Industry Growth Insights published a new data on “Advanced Packaging Materials Market”. The research report is titled “Advanced Packaging Materials Market research by Types (Silicon Carbide (SiC), Aluminum nitride (AlN), Aluminum Silicon Carbide (AlSiC), Others), By Applications (Power Amplifier, Microwave Electronics, Thyristor, IGBT, MOSFET, Others), By Players/Companies Saint-Gobain, Lanzhou Heqiao Resource Co., Ltd., Cumi Murugappa, Elsid S.A, Washington Mills, ESD-SIC, Denka, CPS Technologies, Hunan Harvest Technology Development Company, Ltd, Beijing Baohang Advanced Material Co., Ltd., Xi'an Mingke, Hunan Everrich Composite Corp., Ceramtec, DWA Aluminum Composite, Thermal Transfer Composites, Japan Fine Ceramic, Sumitomo Electric”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Advanced Packaging Materials Market Research Report
By Type
Silicon Carbide (SiC), Aluminum nitride (AlN), Aluminum Silicon Carbide (AlSiC), Others
By Application
Power Amplifier, Microwave Electronics, Thyristor, IGBT, MOSFET, Others
By Companies
Saint-Gobain, Lanzhou Heqiao Resource Co., Ltd., Cumi Murugappa, Elsid S.A, Washington Mills, ESD-SIC, Denka, CPS Technologies, Hunan Harvest Technology Development Company, Ltd, Beijing Baohang Advanced Material Co., Ltd., Xi'an Mingke, Hunan Everrich Composite Corp., Ceramtec, DWA Aluminum Composite, Thermal Transfer Composites, Japan Fine Ceramic, Sumitomo Electric
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
184
Number of Tables & Figures
129
Customization Available
Yes, the report can be customized as per your need.
Global Advanced Packaging Materials Market Report Segments:
The global Advanced Packaging Materials market is segmented on the basis of:
Types
Silicon Carbide (SiC), Aluminum nitride (AlN), Aluminum Silicon Carbide (AlSiC), Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Power Amplifier, Microwave Electronics, Thyristor, IGBT, MOSFET, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Saint-Gobain
- Lanzhou Heqiao Resource Co., Ltd.
- Cumi Murugappa
- Elsid S.A
- Washington Mills
- ESD-SIC
- Denka
- CPS Technologies
- Hunan Harvest Technology Development Company, Ltd
- Beijing Baohang Advanced Material Co., Ltd.
- Xi'an Mingke
- Hunan Everrich Composite Corp.
- Ceramtec
- DWA Aluminum Composite
- Thermal Transfer Composites
- Japan Fine Ceramic
- Sumitomo Electric
Highlights of The Advanced Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicon Carbide (SiC)
- Aluminum nitride (AlN)
- Aluminum Silicon Carbide (AlSiC)
- Others
- By Application:
- Power Amplifier
- Microwave Electronics
- Thyristor
- IGBT
- MOSFET
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Advanced Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Advanced Packaging Materials (APM) is a global trade association representing the packaging and materials industry. APM's mission is to promote innovation, education and collaboration in the packaging and materials industry.
Some of the major companies in the advanced packaging materials market are Saint-Gobain, Lanzhou Heqiao Resource Co., Ltd., Cumi Murugappa, Elsid S.A, Washington Mills, ESD-SIC, Denka, CPS Technologies, Hunan Harvest Technology Development Company, Ltd, Beijing Baohang Advanced Material Co., Ltd., Xi'an Mingke, Hunan Everrich Composite Corp., Ceramtec, DWA Aluminum Composite, Thermal Transfer Composites, Japan Fine Ceramic, Sumitomo Electric.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Advanced Packaging Materials Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Advanced Packaging Materials Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Advanced Packaging Materials Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Advanced Packaging Materials Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Advanced Packaging Materials Market Size & Forecast, 2018-2028 4.5.1 Advanced Packaging Materials Market Size and Y-o-Y Growth 4.5.2 Advanced Packaging Materials Market Absolute $ Opportunity
Chapter 5 Global Advanced Packaging Materials Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Advanced Packaging Materials Market Size Forecast by Type
5.2.1 Silicon Carbide (SiC)
5.2.2 Aluminum nitride (AlN)
5.2.3 Aluminum Silicon Carbide (AlSiC)
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Advanced Packaging Materials Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Advanced Packaging Materials Market Size Forecast by Applications
6.2.1 Power Amplifier
6.2.2 Microwave Electronics
6.2.3 Thyristor
6.2.4 IGBT
6.2.5 MOSFET
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Advanced Packaging Materials Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Advanced Packaging Materials Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Advanced Packaging Materials Analysis and Forecast
9.1 Introduction
9.2 North America Advanced Packaging Materials Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Advanced Packaging Materials Market Size Forecast by Type
9.6.1 Silicon Carbide (SiC)
9.6.2 Aluminum nitride (AlN)
9.6.3 Aluminum Silicon Carbide (AlSiC)
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Advanced Packaging Materials Market Size Forecast by Applications
9.10.1 Power Amplifier
9.10.2 Microwave Electronics
9.10.3 Thyristor
9.10.4 IGBT
9.10.5 MOSFET
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Advanced Packaging Materials Analysis and Forecast
10.1 Introduction
10.2 Europe Advanced Packaging Materials Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Advanced Packaging Materials Market Size Forecast by Type
10.6.1 Silicon Carbide (SiC)
10.6.2 Aluminum nitride (AlN)
10.6.3 Aluminum Silicon Carbide (AlSiC)
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Advanced Packaging Materials Market Size Forecast by Applications
10.10.1 Power Amplifier
10.10.2 Microwave Electronics
10.10.3 Thyristor
10.10.4 IGBT
10.10.5 MOSFET
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Advanced Packaging Materials Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Advanced Packaging Materials Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Advanced Packaging Materials Market Size Forecast by Type
11.6.1 Silicon Carbide (SiC)
11.6.2 Aluminum nitride (AlN)
11.6.3 Aluminum Silicon Carbide (AlSiC)
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Advanced Packaging Materials Market Size Forecast by Applications
11.10.1 Power Amplifier
11.10.2 Microwave Electronics
11.10.3 Thyristor
11.10.4 IGBT
11.10.5 MOSFET
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Advanced Packaging Materials Analysis and Forecast
12.1 Introduction
12.2 Latin America Advanced Packaging Materials Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Advanced Packaging Materials Market Size Forecast by Type
12.6.1 Silicon Carbide (SiC)
12.6.2 Aluminum nitride (AlN)
12.6.3 Aluminum Silicon Carbide (AlSiC)
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Advanced Packaging Materials Market Size Forecast by Applications
12.10.1 Power Amplifier
12.10.2 Microwave Electronics
12.10.3 Thyristor
12.10.4 IGBT
12.10.5 MOSFET
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Advanced Packaging Materials Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Advanced Packaging Materials Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Advanced Packaging Materials Market Size Forecast by Type
13.6.1 Silicon Carbide (SiC)
13.6.2 Aluminum nitride (AlN)
13.6.3 Aluminum Silicon Carbide (AlSiC)
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Advanced Packaging Materials Market Size Forecast by Applications
13.10.1 Power Amplifier
13.10.2 Microwave Electronics
13.10.3 Thyristor
13.10.4 IGBT
13.10.5 MOSFET
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Advanced Packaging Materials Market: Competitive Dashboard
14.2 Global Advanced Packaging Materials Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Saint-Gobain
14.3.2 Lanzhou Heqiao Resource Co., Ltd.
14.3.3 Cumi Murugappa
14.3.4 Elsid S.A
14.3.5 Washington Mills
14.3.6 ESD-SIC
14.3.7 Denka
14.3.8 CPS Technologies
14.3.9 Hunan Harvest Technology Development Company, Ltd
14.3.10 Beijing Baohang Advanced Material Co., Ltd.
14.3.11 Xi'an Mingke
14.3.12 Hunan Everrich Composite Corp.
14.3.13 Ceramtec
14.3.14 DWA Aluminum Composite
14.3.15 Thermal Transfer Composites
14.3.16 Japan Fine Ceramic
14.3.17 Sumitomo Electric