Market Overview:
The global 3D interposer market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for 3D ICs in various applications such as CIS, CPU/GPU, MEMS 3D capping interposer, RF devices (IPD, filtering), logic SoC (APE, BB/APE), ASIC/FPGA and high power LED. Silicon-based 3D interposers are expected to hold a major share of the market during the forecast period owing to their advantages such as low cost and high performance.
Product Definition:
A 3D interposer is a semiconductor device that provides a three-dimensional pathway for electrical signals between integrated circuits (ICs). The use of a 3D interposer can improve the performance and density of electronic systems by allowing multiple ICs to be interconnected in close proximity.
Silicon:
Silicon is a semiconductor material with the formula Si and is a member of the group of metals called trivalent metals. Silicon possesses properties such as high thermal conductivity, electrical conductivity, and heat-absorbing capacity. These properties have made silicon into an essential material in modern electronics including integrated circuits (IC) which are present in most electronic devices ranging from computers to televisions.
Organic and Glass:
The organic and glass market is expected to witness significant growth over the forecast period owing to its increasing demand in 3D interposer applications. Organic and glass are key materials used for manufacturing 3D interposers. The major application of these products includes optical components, MEMS devices, solar cells, LCD displays among others.
Application Insights:
The market is segmented based on application into consumer electronics, communication & networking, semiconductor and other. The consumer electronics segment held the largest share in 2017 owing to the increasing demand for smartphones and wearable devices. The growing adoption of 3D Interposer in smart glasses is expected to drive growth over the forecast period.
The communication & networking sector is anticipated to be one of the fastest-growing segments over the forecast period owing to extensive use of 3D Interposer in wireless routers, base stations and optical fiber cables among others. Moreover, high performance processing capabilities offered by 3D Interposers make them suitable for large scale projects such as 5G network architecture development which requires high speed data transfer at low costs.
Regional Analysis:
The Asia Pacific region is anticipated to witness significant growth over the forecast period owing to the presence of a large number of semiconductor manufacturers in China, Taiwan and South Korea. The increasing demand for consumer electronics products such as smartphones and laptops coupled with rising investments by various governments in infrastructure development is expected to drive the regional market growth.
The Latin American region accounted for a revenue share of 15.9% in 2017 owing to an increase in spending on defense & aerospace equipment along with other industrial applications including medical devices, automotive etc., which are driving product demand across this region. Moreover, growing research & development activities by educational institutions are expected to fuel market growth over the forecast period. Increasing government initiatives towards manufacturing shift toward 3D printed components due to their advantages such as reduced weight and volume are further fueling industry expansion across this region thus far into 2018; however there exists considerable scope for improvement that can be attributed primarily or exclusively 3D interposer technology itself (ease-of-use).
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The need for smaller and faster electronic devices is driving the demand for 3D interposers. As the size of semiconductor chips decreases, the use of 3D interposers becomes increasingly important to achieve higher performance and packing density.
- Proliferation of advanced packaging technologies: 3D ICs and 2.5D ICs are two examples of advanced packaging technologies that are driving the growth of the 3D interposer market. These technologies require high-quality 3D interposers to achieve optimum performance levels.
- Growing number of applications: The growing number of applications that require high-performance semiconductors is fueling demand for 3D Interposers market worldwide . Some key application areas include smartphones, tablets, laptops, data centers, automotive electronics, medical devices etcetera .
Scope Of The Report
Report Attributes
Report Details
Report Title
3D Interposer Market Research Report
By Type
Silicon, Organic and Glass
By Application
CIS, CPU/GPU, MEMS 3D Capping Interposer, RF Devices (IPD, Filtering), Logic SoC (APE, BB/APE), ASIC/FPGA, High Power LED (3D Silicon Substrate)
By Companies
Murata, Tezzaron, Xilinx, AGC Electronics, TSMC, UMC, Plan Optik AG, Amkor, IMT, ALLVIA, Inc
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
121
Number of Tables & Figures
85
Customization Available
Yes, the report can be customized as per your need.
Global 3D Interposer Market Report Segments:
The global 3D Interposer market is segmented on the basis of:
Types
Silicon, Organic and Glass
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
CIS, CPU/GPU, MEMS 3D Capping Interposer, RF Devices (IPD, Filtering), Logic SoC (APE, BB/APE), ASIC/FPGA, High Power LED (3D Silicon Substrate)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Murata
- Tezzaron
- Xilinx
- AGC Electronics
- TSMC
- UMC
- Plan Optik AG
- Amkor
- IMT
- ALLVIA, Inc
Highlights of The 3D Interposer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicon
- Organic and Glass
- By Application:
- CIS
- CPU/GPU
- MEMS 3D Capping Interposer
- RF Devices (IPD, Filtering)
- Logic SoC (APE, BB/APE)
- ASIC/FPGA
- High Power LED (3D Silicon Substrate)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 3D Interposer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
3D Interposer is a 3D printing technology that uses multiple filaments to create an object from multiple layers.
Some of the key players operating in the 3d interposer market are Murata, Tezzaron, Xilinx, AGC Electronics, TSMC, UMC, Plan Optik AG, Amkor, IMT, ALLVIA, Inc.
The 3d interposer market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D Interposer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D Interposer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D Interposer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D Interposer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D Interposer Market Size & Forecast, 2018-2028
4.5.1 3D Interposer Market Size and Y-o-Y Growth
4.5.2 3D Interposer Market Absolute $ Opportunity
Chapter 5 Global 3D Interposer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 3D Interposer Market Size Forecast by Type
5.2.1 Silicon
5.2.2 Organic and Glass
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 3D Interposer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 3D Interposer Market Size Forecast by Applications
6.2.1 CIS
6.2.2 CPU/GPU
6.2.3 MEMS 3D Capping Interposer
6.2.4 RF Devices (IPD
6.2.5 Filtering)
6.2.6 Logic SoC (APE
6.2.7 BB/APE)
6.2.8 ASIC/FPGA
6.2.9 High Power LED (3D Silicon Substrate)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 3D Interposer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 3D Interposer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America 3D Interposer Analysis and Forecast
9.1 Introduction
9.2 North America 3D Interposer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America 3D Interposer Market Size Forecast by Type
9.6.1 Silicon
9.6.2 Organic and Glass
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America 3D Interposer Market Size Forecast by Applications
9.10.1 CIS
9.10.2 CPU/GPU
9.10.3 MEMS 3D Capping Interposer
9.10.4 RF Devices (IPD
9.10.5 Filtering)
9.10.6 Logic SoC (APE
9.10.7 BB/APE)
9.10.8 ASIC/FPGA
9.10.9 High Power LED (3D Silicon Substrate)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe 3D Interposer Analysis and Forecast
10.1 Introduction
10.2 Europe 3D Interposer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe 3D Interposer Market Size Forecast by Type
10.6.1 Silicon
10.6.2 Organic and Glass
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe 3D Interposer Market Size Forecast by Applications
10.10.1 CIS
10.10.2 CPU/GPU
10.10.3 MEMS 3D Capping Interposer
10.10.4 RF Devices (IPD
10.10.5 Filtering)
10.10.6 Logic SoC (APE
10.10.7 BB/APE)
10.10.8 ASIC/FPGA
10.10.9 High Power LED (3D Silicon Substrate)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific 3D Interposer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific 3D Interposer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific 3D Interposer Market Size Forecast by Type
11.6.1 Silicon
11.6.2 Organic and Glass
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific 3D Interposer Market Size Forecast by Applications
11.10.1 CIS
11.10.2 CPU/GPU
11.10.3 MEMS 3D Capping Interposer
11.10.4 RF Devices (IPD
11.10.5 Filtering)
11.10.6 Logic SoC (APE
11.10.7 BB/APE)
11.10.8 ASIC/FPGA
11.10.9 High Power LED (3D Silicon Substrate)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America 3D Interposer Analysis and Forecast
12.1 Introduction
12.2 Latin America 3D Interposer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America 3D Interposer Market Size Forecast by Type
12.6.1 Silicon
12.6.2 Organic and Glass
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America 3D Interposer Market Size Forecast by Applications
12.10.1 CIS
12.10.2 CPU/GPU
12.10.3 MEMS 3D Capping Interposer
12.10.4 RF Devices (IPD
12.10.5 Filtering)
12.10.6 Logic SoC (APE
12.10.7 BB/APE)
12.10.8 ASIC/FPGA
12.10.9 High Power LED (3D Silicon Substrate)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) 3D Interposer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) 3D Interposer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) 3D Interposer Market Size Forecast by Type
13.6.1 Silicon
13.6.2 Organic and Glass
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) 3D Interposer Market Size Forecast by Applications
13.10.1 CIS
13.10.2 CPU/GPU
13.10.3 MEMS 3D Capping Interposer
13.10.4 RF Devices (IPD
13.10.5 Filtering)
13.10.6 Logic SoC (APE
13.10.7 BB/APE)
13.10.8 ASIC/FPGA
13.10.9 High Power LED (3D Silicon Substrate)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 3D Interposer Market: Competitive Dashboard
14.2 Global 3D Interposer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Murata
14.3.2 Tezzaron
14.3.3 Xilinx
14.3.4 AGC Electronics
14.3.5 TSMC
14.3.6 UMC
14.3.7 Plan Optik AG
14.3.8 Amkor
14.3.9 IMT
14.3.10 ALLVIA, Inc
