10.1 Mobile and Consumer Electronics
11.10.2 Communication Equipment
11.10.3 Automotive and Transportation Electronics
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America 2.5D and 3D TSV Analysis and Forecast
12.1 Introduction
12.2 Latin America 2.5D and 3D TSV Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America 2.5D and 3D TSV Market Size Forecast by Type
12.6.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
12.6.2 2.5D TSV
12.6.3 3D TSV
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America 2.5D and 3D TSV Market Size Forecast by Applications
12.10.1 Mobile and Consumer Electronics
12.10.2 Communication Equipment
12.10.3 Automotive and Transportation Electronics
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) 2.5D and 3D TSV Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) 2.5D and 3D TSV Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) 2.5D and 3D TSV Market Size Forecast by Type
13.6.1 Global 2.5D and 3D TSV Market Size Growth Rate by Packaging Type: 2016 VS 2021 VS 2027
13.6.2 2.5D TSV
13.6.3 3D TSV
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) 2.5D and 3D TSV Market Size Forecast by Applications
13.10.1 Mobile and Consumer Electronics
13.10.2 Communication Equipment
13.10.3 Automotive and Transportation Electronics
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 2.5D and 3D TSV Market: Competitive Dashboard
14.2 Global 2.5D and 3D TSV Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Samsung
14.3.2 Intel
14.3.3 ASE Group
14.3.4 GlobalFoundries
14.3.5 Amkor Technology
14.3.6 Micron Technology
14.3.7 TSMC
14.3.8 UMC
14.3.9 SK Hynix
14.3.10 Shinko
14.3.11 Unimicron
14.3.12 Fujitsu Interconnect
14.3.13 Xperi
