Market Overview:
The global aluminum silicon (AlSi) bonding wire market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for aluminum silicon (AlSi) bonding wire in various applications, such as automotive electronics, consumer electronics, power supplies, computing, industry and military/aerospace. In addition, the growing demand for miniaturization and higher performance in electronic devices is also contributing to the growth of the global aluminum silicon (AlSi) bonding wire market. However, fluctuations in raw material prices may restrain the growth of this market during the forecast period. Based on type, 10-20 μm segment is projected to lead the global aluminum silicon (AlSi) bonding wire market during 2018-2030 owing to its high usage in various applications such as automotive electronics and computing segments. By application type; automotive electronics segment is projected grow at highest CAGR over forecast period due miniaturization trend followed by other electronic devices manufacturers across globe .Regionally Asia Pacific accounted for largest share in 2017 and it is expected that this region will continue its dominance throughout forecast period due rising demand from countries such as China , Japan and South Korea .
 Bonding Wire Industry Outlook.svg)
Product Definition:
Aluminum Silicon (AlSi) Bonding Wire is a type of bonding wire that is made of aluminum and silicon. It is used to connect electronic components together, and it can also be used to create electrical circuits.
10-20 μm:
10-20 μm is the range of thickness for aluminum silicomer bonding wire in the market. It's a key component used in integrated circuits (IC) manufacturing and interconnecting electronic devices. The growth factor for this segment is high as compared to other segments, which can be attributed to increasing demand from IC industry coupled with rising technological advancements pertaining to thin film deposition technologies.
20-30 μm:
20-30 μm is the typical range of silicon wafer thickness for high volume manufacturing (HVM) applications. It has been observed that the optimum value of 20-30μm varies with process technology and equipment type used. For instance, in large volume production, a typical value of 20-30μm works well whereas in small scale production a thinner wafer is required ( below 20 - 30 μm).
Application Insights:
The automotive electronics application segment accounted for the largest volume share of over 30% in 2017. The growth can be attributed to the extensive usage of aluminum silicon bonding wire in this application as it helps reduce thermal conductivity, enhance dielectricity and capacitance, and improve signal reception. In addition, it improves antenna efficiency which aids in boosting overall performance.
Aluminum silicon provides a low-cost solution for power supply units (PSUs) manufacturers as it reduces costs by 20%. It also increases efficiency by around 10% which helps reduce carbon footprint during manufacturing process. Moreover, increasing demand from computing industry is expected to drive product demand over the forecast period owing to its high-frequency capability and enhanced heat dissipation properties resulting in higher product prices.
Regional Analysis:
Asia Pacific was the largest market in 2016 and is expected to continue leading over the forecast period. The region accounted for a share of more than 35% in 2016 and is anticipated to grow at a significant rate over the forecast period. This growth can be attributed to increasing production of electronic products such as smartphones, tablets, personal computers (PC), LEDs, etc., coupled with growing demand from key application sectors including automotive electronics, computing & laptops/desktops/netbooks, consumer electronics among others.
The aluminum silicon bonding wire industry has witnessed an upsurge in utilization across end-use industries such as aerospace & defense (AD) and industrial applications owing to its excellent electrical properties along with high thermal conductivity which makes it suitable for use in heat sinks or radiators of electronic devices such as computer systems or mobile phones among others. Increasing military expenditure by countries like China and India are also expected to drive product demand across Asia Pacific during the forecast period.
Growth Factors:
- Increasing demand for aluminum silicon bonding wire from the automotive and electronics industries due to its properties such as high strength, low weight, and resistance to corrosion.
- Growing popularity of aluminum silicon bonding wire in the aerospace industry due to its ability to withstand extreme temperatures and vibrations.
- Rising demand for semiconductor devices that require higher quality bonding wires, which is fueling the growth of the aluminum silicon bonding wire market.
- Technological advancements in manufacturing processes that are resulting in improved quality and performance of aluminum silicon bonding wires. 5) Growing investments by key players in research and development activities aimed at enhancing product offerings and expanding their customer base
Scope Of The Report
Report Attributes
Report Details
Report Title
Aluminum Silicon (AlSi) Bonding Wire Market Research Report
By Type
10-20 μm, 20-30 μm, 30-40 μm, 40-50 μm, 50-60 μm, 60-70 μm, 70-80 μm, 80-90 μm, 90-100 μm, Others
By Application
Automotive Electronics, Consumer Electronics, Power Supplies, Computing, Industry, Military/Aerospace, Others
By Companies
Heraeus, Tanaka, World Star Electronic Material Co.,Ltd., Ametek, Nichetech, Holdwell, Heraeus
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
163
Number of Tables & Figures
115
Customization Available
Yes, the report can be customized as per your need.
Global Aluminum Silicon (AlSi) Bonding Wire Market Report Segments:
The global Aluminum Silicon (AlSi) Bonding Wire market is segmented on the basis of:
Types
10-20 μm, 20-30 μm, 30-40 μm, 40-50 μm, 50-60 μm, 60-70 μm, 70-80 μm, 80-90 μm, 90-100 μm, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Power Supplies, Computing, Industry, Military/Aerospace, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus
- Tanaka
- World Star Electronic Material Co.,Ltd.
- Ametek
- Nichetech
- Holdwell
- Heraeus
 Bonding Wire Market Overview.svg)
Highlights of The Aluminum Silicon (AlSi) Bonding Wire Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 10-20 μm
- 20-30 μm
- 30-40 μm
- 40-50 μm
- 50-60 μm
- 60-70 μm
- 70-80 μm
- 80-90 μm
- 90-100 μm
- Others
- By Application:
- Automotive Electronics
- Consumer Electronics
- Power Supplies
- Computing
- Industry
- Military/Aerospace
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Aluminum Silicon (AlSi) Bonding Wire Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Bonding Wire Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Aluminum silicon bonding wire is a type of wire that is made up of an aluminum core and a silicon coating. The aluminum core provides the strength and durability of the wire, while the silicon coating makes it resistant to corrosion. This combination makes aluminum silicon bonding wire ideal for use in applications where resistance to corrosion is important, such as in water treatment systems or industrial processes.
Some of the key players operating in the aluminum silicon (alsi) bonding wire market are Heraeus, Tanaka, World Star Electronic Material Co.,Ltd., Ametek, Nichetech, Holdwell, Heraeus.
The aluminum silicon (alsi) bonding wire market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Aluminum Silicon (AlSi) Bonding Wire Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Aluminum Silicon (AlSi) Bonding Wire Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Aluminum Silicon (AlSi) Bonding Wire Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Aluminum Silicon (AlSi) Bonding Wire Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Aluminum Silicon (AlSi) Bonding Wire Market Size & Forecast, 2018-2028
4.5.1 Aluminum Silicon (AlSi) Bonding Wire Market Size and Y-o-Y Growth
4.5.2 Aluminum Silicon (AlSi) Bonding Wire Market Absolute $ Opportunity
Chapter 5 Global Aluminum Silicon (AlSi) Bonding Wire Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
5.2.1 10-20 μm
5.2.2 20-30 μm
5.2.3 30-40 μm
5.2.4 40-50 μm
5.2.5 50-60 μm
5.2.6 60-70 μm
5.2.7 70-80 μm
5.2.8 80-90 μm
5.2.9 90-100 μm
5.2.10 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Aluminum Silicon (AlSi) Bonding Wire Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
6.2.1 Automotive Electronics
6.2.2 Consumer Electronics
6.2.3 Power Supplies
6.2.4 Computing
6.2.5 Industry
6.2.6 Military/Aerospace
6.2.7 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Aluminum Silicon (AlSi) Bonding Wire Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Aluminum Silicon (AlSi) Bonding Wire Analysis and Forecast
9.1 Introduction
9.2 North America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
9.6.1 10-20 μm
9.6.2 20-30 μm
9.6.3 30-40 μm
9.6.4 40-50 μm
9.6.5 50-60 μm
9.6.6 60-70 μm
9.6.7 70-80 μm
9.6.8 80-90 μm
9.6.9 90-100 μm
9.6.10 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
9.10.1 Automotive Electronics
9.10.2 Consumer Electronics
9.10.3 Power Supplies
9.10.4 Computing
9.10.5 Industry
9.10.6 Military/Aerospace
9.10.7 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Aluminum Silicon (AlSi) Bonding Wire Analysis and Forecast
10.1 Introduction
10.2 Europe Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
10.6.1 10-20 μm
10.6.2 20-30 μm
10.6.3 30-40 μm
10.6.4 40-50 μm
10.6.5 50-60 μm
10.6.6 60-70 μm
10.6.7 70-80 μm
10.6.8 80-90 μm
10.6.9 90-100 μm
10.6.10 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
10.10.1 Automotive Electronics
10.10.2 Consumer Electronics
10.10.3 Power Supplies
10.10.4 Computing
10.10.5 Industry
10.10.6 Military/Aerospace
10.10.7 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Aluminum Silicon (AlSi) Bonding Wire Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
11.6.1 10-20 μm
11.6.2 20-30 μm
11.6.3 30-40 μm
11.6.4 40-50 μm
11.6.5 50-60 μm
11.6.6 60-70 μm
11.6.7 70-80 μm
11.6.8 80-90 μm
11.6.9 90-100 μm
11.6.10 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
11.10.1 Automotive Electronics
11.10.2 Consumer Electronics
11.10.3 Power Supplies
11.10.4 Computing
11.10.5 Industry
11.10.6 Military/Aerospace
11.10.7 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Aluminum Silicon (AlSi) Bonding Wire Analysis and Forecast
12.1 Introduction
12.2 Latin America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
12.6.1 10-20 μm
12.6.2 20-30 μm
12.6.3 30-40 μm
12.6.4 40-50 μm
12.6.5 50-60 μm
12.6.6 60-70 μm
12.6.7 70-80 μm
12.6.8 80-90 μm
12.6.9 90-100 μm
12.6.10 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
12.10.1 Automotive Electronics
12.10.2 Consumer Electronics
12.10.3 Power Supplies
12.10.4 Computing
12.10.5 Industry
12.10.6 Military/Aerospace
12.10.7 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Aluminum Silicon (AlSi) Bonding Wire Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Type
13.6.1 10-20 μm
13.6.2 20-30 μm
13.6.3 30-40 μm
13.6.4 40-50 μm
13.6.5 50-60 μm
13.6.6 60-70 μm
13.6.7 70-80 μm
13.6.8 80-90 μm
13.6.9 90-100 μm
13.6.10 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Aluminum Silicon (AlSi) Bonding Wire Market Size Forecast by Applications
13.10.1 Automotive Electronics
13.10.2 Consumer Electronics
13.10.3 Power Supplies
13.10.4 Computing
13.10.5 Industry
13.10.6 Military/Aerospace
13.10.7 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Aluminum Silicon (AlSi) Bonding Wire Market: Competitive Dashboard
14.2 Global Aluminum Silicon (AlSi) Bonding Wire Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Heraeus
14.3.2 Tanaka
14.3.3 World Star Electronic Material Co.,Ltd.
14.3.4 Ametek
14.3.5 Nichetech
14.3.6 Holdwell
14.3.7 Heraeus
