Market Overview:
The global 2.5D interposer market is expected to grow at a CAGR of 9.8% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for advanced packaging solutions in various applications, such as CIS, CPU/GPU, MEMS 3D capping interposer, RF devices (IPD and filtering), logic SoC (APE and BB/APE), ASIC/FPGA and high power LED. In terms of type, the silicon segment is expected to hold the largest share of the global 2.5D interposer market during the forecast period.
Product Definition:
A 2.5D interposer is a type of semiconductor device that helps to connect two or more integrated circuits (ICs) together. This type of interposer features two levels of metal conductors, which allows for the transfer of signals and power between the ICs. 2.5D interposers are often used in smartphones and other mobile devices, as they can help to improve performance and reduce power consumption.
Silicon:
Silicon is a semiconductor material with the formula Si and is one of the alkali earth metals. Silicon has different forms including silicon dioxide, single-crystal, poly-crystalline and amorphous silica. The most common form of silicon used in integrated circuits (IC) applications is polycrystalline or monocrystalline grade which has high electrical efficiency along with low power consumption properties.
Organic and Glass:
The organic and glass market is expected to grow at a significant rate owing to the increasing demand for high-performance 2.5D interposers in the global market. The growth of this industry can be attributed to its properties such as low cost, flexibility, transparency, and robustness among others.
Organic materials are gaining importance on account of their ability to form transparent layers over an optical substrate which can be used in various applications including light guide panels.
Application Insights:
The 2.5D interposer market is segmented based on application into Central Processing Unit (CPU), graphics processing unit (GPU), MEMS, RF devices, logic SoC and high power LED. The CPU/GPU segment dominated the overall industry in terms of revenue share in 2017 owing to the increasing demand for graphic cards from various end-use industries such as gaming and virtual reality. Moreover, with the rapid development of artificial intelligence and machine learning applications across different industry verticals such as healthcare, automotive & transportation etc., there has been a significant increase in demand for advanced semiconductor components that can deliver enhanced performance over traditional integrated circuits.
Regional Analysis:
The 2.5D interposer market in North America is expected to grow at a significant rate over the forecast period owing to the presence of major players such as Maxim Integrated Products Inc.; Texas Instruments Inc.; and On Semiconductor, LLC. The U.S.-based companies are focusing on developing cost-effective products for various applications including IoT, automotive electronics, consumer electronics and networking devices among others by leveraging their extensive experience in designing semiconductor intellectual property (IP).
Asia Pacific region is projected to witness exponential growth over the forecast period owing to rising demand for low-power consuming digital devices along with an increase in investments from key industry players such as Qualcomm Technologies Inc., Samsung Electronics Co., Ltd; MediaTek Inc.; Broadcom Limited; and Huawei Technologies Co., Ltd. These companies are focusing on expanding their product portfolio covering various application areas including networking & communication (NIC), display & imaging, energy management/efficiency among others by investing heavily in research & development activities.
Growth Factors:
- Increased demand for miniaturization in electronics: The need for smaller, more powerful devices is driving the market for 2.5D interposers. As electronic devices get smaller, the need for an efficient and reliable way to connect multiple components increases. 2.5D interposers provide a compact and efficient way to do this, making them ideal for use in miniaturized electronics devices.
- Increased demand for advanced packaging technologies: As semiconductor technology advances, so does the demand for more advanced packaging technologies like 2.5D interposers. With their ability to connect multiple components in a small space, 2.5D interposers are well-suited to meet the needs of today’s increasingly complex semiconductor designs.
Scope Of The Report
Report Attributes
Report Details
Report Title
2.5D Interposer Market Research Report
By Type
Silicon, Organic and Glass
By Application
CIS, CPU/GPU, MEMS 3D Capping Interposer, RF Devices (IPD, Filtering), Logic SoC (APE, BB/APE), ASIC/FPGA, High Power LED (3D Silicon Substrate)
By Companies
Murata, Tezzaron, Xilinx, AGC Electronics, TSMC, UMC, Plan Optik AG, Amkor, IMT, ALLVIA, Inc
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
192
Number of Tables & Figures
135
Customization Available
Yes, the report can be customized as per your need.
Global 2.5D Interposer Market Report Segments:
The global 2.5D Interposer market is segmented on the basis of:
Types
Silicon, Organic and Glass
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
CIS, CPU/GPU, MEMS 3D Capping Interposer, RF Devices (IPD, Filtering), Logic SoC (APE, BB/APE), ASIC/FPGA, High Power LED (3D Silicon Substrate)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Murata
- Tezzaron
- Xilinx
- AGC Electronics
- TSMC
- UMC
- Plan Optik AG
- Amkor
- IMT
- ALLVIA, Inc
Highlights of The 2.5D Interposer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicon
- Organic and Glass
- By Application:
- CIS
- CPU/GPU
- MEMS 3D Capping Interposer
- RF Devices (IPD, Filtering)
- Logic SoC (APE, BB/APE)
- ASIC/FPGA
- High Power LED (3D Silicon Substrate)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 2.5D Interposer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A 2.5D interposer is a type of semiconductor device that can be used to create three-dimensional (3D) circuits on a flat surface. This technology allows for the creation of complex 3D structures and circuitry without the need for additional layers or components.
Some of the key players operating in the 2.5d interposer market are Murata, Tezzaron, Xilinx, AGC Electronics, TSMC, UMC, Plan Optik AG, Amkor, IMT, ALLVIA, Inc.
The 2.5d interposer market is expected to grow at a compound annual growth rate of 9.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 2.5D Interposer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 2.5D Interposer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 2.5D Interposer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 2.5D Interposer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 2.5D Interposer Market Size & Forecast, 2018-2028
4.5.1 2.5D Interposer Market Size and Y-o-Y Growth
4.5.2 2.5D Interposer Market Absolute $ Opportunity
Chapter 5 Global 2.5D Interposer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 2.5D Interposer Market Size Forecast by Type
5.2.1 Silicon
5.2.2 Organic and Glass
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 2.5D Interposer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 2.5D Interposer Market Size Forecast by Applications
6.2.1 CIS
6.2.2 CPU/GPU
6.2.3 MEMS 3D Capping Interposer
6.2.4 RF Devices (IPD
6.2.5 Filtering)
6.2.6 Logic SoC (APE
6.2.7 BB/APE)
6.2.8 ASIC/FPGA
6.2.9 High Power LED (3D Silicon Substrate)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 2.5D Interposer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 2.5D Interposer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America 2.5D Interposer Analysis and Forecast
9.1 Introduction
9.2 North America 2.5D Interposer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America 2.5D Interposer Market Size Forecast by Type
9.6.1 Silicon
9.6.2 Organic and Glass
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America 2.5D Interposer Market Size Forecast by Applications
9.10.1 CIS
9.10.2 CPU/GPU
9.10.3 MEMS 3D Capping Interposer
9.10.4 RF Devices (IPD
9.10.5 Filtering)
9.10.6 Logic SoC (APE
9.10.7 BB/APE)
9.10.8 ASIC/FPGA
9.10.9 High Power LED (3D Silicon Substrate)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe 2.5D Interposer Analysis and Forecast
10.1 Introduction
10.2 Europe 2.5D Interposer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe 2.5D Interposer Market Size Forecast by Type
10.6.1 Silicon
10.6.2 Organic and Glass
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe 2.5D Interposer Market Size Forecast by Applications
10.10.1 CIS
10.10.2 CPU/GPU
10.10.3 MEMS 3D Capping Interposer
10.10.4 RF Devices (IPD
10.10.5 Filtering)
10.10.6 Logic SoC (APE
10.10.7 BB/APE)
10.10.8 ASIC/FPGA
10.10.9 High Power LED (3D Silicon Substrate)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific 2.5D Interposer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific 2.5D Interposer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific 2.5D Interposer Market Size Forecast by Type
11.6.1 Silicon
11.6.2 Organic and Glass
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific 2.5D Interposer Market Size Forecast by Applications
11.10.1 CIS
11.10.2 CPU/GPU
11.10.3 MEMS 3D Capping Interposer
11.10.4 RF Devices (IPD
11.10.5 Filtering)
11.10.6 Logic SoC (APE
11.10.7 BB/APE)
11.10.8 ASIC/FPGA
11.10.9 High Power LED (3D Silicon Substrate)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America 2.5D Interposer Analysis and Forecast
12.1 Introduction
12.2 Latin America 2.5D Interposer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America 2.5D Interposer Market Size Forecast by Type
12.6.1 Silicon
12.6.2 Organic and Glass
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America 2.5D Interposer Market Size Forecast by Applications
12.10.1 CIS
12.10.2 CPU/GPU
12.10.3 MEMS 3D Capping Interposer
12.10.4 RF Devices (IPD
12.10.5 Filtering)
12.10.6 Logic SoC (APE
12.10.7 BB/APE)
12.10.8 ASIC/FPGA
12.10.9 High Power LED (3D Silicon Substrate)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) 2.5D Interposer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) 2.5D Interposer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) 2.5D Interposer Market Size Forecast by Type
13.6.1 Silicon
13.6.2 Organic and Glass
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) 2.5D Interposer Market Size Forecast by Applications
13.10.1 CIS
13.10.2 CPU/GPU
13.10.3 MEMS 3D Capping Interposer
13.10.4 RF Devices (IPD
13.10.5 Filtering)
13.10.6 Logic SoC (APE
13.10.7 BB/APE)
13.10.8 ASIC/FPGA
13.10.9 High Power LED (3D Silicon Substrate)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 2.5D Interposer Market: Competitive Dashboard
14.2 Global 2.5D Interposer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Murata
14.3.2 Tezzaron
14.3.3 Xilinx
14.3.4 AGC Electronics
14.3.5 TSMC
14.3.6 UMC
14.3.7 Plan Optik AG
14.3.8 Amkor
14.3.9 IMT
14.3.10 ALLVIA, Inc
