Market Overview:
The global 5G chip packaging market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for 5G chipsets across different applications, such as automotive, computer, communication, LED lighting and medical devices. In addition, the growing trend of miniaturization is also contributing towards the growth of this market. Based on type, the global 5G chip packaging market can be segmented into DIP (dual in-line package), PGA (pin grid array), BGA (ball grid array), CSP (chip scale package), 3.0 DIC (3D integrated circuit) and FO SIP (flip-chip on silicon substrate). Among these types, BGA packages are expected to witness highest growth during the forecast period owing to their advantages such as high packing density and low thermal resistance. Based on application, the global 5G chip packaging market can be segmented into automotive electronics, computers & peripherals electronics , communications equipment , LED lighting fixtures , medical devices and other applications . The automotive electronics segment is projected to account for highest share in terms of revenue in 2018 followed by computers & peripherals electronics . This can be attributed to increasing demand for advanced electronic systems in automobiles across different regions worldwide.
Product Definition:
5G chip packaging is a technology that is used to protect and house electronic components, such as microchips. It is made up of multiple layers of materials that are designed to keep the chips safe from damage and also protect them from moisture, dust, and other elements. 5G chip packaging is important because it helps to ensure the safety and longevity of the chips.
DIP:
DIP, or die in place, is a technology where the dies are placed into an SOP package and then the package is put into a plastic tray that has been pre-filled with silicon wafers. The whole assembly is then lowered into an oven which causes the trays to fill with silicon and upon cooling, out comes a completed DIP semiconductor device.
PGA:
PGA (Plastic Greening Additives) is a family of additives that are primarily used to impart color and enhance the quality of plastic. PGA has been traditionally used as an additive in PVC, PE, PP, PS and other such polymers. However, owing to their enhanced properties such as high heat resistance & low moisture absorption; PGA based plastics have found increased application scope in electronics packaging materials including SDRAM modules & micro-chips.
Application Insights:
The communications segment accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growing demand for 5G chips from mobile network operators as they prepare their infrastructure for 2020s and 2030s is expected to drive growth. The introduction of new technologies such as millimeter-wave (MMW) and high-speed packet access (HSPA) are anticipated to fuel industry expansion over the forecast period.
5G chip packaging has several benefits including improved signal reception, increased data transfer speed, reduced power consumption, enhanced battery life on smartphones along with other technological advancements that will enable a connected world. These advantages have led to an increase in demand across various application segments including LED lighting, medical devices & equipment among others which are estimated to grow at a significant rate during the forecast period leading up to 2030 when compared with 2018 estimates.
Regional Analysis:
North America dominated the global 5G chip packaging market in terms of revenue share and is expected to continue its dominance over the forecast period. The region has witnessed a significant increase in demand for smartphones, tablets, personal computers (PCs) and other consumer electronics products. This growth can be attributed to increasing internet usage, high-speed wireless connectivity offered by 5G network infrastructure along with advancements in networking technologies such as Massive MIMO (Multiple Input Multiple Output), which will further boost data speeds across next-generation networks.
The Asia Pacific regional market is anticipated to grow at a lucrative CAGR over the forecast period owing to rapid developments taking place across several sectors including automotive, healthcare & life sciences, manufacturing industries among others that require advanced technology platforms based on next-generation mobile communication systems such as 5G network infrastructure. Moreover investments made by key players for research & development activities are also driving industry expansion within this region. For instance; In November 2017; Qualcomm Inc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of Internet of Things (IoT) and connected devices
- Rising demand for high-speed and low-latency wireless communication
- Growing trend of advanced packaging technologies such as 3D ICs and 2.5D/3D integration
- Emergence of new applications that require higher bandwidth and data throughput
Scope Of The Report
Report Attributes
Report Details
Report Title
5G Chip Packaging Market Research Report
By Type
DIP, PGA, BGA, CSP, 3.0 DIC, FO SIP, WLP, WLCSP, Filp Chip
By Application
Automotives, Computers, Communications, LED, Medical, Others
By Companies
ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa, NEPES, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, Tongfu Microelectronics Co., Ltd.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
146
Number of Tables & Figures
103
Customization Available
Yes, the report can be customized as per your need.
Global 5G Chip Packaging Market Report Segments:
The global 5G Chip Packaging market is segmented on the basis of:
Types
DIP, PGA, BGA, CSP, 3.0 DIC, FO SIP, WLP, WLCSP, Filp Chip
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotives, Computers, Communications, LED, Medical, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE
- Amkor
- SPIL
- Stats Chippac
- PTI
- JCET
- J-Devices
- UTAC
- Chipmos
- Chipbond
- STS
- Huatian
- NFM
- Carsem
- Walton
- Unisem
- OSE
- AOI
- Formosa
- NEPES
- Powertech Technology Inc.
- Tianshui Huatian Technology Co., LTD
- Tongfu Microelectronics Co., Ltd.
Highlights of The 5G Chip Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- DIP
- PGA
- BGA
- CSP
- 3.0 DIC
- FO SIP
- WLP
- WLCSP
- Filp Chip
- By Application:
- Automotives
- Computers
- Communications
- LED
- Medical
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 5G Chip Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
5G chip packaging is a new type of packaging for 5G chips. It is a small, thin package that contains the 5G chip and antenna.
Some of the key players operating in the 5g chip packaging market are ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa, NEPES, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, Tongfu Microelectronics Co., Ltd..
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 5G Chip Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 5G Chip Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 5G Chip Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 5G Chip Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 5G Chip Packaging Market Size & Forecast, 2018-2028
4.5.1 5G Chip Packaging Market Size and Y-o-Y Growth
4.5.2 5G Chip Packaging Market Absolute $ Opportunity
Chapter 5 Global 5G Chip Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 5G Chip Packaging Market Size Forecast by Type
5.2.1 DIP
5.2.2 PGA
5.2.3 BGA
5.2.4 CSP
5.2.5 3.0 DIC
5.2.6 FO SIP
5.2.7 WLP
5.2.8 WLCSP
5.2.9 Filp Chip
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 5G Chip Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 5G Chip Packaging Market Size Forecast by Applications
6.2.1 Automotives
6.2.2 Computers
6.2.3 Communications
6.2.4 LED
6.2.5 Medical
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 5G Chip Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 5G Chip Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America 5G Chip Packaging Analysis and Forecast
9.1 Introduction
9.2 North America 5G Chip Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America 5G Chip Packaging Market Size Forecast by Type
9.6.1 DIP
9.6.2 PGA
9.6.3 BGA
9.6.4 CSP
9.6.5 3.0 DIC
9.6.6 FO SIP
9.6.7 WLP
9.6.8 WLCSP
9.6.9 Filp Chip
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America 5G Chip Packaging Market Size Forecast by Applications
9.10.1 Automotives
9.10.2 Computers
9.10.3 Communications
9.10.4 LED
9.10.5 Medical
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe 5G Chip Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe 5G Chip Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe 5G Chip Packaging Market Size Forecast by Type
10.6.1 DIP
10.6.2 PGA
10.6.3 BGA
10.6.4 CSP
10.6.5 3.0 DIC
10.6.6 FO SIP
10.6.7 WLP
10.6.8 WLCSP
10.6.9 Filp Chip
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe 5G Chip Packaging Market Size Forecast by Applications
10.10.1 Automotives
10.10.2 Computers
10.10.3 Communications
10.10.4 LED
10.10.5 Medical
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific 5G Chip Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific 5G Chip Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific 5G Chip Packaging Market Size Forecast by Type
11.6.1 DIP
11.6.2 PGA
11.6.3 BGA
11.6.4 CSP
11.6.5 3.0 DIC
11.6.6 FO SIP
11.6.7 WLP
11.6.8 WLCSP
11.6.9 Filp Chip
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific 5G Chip Packaging Market Size Forecast by Applications
11.10.1 Automotives
11.10.2 Computers
11.10.3 Communications
11.10.4 LED
11.10.5 Medical
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America 5G Chip Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America 5G Chip Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America 5G Chip Packaging Market Size Forecast by Type
12.6.1 DIP
12.6.2 PGA
12.6.3 BGA
12.6.4 CSP
12.6.5 3.0 DIC
12.6.6 FO SIP
12.6.7 WLP
12.6.8 WLCSP
12.6.9 Filp Chip
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America 5G Chip Packaging Market Size Forecast by Applications
12.10.1 Automotives
12.10.2 Computers
12.10.3 Communications
12.10.4 LED
12.10.5 Medical
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) 5G Chip Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) 5G Chip Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) 5G Chip Packaging Market Size Forecast by Type
13.6.1 DIP
13.6.2 PGA
13.6.3 BGA
13.6.4 CSP
13.6.5 3.0 DIC
13.6.6 FO SIP
13.6.7 WLP
13.6.8 WLCSP
13.6.9 Filp Chip
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) 5G Chip Packaging Market Size Forecast by Applications
13.10.1 Automotives
13.10.2 Computers
13.10.3 Communications
13.10.4 LED
13.10.5 Medical
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 5G Chip Packaging Market: Competitive Dashboard
14.2 Global 5G Chip Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE
14.3.2 Amkor
14.3.3 SPIL
14.3.4 Stats Chippac
14.3.5 PTI
14.3.6 JCET
14.3.7 J-Devices
14.3.8 UTAC
14.3.9 Chipmos
14.3.10 Chipbond
14.3.11 STS
14.3.12 Huatian
14.3.13 NFM
14.3.14 Carsem
14.3.15 Walton
14.3.16 Unisem
14.3.17 OSE
14.3.18 AOI
14.3.19 Formosa
14.3.20 NEPES
14.3.21 Powertech Technology Inc.
14.3.22 Tianshui Huatian Technology Co., LTD
14.3.23 Tongfu Microelectronics Co., Ltd.
