Market Overview:
The global advanced packaging inspection systems market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for packaged food and beverages, rising concerns over product quality, and the growing trend of miniaturization in electronics products. Based on type, the global advanced packaging inspection systems market can be segmented into optical based packaging inspection systems and infrared packaging inspection systems. Optical based packaging inspection systems are further classified into visible light imaging (VLI) and near-infrared (NIR) imaging technologies. Infrared-based Packaging Inspection Systems are used for detecting defects that are not visible to the human eye such as moisture ingress, foreign material contamination etc., due to their ability to detect radiation beyond the visual spectrum. In terms of application, consumer electronics accounted for the largest share of the global advanced packaging inspection systems market in 2017 owing to increased demand for smartphones, tablets PCs etc., which require high levels of product quality assurance.
Product Definition:
Advanced Packaging Inspection Systems are used to detect and correct defects in the packaging of products. This is important because it helps ensure that products are properly packaged and protected during shipping.
Optical Based Packaging Inspection Systems:
The global optical based packaging inspection systems market size was valued at USD 6.5 billion in 2015 and is expected to witness significant growth over the forecast period owing to its ability to detect minute details, which would otherwise go undetected through other technologies. The technology provides a high level of accuracy and reliability in detecting defects that are either mechanically or chemically induced, thereby augmenting the demand for this technology globally.
Infrared Packaging Inspection Systems:
Infrared packaging inspection systems are used in the market for advanced packaging inspection system. Advanced packaging inspection system is a technology that uses infrared radiation to detect micro-sized flaws in the product such as surface defects, impurities and moisture content. The technology has high accuracy and can identify various types of flaws including internal flaw, external flaw or damage and foreign particle. It also provides information regarding type of damage such as burns, cuts or puncture etc.
Application Insights:
The automotive electronics application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for electronic devices across various applications such as infotainment, navigation systems, entertainment systems and lighting systems among others.
Consumer electronics are expected to emerge as one of the fastest-growing segments owing to rising demand from end-use industries such as consumer appliances and mobile phones among others. Advancements in technology have led consumers towards purchasing smart products that offer enhanced functionality along with improved aesthetics which has increased product exposure during transportation leading to an increase in inspection activities globally.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing foreign investments in this region. For instance, in September 2017, Panasonic Corporation invested USD X million for expanding its LED display manufacturing plant in India. This investment will help it meet growing demand from various end-use industries such as automotive and healthcare by allowing flexible production requirements.
North America accounted for a significant share of global revenue owing to early adoption of advanced technologies across several major industries such as consumer electronics and healthcare among others.
Growth Factors:
- Increasing demand for miniaturization in electronics industry
- Rising need for quality control and assurance in advanced packaging process
- Proliferation of counterfeit products in the market
- Growing trend of outsourcing manufacturing to low-cost countries
- Advancements in technology and automation
Scope Of The Report
Report Attributes
Report Details
Report Title
Advanced Packaging Inspection Systems Market Research Report
By Type
Optical Based Packaging Inspection Systems, Infrared Packaging Inspection Systems
By Application
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
By Companies
KLA-Tencor, Onto Innovation, Semiconductor Technologies & Instruments (STI), Cohu, Camtek
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
222
Number of Tables & Figures
156
Customization Available
Yes, the report can be customized as per your need.
Global Advanced Packaging Inspection Systems Market Report Segments:
The global Advanced Packaging Inspection Systems market is segmented on the basis of:
Types
Optical Based Packaging Inspection Systems, Infrared Packaging Inspection Systems
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- KLA-Tencor
- Onto Innovation
- Semiconductor Technologies & Instruments (STI)
- Cohu
- Camtek
Highlights of The Advanced Packaging Inspection Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Optical Based Packaging Inspection Systems
- Infrared Packaging Inspection Systems
- By Application:
- Consumer Electronics
- Automotive Electronics
- Industrial
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Advanced Packaging Inspection Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Advanced Packaging Inspection Systems (APIS) is a technology that uses imaging and analysis to identify potential defects in packaging. APIS can help ensure the safety and quality of products by identifying potential problems before they cause damage or spoilage.
Some of the key players operating in the advanced packaging inspection systems market are KLA-Tencor, Onto Innovation, Semiconductor Technologies & Instruments (STI), Cohu, Camtek.
The advanced packaging inspection systems market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Advanced Packaging Inspection Systems Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Advanced Packaging Inspection Systems Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Advanced Packaging Inspection Systems Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Advanced Packaging Inspection Systems Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Advanced Packaging Inspection Systems Market Size & Forecast, 2020-2028
4.5.1 Advanced Packaging Inspection Systems Market Size and Y-o-Y Growth
4.5.2 Advanced Packaging Inspection Systems Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Optical Based Packaging Inspection Systems
5.2.2 Infrared Packaging Inspection Systems
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive Electronics
6.2.3 Industrial
6.2.4 Healthcare
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Advanced Packaging Inspection Systems Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Advanced Packaging Inspection Systems Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Optical Based Packaging Inspection Systems
9.6.2 Infrared Packaging Inspection Systems
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive Electronics
9.10.3 Industrial
9.10.4 Healthcare
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Optical Based Packaging Inspection Systems
10.6.2 Infrared Packaging Inspection Systems
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive Electronics
10.10.3 Industrial
10.10.4 Healthcare
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Optical Based Packaging Inspection Systems
11.6.2 Infrared Packaging Inspection Systems
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive Electronics
11.10.3 Industrial
11.10.4 Healthcare
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Optical Based Packaging Inspection Systems
12.6.2 Infrared Packaging Inspection Systems
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive Electronics
12.10.3 Industrial
12.10.4 Healthcare
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Optical Based Packaging Inspection Systems
13.6.2 Infrared Packaging Inspection Systems
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive Electronics
13.10.3 Industrial
13.10.4 Healthcare
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Advanced Packaging Inspection Systems Market: Competitive Dashboard
14.2 Global Advanced Packaging Inspection Systems Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 KLA-Tencor
14.3.2 Onto Innovation
14.3.3 Semiconductor Technologies & Instruments (STI)
14.3.4 Cohu
14.3.5 Camtek
