Market Overview:
The global ABF substrate market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced packaging solutions in various applications, such as PCs, servers, 5G base stations, AI chipsets, and others. In addition, the growing demand for miniaturization and higher integration in electronic devices is also fueling the growth of this market. The global ABF substrate market by type is segmented into three layers and other types. The three-layer type segment is expected to hold the largest share of the global ABF substrate market during the forecast period. This can be attributed to its advantages such as high thermal conductivity and low dielectric constant. The other type segment includes multilayer ceramic substrates (MLCs) and silicon wafers/substrates among others. The global ABF substrate market by application is divided into five segments: PCs, servers, 5G base stations, AI chipsets,,and other applications segments). Among these five segments,.
 Substrate Industry Outlook.svg)
Product Definition:
ABF(Ajinomoto Build-up Film) Substrate is a transparent film which has been chemically treated to provide a homogeneous and smooth surface. ABF substrate is used as the foundation for optical coatings, adhesives, and sealants. It helps in the formation of even films by reducing the number of defects that can form during deposition.
3 Layers:
3 layers is a thin film formed from an organic compound, which acts as a barrier to water vapor and other volatile compounds. The most commonly used materials for 3Layers are polyethylene (PE), polypropylene (PP), and polyvinylidene chloride (PVC). PE is the most widely used material for 3 layer applications owing to its low cost & wide availability.
Other:
Other is a colloidal particle made up of lipids, proteins and nucleic acids. It is also known as the second messenger. Other name can be used for other substances that are very similar to ABF such as plasma proteins, cytokines and hormones among others. The most important function of other in ABF substrate market is to signal between cells or molecules which leads to changes in cell behavior or protein expression ultimately resulting into cellular change.
Application Insights:
The other application segment includes mobile phones, consumer electronics, medical devices and others. The server application is projected to witness the highest CAGR of XX% from 2018 to 2030. This growth can be attributed to increasing demand for high-performance computing systems across various applications such as data analytics and artificial intelligence.
A large number of research initiatives are undertaken by industry players with the objective of enhancing performance capabilities in ABF substrate based electronic devices through optimization of device architecture, material selection and process design which will further boost product demand in near future.
PC application dominated the overall market in terms of revenue share at more than 40% in 2017 owing to its broad usage across various end-use industries such as business/home office computers, gaming computers and laptops among others where high stability & reliability along with enhanced performance is required from substrates used within these systems.
Regional Analysis:
North America dominated the market in terms of revenue share and is expected to grow at a CAGR of XX% from 2018 to 2030. This growth can be attributed to the presence of major industry participants such as Intel Corporation; Qualcomm Inc.; Texas Instruments Inc.; and Avago Technologies Limited, which are engaged in extensive research & development activities for developing advanced semiconductor technologies. The U.S.-based companies are also involved in strategic initiatives such as joint ventures, acquisitions, and partnerships with Asian manufacturers for expanding their business operations across this region.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Growing trend of using flexible substrates in displays and sensors
- Proliferation of advanced packaging technologies
- Rising demand for semiconductor materials and devices
- Increasing investments in R&D by substrate manufacturers
Scope Of The Report
Report Attributes
Report Details
Report Title
ABF(Ajinomoto Build-up Film) Substrate Market Research Report
By Type
3 Layers, Other
By Application
PC, Server, 5G Base, AI Chip, Other
By Companies
Unimicron Technology, Nan Ya PCB, Kinsus Interconnect Technology, Ajinomoto Fine-Techno, Daeduck Electronics, Ibiden, AT&S, Shinko, SEMCO, Unimicron Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
215
Number of Tables & Figures
151
Customization Available
Yes, the report can be customized as per your need.
Global ABF(Ajinomoto Build-up Film) Substrate Market Report Segments:
The global ABF(Ajinomoto Build-up Film) Substrate market is segmented on the basis of:
Types
3 Layers, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
PC, Server, 5G Base, AI Chip, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Unimicron Technology
- Nan Ya PCB
- Kinsus Interconnect Technology
- Ajinomoto Fine-Techno
- Daeduck Electronics
- Ibiden
- AT&S
- Shinko
- SEMCO
- Unimicron Technology
 Substrate Market Overview.svg)
Highlights of The ABF(Ajinomoto Build-up Film) Substrate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3 Layers
- Other
- By Application:
- PC
- Server
- 5G Base
- AI Chip
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the ABF(Ajinomoto Build-up Film) Substrate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Substrate Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
ABF is a substrate used in the manufacture of photomasks. It is a thin, transparent film that can be coated on either side with photosensitive material. When light shines through the film, it creates an image on the other side.
Some of the major players in the abf(ajinomoto build-up film) substrate market are Unimicron Technology, Nan Ya PCB, Kinsus Interconnect Technology, Ajinomoto Fine-Techno, Daeduck Electronics, Ibiden, AT&S, Shinko, SEMCO, Unimicron Technology.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 ABF(Ajinomoto Build-up Film) Substrate Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 ABF(Ajinomoto Build-up Film) Substrate Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 ABF(Ajinomoto Build-up Film) Substrate Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the ABF(Ajinomoto Build-up Film) Substrate Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global ABF(Ajinomoto Build-up Film) Substrate Market Size & Forecast, 2018-2028
4.5.1 ABF(Ajinomoto Build-up Film) Substrate Market Size and Y-o-Y Growth
4.5.2 ABF(Ajinomoto Build-up Film) Substrate Market Absolute $ Opportunity
Chapter 5 Global ABF(Ajinomoto Build-up Film) Substrate Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
5.2.1 3 Layers
5.2.2 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global ABF(Ajinomoto Build-up Film) Substrate Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
6.2.1 PC
6.2.2 Server
6.2.3 5G Base
6.2.4 AI Chip
6.2.5 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global ABF(Ajinomoto Build-up Film) Substrate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America ABF(Ajinomoto Build-up Film) Substrate Analysis and Forecast
9.1 Introduction
9.2 North America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
9.6.1 3 Layers
9.6.2 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
9.10.1 PC
9.10.2 Server
9.10.3 5G Base
9.10.4 AI Chip
9.10.5 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe ABF(Ajinomoto Build-up Film) Substrate Analysis and Forecast
10.1 Introduction
10.2 Europe ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
10.6.1 3 Layers
10.6.2 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
10.10.1 PC
10.10.2 Server
10.10.3 5G Base
10.10.4 AI Chip
10.10.5 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific ABF(Ajinomoto Build-up Film) Substrate Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
11.6.1 3 Layers
11.6.2 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
11.10.1 PC
11.10.2 Server
11.10.3 5G Base
11.10.4 AI Chip
11.10.5 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America ABF(Ajinomoto Build-up Film) Substrate Analysis and Forecast
12.1 Introduction
12.2 Latin America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
12.6.1 3 Layers
12.6.2 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
12.10.1 PC
12.10.2 Server
12.10.3 5G Base
12.10.4 AI Chip
12.10.5 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) ABF(Ajinomoto Build-up Film) Substrate Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Type
13.6.1 3 Layers
13.6.2 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) ABF(Ajinomoto Build-up Film) Substrate Market Size Forecast by Applications
13.10.1 PC
13.10.2 Server
13.10.3 5G Base
13.10.4 AI Chip
13.10.5 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 ABF(Ajinomoto Build-up Film) Substrate Market: Competitive Dashboard
14.2 Global ABF(Ajinomoto Build-up Film) Substrate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Unimicron Technology
14.3.2 Nan Ya PCB
14.3.3 Kinsus Interconnect Technology
14.3.4 Ajinomoto Fine-Techno
14.3.5 Daeduck Electronics
14.3.6 Ibiden
14.3.7 AT&S
14.3.8 Shinko
14.3.9 SEMCO
14.3.10 Unimicron Technology
