Market Overview:
The global 5G thermal interface material market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for 5G-enabled devices and the rising need for high-speed data transmission. Based on type, the global 5G thermal interface material market is segmented into silicone gasket, graphite pad, thermal paste, thermal tape, thermally conductive film, phase change material and others. Thermal paste is expected to hold the largest share of this market in 2018 owing to its low cost and easy installation. Based on application, the global 5G thermal interface material market is segmented into communication, consumer electronics defense&aviation and others. Communication accounted for the largest share of this market in 2017 owing to increased demand for smartphones and other connected devices.
Product Definition:
5G Thermal Interface Material is a material that is used to improve the heat transfer between two surfaces. It can be used to improve the performance of a system or device by helping to keep it cooler.
Silicone Gasket:
Silicone gasket is a kind of thermal interface material that is used in mobile phones, laptops and other electronic products for providing thermal insulation. It has the ability to maintain its softness under high temperatures and can be re-molded after being installed.
Graphite Pad:
The graphite pad is a type of thermal interface material that is used to transfer heat from the device to which it is attached. It has high thermal conductivity and low density, which makes it an ideal choice for use in applications where performance and efficiency are primary concerns. The growing demand for smartphones coupled with increasing demand for high-speed data networks has led to the introduction of 5G technology, thus creating lucrative growth opportunities in this market over the forecast period.
Application Insights:
The communication segment dominated the global 5G thermal interface material market in terms of revenue share in 2017. The application of the product helps to improve radio performance and reliability for smartphones, tablets, Wi-Fi routers as well as access points. Moreover, increasing demand for cloud-based applications is expected to drive the growth of this segment over the forecast period.
The consumer electronics segment is anticipated to witness significant growth over the forecast period owing to rapidly growing demand from smartphones and wearable devices manufacturers such as Fitbit, Garmin and Apple Inc. In addition, rapid development in IoT (Internet of Things) technology is further expected to fuel industry expansion during the study period.
Regional Analysis:
The North American regional market dominated the global 5G TFM market in 2016. The presence of key industry participants, early adoption of technologies, and increased demand for data communication services are some major factors driving the growth of this regional market. Moreover, technological advancements such as multi-gigabit per second (Gb/s) technology that is used to transfer data at a faster rate are anticipated to drive the demand for 5G TFM over the forecast period.
Asia Pacific is expected to be one of the fastest-growing regions owing to increasing number of mobile internet users and growing penetration in developing countries such as China and India. In addition, investments by telecom companies in order to roll out advanced wireless networks are expected favorably impact overall industry growth over the next eight years. For instance, China Telecom Corporation Limited has announced plans about deploying high-speed dedicated fiber links between cities called National Trunk Network (NEN).
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The need for smaller and faster devices is driving the demand for thermal interface materials that can provide better heat dissipation. Thermal interface materials help to improve the heat transfer between two surfaces, thus reducing the temperature of the device.
- Growing adoption of LED lighting: LED lighting is becoming increasingly popular due to its energy-efficiency and long life span. However, LEDs generate a lot of heat, which needs to be dissipated quickly in order to prevent damage to the device. Thermal interface materials play an important role in dissipating this heat and preventing overheating.
- Rising demand for electric vehicles: Electric vehicles are becoming more popular as awareness about their benefits grows. However, they require a lot of power which generates a lot of heat that needs to be managed effectively or it can damage the vehicle’s components . Thermal interface materials are essential in managing this excess heat and ensuring optimal performance from electric vehicles .
Scope Of The Report
Report Attributes
Report Details
Report Title
5G Thermal Interface Material Market Research Report
By Type
Silicone Gasket, Graphite Pad, Thermal Paste, Thermal Tape, Thermally Conductive Film, Phase Change Material, Others
By Application
Communication, Consumer Electronics, Defense&Aviation, Others
By Companies
DuPont, Shin-Etsu Chemical Co., Ltd., Panasonic, Laird, Henkel, Honeywell, 3M, SEMIKRON, Momentive, Boyd Corporation, AI Technology, Guangzhou Huitian New Material Co.,Ltd., Kingbali, Shenzhen HFC Shielding Products Co., Ltd., Hunan Boom New Materials, Shenzhen Aochuan Technology Co., Ltd., Fujipoly, Parker, KITAGAWA, Tanyuan Technology Co, JONES, DOW
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
149
Number of Tables & Figures
105
Customization Available
Yes, the report can be customized as per your need.
Global 5G Thermal Interface Material Market Report Segments:
The global 5G Thermal Interface Material market is segmented on the basis of:
Types
Silicone Gasket, Graphite Pad, Thermal Paste, Thermal Tape, Thermally Conductive Film, Phase Change Material, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication, Consumer Electronics, Defense&Aviation, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DuPont
- Shin-Etsu Chemical Co., Ltd.
- Panasonic
- Laird
- Henkel
- Honeywell
- 3M
- SEMIKRON
- Momentive
- Boyd Corporation
- AI Technology
- Guangzhou Huitian New Material Co.,Ltd.
- Kingbali
- Shenzhen HFC Shielding Products Co., Ltd.
- Hunan Boom New Materials
- Shenzhen Aochuan Technology Co., Ltd.
- Fujipoly
- Parker
- KITAGAWA
- Tanyuan Technology Co
- JONES
- DOW
Highlights of The 5G Thermal Interface Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicone Gasket
- Graphite Pad
- Thermal Paste
- Thermal Tape
- Thermally Conductive Film
- Phase Change Material
- Others
- By Application:
- Communication
- Consumer Electronics
- Defense&Aviation
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 5G Thermal Interface Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
5G Thermal Interface Material (TIM) is a thermal interface material used in the manufacture of mobile devices, including smartphones and tablets. It is also used in the production of 5G telecommunications infrastructure. TIM helps to reduce heat transfer between electronic components and their surroundings, which can improve device performance and reliability.
Some of the major companies in the 5g thermal interface material market are DuPont, Shin-Etsu Chemical Co., Ltd., Panasonic, Laird, Henkel, Honeywell, 3M, SEMIKRON, Momentive, Boyd Corporation, AI Technology, Guangzhou Huitian New Material Co.,Ltd., Kingbali, Shenzhen HFC Shielding Products Co., Ltd., Hunan Boom New Materials, Shenzhen Aochuan Technology Co., Ltd., Fujipoly, Parker, KITAGAWA, Tanyuan Technology Co, JONES, DOW.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 5G Thermal Interface Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 5G Thermal Interface Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 5G Thermal Interface Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 5G Thermal Interface Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 5G Thermal Interface Material Market Size & Forecast, 2018-2028
4.5.1 5G Thermal Interface Material Market Size and Y-o-Y Growth
4.5.2 5G Thermal Interface Material Market Absolute $ Opportunity
Chapter 5 Global 5G Thermal Interface Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 5G Thermal Interface Material Market Size Forecast by Type
5.2.1 Silicone Gasket
5.2.2 Graphite Pad
5.2.3 Thermal Paste
5.2.4 Thermal Tape
5.2.5 Thermally Conductive Film
5.2.6 Phase Change Material
5.2.7 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 5G Thermal Interface Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 5G Thermal Interface Material Market Size Forecast by Applications
6.2.1 Communication
6.2.2 Consumer Electronics
6.2.3 Defense&Aviation
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global 5G Thermal Interface Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 5G Thermal Interface Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America 5G Thermal Interface Material Analysis and Forecast
9.1 Introduction
9.2 North America 5G Thermal Interface Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America 5G Thermal Interface Material Market Size Forecast by Type
9.6.1 Silicone Gasket
9.6.2 Graphite Pad
9.6.3 Thermal Paste
9.6.4 Thermal Tape
9.6.5 Thermally Conductive Film
9.6.6 Phase Change Material
9.6.7 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America 5G Thermal Interface Material Market Size Forecast by Applications
9.10.1 Communication
9.10.2 Consumer Electronics
9.10.3 Defense&Aviation
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe 5G Thermal Interface Material Analysis and Forecast
10.1 Introduction
10.2 Europe 5G Thermal Interface Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe 5G Thermal Interface Material Market Size Forecast by Type
10.6.1 Silicone Gasket
10.6.2 Graphite Pad
10.6.3 Thermal Paste
10.6.4 Thermal Tape
10.6.5 Thermally Conductive Film
10.6.6 Phase Change Material
10.6.7 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe 5G Thermal Interface Material Market Size Forecast by Applications
10.10.1 Communication
10.10.2 Consumer Electronics
10.10.3 Defense&Aviation
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific 5G Thermal Interface Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific 5G Thermal Interface Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific 5G Thermal Interface Material Market Size Forecast by Type
11.6.1 Silicone Gasket
11.6.2 Graphite Pad
11.6.3 Thermal Paste
11.6.4 Thermal Tape
11.6.5 Thermally Conductive Film
11.6.6 Phase Change Material
11.6.7 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific 5G Thermal Interface Material Market Size Forecast by Applications
11.10.1 Communication
11.10.2 Consumer Electronics
11.10.3 Defense&Aviation
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America 5G Thermal Interface Material Analysis and Forecast
12.1 Introduction
12.2 Latin America 5G Thermal Interface Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America 5G Thermal Interface Material Market Size Forecast by Type
12.6.1 Silicone Gasket
12.6.2 Graphite Pad
12.6.3 Thermal Paste
12.6.4 Thermal Tape
12.6.5 Thermally Conductive Film
12.6.6 Phase Change Material
12.6.7 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America 5G Thermal Interface Material Market Size Forecast by Applications
12.10.1 Communication
12.10.2 Consumer Electronics
12.10.3 Defense&Aviation
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) 5G Thermal Interface Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) 5G Thermal Interface Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) 5G Thermal Interface Material Market Size Forecast by Type
13.6.1 Silicone Gasket
13.6.2 Graphite Pad
13.6.3 Thermal Paste
13.6.4 Thermal Tape
13.6.5 Thermally Conductive Film
13.6.6 Phase Change Material
13.6.7 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) 5G Thermal Interface Material Market Size Forecast by Applications
13.10.1 Communication
13.10.2 Consumer Electronics
13.10.3 Defense&Aviation
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 5G Thermal Interface Material Market: Competitive Dashboard
14.2 Global 5G Thermal Interface Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DuPont
14.3.2 Shin-Etsu Chemical Co., Ltd.
14.3.3 Panasonic
14.3.4 Laird
14.3.5 Henkel
14.3.6 Honeywell
14.3.7 3M
14.3.8 SEMIKRON
14.3.9 Momentive
14.3.10 Boyd Corporation
14.3.11 AI Technology
14.3.12 Guangzhou Huitian New Material Co.,Ltd.
14.3.13 Kingbali
14.3.14 Shenzhen HFC Shielding Products Co., Ltd.
14.3.15 Hunan Boom New Materials
14.3.16 Shenzhen Aochuan Technology Co., Ltd.
14.3.17 Fujipoly
14.3.18 Parker
14.3.19 KITAGAWA
14.3.20 Tanyuan Technology Co
14.3.21 JONES
14.3.22 DOW
