Market Overview:
The global Antenna in Package (AiP) module market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth of the market can be attributed to the increasing demand for miniaturized and high-performance antennas in consumer electronics, vehicle electronics, industrial internet of things (IIoT), communication base stations, and other applications. LTCC modules are expected to hold a major share of the global AiP module market during the forecast period owing to their advantages such as low weight, small size, and high performance. HDI modules are also expected to witness significant growth during the forecast period due to their advantages such as miniaturization and higher performance over traditional FR4 PCBs.
 Module Industry Outlook.svg)
Product Definition:
AiP (antenna in package) module is a RF component that integrates an antenna and RF chip into one package. It is used to transmit and receive wireless signals. The importance of AiP module lies in its ability to reduce the size and weight of a product, while still providing adequate signal strength.
LTCC:
LTCC (Lithium-Tin-Chloride) is a type of plastic with high thermal and electrical conductivity. It has the highest melting point of any material, which makes it ideal for use in packaging applications. The material is also stable at room temperature, making it an excellent choice for manufacturing antennas in packages that can be used in mobile devices such as smartphones and tablets.
HDI:
High-Density Interconnect (HDI) is a technology that allows the packaging of an antenna in a smaller space. It helps in increasing the performance and efficiency of wireless devices by reducing signal loss. The technology also provides for efficient power management, which enables longer battery life and faster data speeds.
Application Insights:
The vehicle electronics segment accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. This can be attributed to growing demand for advanced communication and information technology in automobiles, which has led to an increase in antenna integrated circuit packages (AiP).
Vehicle electronic systems require stable and secure connectivity with various devices, such as Global Positioning System (GPS), Bluetooth Low-Energy (BLE), Wi-Fi hot spots, cellular networks, navigation systems, etc. The increasing need for these systems is propelling their development at a rapid pace. Furthermore, rising demand from the automotive industry will drive growth over the coming years.
Consumer electronics are expected to witness significant growth during the forecast period owing to increased use of smart devices such as smartphones and tablets across various end-use industries including healthcare & pharmaceuticals among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for data communication services in emerging economies, such as China and India. In addition, rising number of smart devices is anticipated to fuel industry expansion over the next eight years.
North America occupied a significant share in global aiP module market owing to early adoption of advanced antenna technologies across various applications. Europe also held a considerable share due to high penetration rate of 4G/LTE connectivity and growing demand for high-speed wireless data networks used by industrial IoT devices and base station antennas among others to establish communication with remote locations or sensors at those locations thereby boosting industry growth over the coming years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The trend of miniaturization in electronic devices is driving the demand for AiP modules. With the ever-growing demand for smaller and sleeker devices, the need for antennas that can be integrated into packages is increasing. This is providing a major growth driver for the AiP module market.
- Rising number of wireless applications: The proliferation of wireless applications is another key factor driving the growth of the AiP module market. With an increase in number of connected devices and rising data traffic, there is a growing need for antennas that can handle high-frequency signals efficiently. This is fueling demand for AiP modules across various industries.
- Growing popularity of 5G technology: The upcoming rollout of 5G technology across various countries worldwide is expected to provide a major boost to the AIp module market during the forecast period 2019-2025 . 5G networks are anticipated to offer significantly higher bandwidths as compared to 4G networks, thus resulting in an increased uptake of AIp modules by telecom service providers worldwide .
Scope Of The Report
Report Attributes
Report Details
Report Title
AiP (Antenna in Package) Module Market Research Report
By Type
LTCC, HDI, FOWLP
By Application
Consumer Electronics, Vehicle Electronics, Industrial Internet of Things, Communication Base Station, Others
By Companies
Qualcomm, Intel, Murata, Skyworks, Qorvo, Samsung, Broadcom, Huizhou Speed Wireless Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
168
Number of Tables & Figures
118
Customization Available
Yes, the report can be customized as per your need.
Global AiP (Antenna in Package) Module Market Report Segments:
The global AiP (Antenna in Package) Module market is segmented on the basis of:
Types
LTCC, HDI, FOWLP
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Vehicle Electronics, Industrial Internet of Things, Communication Base Station, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Qualcomm
- Intel
- Murata
- Skyworks
- Qorvo
- Samsung
- Broadcom
- Huizhou Speed Wireless Technology
 Module Market Overview.svg)
Highlights of The AiP (Antenna in Package) Module Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- LTCC
- HDI
- FOWLP
- By Application:
- Consumer Electronics
- Vehicle Electronics
- Industrial Internet of Things
- Communication Base Station
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the AiP (Antenna in Package) Module Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Module Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
AiP (Antenna in Package) Module is a small, low-cost module that can be installed on a Wi-Fi access point or router to provide extended range and improved performance.
Some of the major players in the aip (antenna in package) module market are Qualcomm, Intel, Murata, Skyworks, Qorvo, Samsung, Broadcom, Huizhou Speed Wireless Technology.
The aip (antenna in package) module market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 AiP (Antenna in Package) Module Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 AiP (Antenna in Package) Module Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 AiP (Antenna in Package) Module Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the AiP (Antenna in Package) Module Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global AiP (Antenna in Package) Module Market Size & Forecast, 2020-2028
4.5.1 AiP (Antenna in Package) Module Market Size and Y-o-Y Growth
4.5.2 AiP (Antenna in Package) Module Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 LTCC
5.2.2 HDI
5.2.3 FOWLP
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Vehicle Electronics
6.2.3 Industrial Internet of Things
6.2.4 Communication Base Station
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global AiP (Antenna in Package) Module Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 AiP (Antenna in Package) Module Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 LTCC
9.6.2 HDI
9.6.3 FOWLP
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Vehicle Electronics
9.10.3 Industrial Internet of Things
9.10.4 Communication Base Station
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 LTCC
10.6.2 HDI
10.6.3 FOWLP
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Vehicle Electronics
10.10.3 Industrial Internet of Things
10.10.4 Communication Base Station
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 LTCC
11.6.2 HDI
11.6.3 FOWLP
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Vehicle Electronics
11.10.3 Industrial Internet of Things
11.10.4 Communication Base Station
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 LTCC
12.6.2 HDI
12.6.3 FOWLP
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Vehicle Electronics
12.10.3 Industrial Internet of Things
12.10.4 Communication Base Station
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 LTCC
13.6.2 HDI
13.6.3 FOWLP
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Vehicle Electronics
13.10.3 Industrial Internet of Things
13.10.4 Communication Base Station
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 AiP (Antenna in Package) Module Market: Competitive Dashboard
14.2 Global AiP (Antenna in Package) Module Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Qualcomm
14.3.2 Intel
14.3.3 Murata
14.3.4 Skyworks
14.3.5 Qorvo
14.3.6 Samsung
14.3.7 Broadcom
14.3.8 Huizhou Speed Wireless Technology
