Market Overview:
The global aluminum copper sputtering target market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor and deposition applications across the globe. In terms of purity, the 99% purity segment is expected to hold a major share of the global aluminum copper sputtering target market during the forecast period.
Product Definition:
Sputtering is a physical vapor deposition (PVD) process used to produce thin films. In the sputtering process, a target material is bombarded with energetic particles, causing it to eject atoms or molecules. These atoms or molecules are then deposited on a substrate, forming a thin film. Aluminum copper sputtering target is made of aluminum and copper. It has high thermal conductivity and low resistivity.
Purity 99%:
Purity 99% is a type of target material that contains almost pure elements. It's the most preferred type of target material by sputtering systems manufacturers and research institutes for various applications such as thin-film deposition, nanotechnology, semiconductor devices fabrication and others. Purity 99% aluminum copper targets are used in different types of equipment such as magnetron sputtering systems, ion plating systems and others.
Purity 99.5%:
Purity 99.5% is a type of target material that has been used in the production of semiconductors, electronic devices and flat panel products. It consists of pure aluminum and copper with no additional materials added to it. The purity level is achieved by continuous quality control measures at every stage from raw material procurement to final product packaging.
Application Insights:
The demand for aluminum copper sputtering target in semiconductor application accounted for over 35% of the global market share in terms of volume in 2017. The segment is projected to witness significant growth over the forecast period on account of increasing demand chips and electronic devices.
Aluminum copper targets are used with different types of coatings including Ta, TiO2, ZrO2 and others which enhance its properties such as adhesion to substrates and ease of cleaning. Furthermore, they are used with various chemicals such as HCI (Hydrogen Chloride), BH3 (Boron Hydride) which provide a protective layer against oxidation that enhances its durability.
Regional Analysis:
Asia Pacific aluminum copper sputtering target market is expected to grow at a significant rate over the forecast period. The growth can be attributed to increasing demand for electronic products in China and India, which in turn is likely to drive industry expansion over the next eight years. In addition, rising R&D activities related to solar energy generation are anticipated to fuel product demand in this region.
North America accounted for a share of more than 20% of the global revenue in 2017 owing to high technological advancement and growing semiconductor industry across U.S., which was valued at USD X billion as of 2016 accordingto Semiconductor Industry Association (SIA). Increasing research & development activities by universities and institutes along with government support are some factors that will drive regional market growth during the forecast period.
Europe aluminum copper sputtering target market is expected witness sluggish growth due its declining application sectors mainly chemical vapor deposition (CVD).
Growth Factors:
- Increasing demand from the electronics and semiconductor industry for aluminum copper sputtering targets due to their superior properties for thin film deposition.
- Growing popularity of aluminum copper sputtering targets in the medical device and biotechnology industries due to their ability to deposit thin films with excellent adhesion and biocompatibility.
- Rising demand from the optical coating industry for aluminum copper sputtering targets as they are used in a variety of applications such as anti-reflective coatings, mirror coatings, and color filters.
- Increasing use of aluminum copper sputtering targets in nanotechnology research and development due to their unique combination of electrical and thermal conductivity properties at the nano scale level.
Scope Of The Report
Report Attributes
Report Details
Report Title
Aluminum Copper Sputtering Target Market Research Report
By Type
Purity 99%, Purity 99.5%, Purity 99.9%, Purity 99.95%, Purity 99.99%, Purity 99.999%
By Application
Semiconductor, Chemical Vapor Deposition, Physical Vapor Deposition, Others
By Companies
American Elements, Kurt J. Lesker, Stanford Advanced Materials, MSE Supplies, QS Advanced Materials, Changsha Xinkang Advanced Materials Corporation, Edgetech Industries
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
178
Number of Tables & Figures
125
Customization Available
Yes, the report can be customized as per your need.
Global Aluminum Copper Sputtering Target Market Report Segments:
The global Aluminum Copper Sputtering Target market is segmented on the basis of:
Types
Purity 99%, Purity 99.5%, Purity 99.9%, Purity 99.95%, Purity 99.99%, Purity 99.999%
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, Chemical Vapor Deposition, Physical Vapor Deposition, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- American Elements
- Kurt J. Lesker
- Stanford Advanced Materials
- MSE Supplies
- QS Advanced Materials
- Changsha Xinkang Advanced Materials Corporation
- Edgetech Industries
Highlights of The Aluminum Copper Sputtering Target Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Purity 99%
- Purity 99.5%
- Purity 99.9%
- Purity 99.95%
- Purity 99.99%
- Purity 99.999%
- By Application:
- Semiconductor
- Chemical Vapor Deposition
- Physical Vapor Deposition
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Aluminum Copper Sputtering Target Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
An aluminum copper sputtering target is a type of sputtering target that uses aluminum and copper to create ions. This type of target is often used when creating thin films or coating materials.
Some of the major companies in the aluminum copper sputtering target market are American Elements, Kurt J. Lesker, Stanford Advanced Materials, MSE Supplies, QS Advanced Materials, Changsha Xinkang Advanced Materials Corporation, Edgetech Industries.
The aluminum copper sputtering target market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Aluminum Copper Sputtering Target Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Aluminum Copper Sputtering Target Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Aluminum Copper Sputtering Target Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Aluminum Copper Sputtering Target Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Aluminum Copper Sputtering Target Market Size & Forecast, 2018-2028
4.5.1 Aluminum Copper Sputtering Target Market Size and Y-o-Y Growth
4.5.2 Aluminum Copper Sputtering Target Market Absolute $ Opportunity
Chapter 5 Global Aluminum Copper Sputtering Target Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Aluminum Copper Sputtering Target Market Size Forecast by Type
5.2.1 Purity 99%
5.2.2 Purity 99.5%
5.2.3 Purity 99.9%
5.2.4 Purity 99.95%
5.2.5 Purity 99.99%
5.2.6 Purity 99.999%
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Aluminum Copper Sputtering Target Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Aluminum Copper Sputtering Target Market Size Forecast by Applications
6.2.1 Semiconductor
6.2.2 Chemical Vapor Deposition
6.2.3 Physical Vapor Deposition
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Aluminum Copper Sputtering Target Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Aluminum Copper Sputtering Target Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Aluminum Copper Sputtering Target Analysis and Forecast
9.1 Introduction
9.2 North America Aluminum Copper Sputtering Target Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Aluminum Copper Sputtering Target Market Size Forecast by Type
9.6.1 Purity 99%
9.6.2 Purity 99.5%
9.6.3 Purity 99.9%
9.6.4 Purity 99.95%
9.6.5 Purity 99.99%
9.6.6 Purity 99.999%
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Aluminum Copper Sputtering Target Market Size Forecast by Applications
9.10.1 Semiconductor
9.10.2 Chemical Vapor Deposition
9.10.3 Physical Vapor Deposition
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Aluminum Copper Sputtering Target Analysis and Forecast
10.1 Introduction
10.2 Europe Aluminum Copper Sputtering Target Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Aluminum Copper Sputtering Target Market Size Forecast by Type
10.6.1 Purity 99%
10.6.2 Purity 99.5%
10.6.3 Purity 99.9%
10.6.4 Purity 99.95%
10.6.5 Purity 99.99%
10.6.6 Purity 99.999%
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Aluminum Copper Sputtering Target Market Size Forecast by Applications
10.10.1 Semiconductor
10.10.2 Chemical Vapor Deposition
10.10.3 Physical Vapor Deposition
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Aluminum Copper Sputtering Target Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Aluminum Copper Sputtering Target Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Aluminum Copper Sputtering Target Market Size Forecast by Type
11.6.1 Purity 99%
11.6.2 Purity 99.5%
11.6.3 Purity 99.9%
11.6.4 Purity 99.95%
11.6.5 Purity 99.99%
11.6.6 Purity 99.999%
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Aluminum Copper Sputtering Target Market Size Forecast by Applications
11.10.1 Semiconductor
11.10.2 Chemical Vapor Deposition
11.10.3 Physical Vapor Deposition
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Aluminum Copper Sputtering Target Analysis and Forecast
12.1 Introduction
12.2 Latin America Aluminum Copper Sputtering Target Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Aluminum Copper Sputtering Target Market Size Forecast by Type
12.6.1 Purity 99%
12.6.2 Purity 99.5%
12.6.3 Purity 99.9%
12.6.4 Purity 99.95%
12.6.5 Purity 99.99%
12.6.6 Purity 99.999%
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Aluminum Copper Sputtering Target Market Size Forecast by Applications
12.10.1 Semiconductor
12.10.2 Chemical Vapor Deposition
12.10.3 Physical Vapor Deposition
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Aluminum Copper Sputtering Target Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Aluminum Copper Sputtering Target Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Aluminum Copper Sputtering Target Market Size Forecast by Type
13.6.1 Purity 99%
13.6.2 Purity 99.5%
13.6.3 Purity 99.9%
13.6.4 Purity 99.95%
13.6.5 Purity 99.99%
13.6.6 Purity 99.999%
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Aluminum Copper Sputtering Target Market Size Forecast by Applications
13.10.1 Semiconductor
13.10.2 Chemical Vapor Deposition
13.10.3 Physical Vapor Deposition
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Aluminum Copper Sputtering Target Market: Competitive Dashboard
14.2 Global Aluminum Copper Sputtering Target Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 American Elements
14.3.2 Kurt J. Lesker
14.3.3 Stanford Advanced Materials
14.3.4 MSE Supplies
14.3.5 QS Advanced Materials
14.3.6 Changsha Xinkang Advanced Materials Corporation
14.3.7 Edgetech Industries
