Market Overview:
The global 3D flip chip market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising demand for 3D ICs in automotive and transport applications, and growing adoption of lead-free solder alloys. Based on type, the global 3D flip chip market is segmented into copper pillar bumping, solder bumping (solder ball), tin-lead eutectic solder bumping, lead-free solder bumping, gold bumped flip chips, and others (including carbon nanotubes). Solder bumping is the most commonly used technology for Flip Chip Assembly (FCA) due to its low cost and high yield. However, with the increasing demand for miniaturization and higher performance in electronic devices, copper pillar bumps are gaining popularity as they offer better electrical performance than traditional solder bumps.
Product Definition:
3D FlipChip is an interconnection technology between integrated circuits. It is a three-dimensional package that allows chip stacking and higher densities by connecting through the use of bumps that protrude from the surface of one chip and make contact with corresponding bumps on another. This eliminates the need for wire bonding, which can reduce package size, weight, and manufacturing costs.
Copper Pillar:
Copper pillar is a device that is used in the packaging of integrated circuits (IC) and it helps in preventing damage due to Electrostatic Dissipation (ESD). It also provides mechanical stability to the IC during handling and shipping. The primary function of copper pillar 3D Flip Chip Market is to protect the sensitive components from ESD, which can be caused by static electricity or electrostatic discharge.
Solder Bumping:
Solder bumping is a process of adding extra legs to the solder joints which are normally made during the production of integrated circuits. The technique is used in Flip Chip Technology (FCT) and involves making contact between pads on two substrates with no additional wire or tracks. It helps in increasing the reliability and yield by enabling better placement of devices on circuit boards, thus resulting into lesser number of defects.
Application Insights:
The electronics segment accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The increasing demand for consumer electronics, such as smartphones and tablets, is anticipated to drive the growth of this application segment. Furthermore, technological advancements in electronic devices are expected to fuel their demand further. Flip chip solder technology has enabled high-speed data transfer through small copper traces on PCBs that were not possible earlier due to limitations imposed by traditional soldering techniques. This factor is likely to boost product adoption across various electronic applications during the forecast period.
Regional Analysis:
Asia Pacific region is anticipated to witness significant growth over the forecast period owing to the presence of a large number of electronic device manufacturers in China and Taiwan. The Asia Pacific region accounted for more than 35% revenue share in 2016 and is expected to grow at a CAGR exceeding 13% from 2017 to 2030. This can be attributed primarily to rising demand for consumer electronics, IT & telecom equipment, automotive electronics, power management devices among others.
The North America market was valued at USD X billion in 2016 and is projected to grow significantly over the forecast period owing its high level of technological advancement coupled with growing investments by major players on developing advanced 3D flip chip technologies that are compatible with higher speeds.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Growing popularity of 3D printing technology
- Rising demand for advanced packaging solutions in semiconductor and electronics industries
- Proliferation of next-generation applications that require high performance and low power consumption
- Emergence of new market players
Scope Of The Report
Report Attributes
Report Details
Report Title
3D Flip Chip Market Research Report
By Type
Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, Others
By Application
Electronics, Industrial, Automotive and Transport, Healthcare, Others
By Companies
TSMC, Samsung, ASE Group, Amkor Technology, UMC, STATS ChipPAC, STMicroelectronics, Advanced Micro Devices, International Business Machines Corporation, Intel Corporation, Texas Instruments Incorporated
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
231
Number of Tables & Figures
162
Customization Available
Yes, the report can be customized as per your need.
Global 3D Flip Chip Market Report Segments:
The global 3D Flip Chip market is segmented on the basis of:
Types
Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Industrial, Automotive and Transport, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TSMC
- Samsung
- ASE Group
- Amkor Technology
- UMC
- STATS ChipPAC
- STMicroelectronics
- Advanced Micro Devices
- International Business Machines Corporation
- Intel Corporation
- Texas Instruments Incorporated
Highlights of The 3D Flip Chip Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Copper Pillar
- Solder Bumping
- Tin-lead eutectic Solder
- Lead-free Solder
- Gold Bumping
- Others
- By Application:
- Electronics
- Industrial
- Automotive and Transport
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 3D Flip Chip Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A 3D Flip Chip is a type of chip that can be flipped over to reveal a different surface. This allows for more complex designs and circuitry, as well as increased performance.
Some of the major players in the 3d flip chip market are TSMC, Samsung, ASE Group, Amkor Technology, UMC, STATS ChipPAC, STMicroelectronics, Advanced Micro Devices, International Business Machines Corporation, Intel Corporation, Texas Instruments Incorporated.
The 3d flip chip market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D Flip Chip Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D Flip Chip Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D Flip Chip Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D Flip Chip Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D Flip Chip Market Size & Forecast, 2020-2028
4.5.1 3D Flip Chip Market Size and Y-o-Y Growth
4.5.2 3D Flip Chip Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Copper Pillar
5.2.2 Solder Bumping
5.2.3 Tin-lead eutectic Solder
5.2.4 Lead-free Solder
5.2.5 Gold Bumping
5.2.6 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 Industrial
6.2.3 Automotive and Transport
6.2.4 Healthcare
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 3D Flip Chip Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 3D Flip Chip Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Copper Pillar
9.6.2 Solder Bumping
9.6.3 Tin-lead eutectic Solder
9.6.4 Lead-free Solder
9.6.5 Gold Bumping
9.6.6 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 Industrial
9.10.3 Automotive and Transport
9.10.4 Healthcare
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Copper Pillar
10.6.2 Solder Bumping
10.6.3 Tin-lead eutectic Solder
10.6.4 Lead-free Solder
10.6.5 Gold Bumping
10.6.6 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 Industrial
10.10.3 Automotive and Transport
10.10.4 Healthcare
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Copper Pillar
11.6.2 Solder Bumping
11.6.3 Tin-lead eutectic Solder
11.6.4 Lead-free Solder
11.6.5 Gold Bumping
11.6.6 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 Industrial
11.10.3 Automotive and Transport
11.10.4 Healthcare
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Copper Pillar
12.6.2 Solder Bumping
12.6.3 Tin-lead eutectic Solder
12.6.4 Lead-free Solder
12.6.5 Gold Bumping
12.6.6 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 Industrial
12.10.3 Automotive and Transport
12.10.4 Healthcare
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Copper Pillar
13.6.2 Solder Bumping
13.6.3 Tin-lead eutectic Solder
13.6.4 Lead-free Solder
13.6.5 Gold Bumping
13.6.6 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 Industrial
13.10.3 Automotive and Transport
13.10.4 Healthcare
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 3D Flip Chip Market: Competitive Dashboard
14.2 Global 3D Flip Chip Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 TSMC
14.3.2 Samsung
14.3.3 ASE Group
14.3.4 Amkor Technology
14.3.5 UMC
14.3.6 STATS ChipPAC
14.3.7 STMicroelectronics
14.3.8 Advanced Micro Devices
14.3.9 International Business Machines Corporation
14.3.10 Intel Corporation
14.3.11 Texas Instruments Incorporated
