Market Overview:
The global semiconductor process tapes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors across various applications, and the growing trend of miniaturization in electronics devices. In addition, the development of new and innovative products by leading players is also contributing to the growth of this market. Based on type, UV tape accounted for a major share of the global semiconductor process tapes market in 2017. This segment is expected to grow at a CAGR of 6% during the forecast period from 2018 to 2030. Non-UV tape is also witnessing significant growth due its advantages such as low cost and easy handling over UV tape.
Product Definition:
A semiconductor process tape is a device that helps to produce semiconductor chips. It is made up of a number of thin films that are deposited on a substrate. The films are used to create the transistors, capacitors and other components that are found on microchips.
UV Tape:
UV tape, also known as UV process tapes or photoresist tapes, are used in the semiconductor industry for various applications such as packaging and protection of integrated circuits (IC), printed circuit boards (PCB) and other electronic products. The product is manufactured using polyester resin which has been coated with a thin layer of titanium dioxide.
Non-UV Tape:
Non-UV tape is a type of electronic component packaging that prevents the migration of chemicals from one side to another through an adhesive layer. It is widely used in United State Semiconductor (USM) process tapes owing to their excellent adhesion properties and low coefficient of thermal expansion.
Application Insights:
The global and United State semiconductor process tapes market by application is segmented into back-grinding, cutting, drilling, milling and other processes. The back-grinding process was the largest application segment in 2017. It is used to remove metal from a semiconductor wafer before it is sent to be further processed by another step in the manufacturing procedure. This operation requires precise grinding of the semiconductor chip so that it can be properly mounted on a circuit board or an electronic device without getting damaged or detached from its base.
Regional Analysis:
North America dominated the global market in 2017. The growth is attributed to the presence of a large number of semiconductor manufacturers in U.S. and continuous technological advancements in this industry over past few years have led to an increased demand for semiconductors, which has resulted into high product demand across North America region.
Asia Pacific is expected to be one of the fastest growing regions during the forecast period owing to increasing production facilities set up by various electronic device manufacturers such as Samsung Electronics Co., Ltd., Sony Corporation, LG Electronics Inc., and Fujifilm Holdings Corporation mainly due to low labor cost associated with this region as compared to other developed nations such as U.S., Germany, Japan etc.
Growth Factors:
- Increasing demand for semiconductor devices from the automotive, consumer electronics, and telecommunications industries
- Growing popularity of miniaturized and low-power semiconductor devices
- Proliferation of 3D printing technology in the manufacturing sector
- Rising demand for advanced packaging technologies in the semiconductor industry
- Emergence of new applications for semiconductor process tapes
Scope Of The Report
Report Attributes
Report Details
Report Title
and United State Semiconductor Process Tapes Market Research Report
By Type
UV Tape, Non-UV Tape
By Application
Back-grinding, Cutting
By Companies
Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang ZHANXIN Adhesive Materials Co, Shanghai Jingshen (Fine Coating) New Material Co, Shanghai Guk Tape Technology Co, Mitsui Chemicals Tohcello, Kunshan Boyi Xincheng Polymer Material Co
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global and United State Semiconductor Process Tapes Market Report Segments:
The global and United State Semiconductor Process Tapes market is segmented on the basis of:
Types
UV Tape, Non-UV Tape
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Back-grinding, Cutting
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Chemicals Tohcello
- Lintec
- Denka
- Nitto
- Furukawa Electric
- D&X
- AI Technology
- Taicang ZHANXIN Adhesive Materials Co
- Shanghai Jingshen (Fine Coating) New Material Co
- Shanghai Guk Tape Technology Co
- Mitsui Chemicals Tohcello
- Kunshan Boyi Xincheng Polymer Material Co
Highlights of The and United State Semiconductor Process Tapes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Tape
- Non-UV Tape
- By Application:
- Back-grinding
- Cutting
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the and United State Semiconductor Process Tapes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
United States Semiconductor Process Tapes are a type of tape used in the semiconductor industry to package and protect electronic components.
Some of the major players in the and united state semiconductor process tapes market are Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang ZHANXIN Adhesive Materials Co, Shanghai Jingshen (Fine Coating) New Material Co, Shanghai Guk Tape Technology Co, Mitsui Chemicals Tohcello, Kunshan Boyi Xincheng Polymer Material Co.
The and united state semiconductor process tapes market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 and United State Semiconductor Process Tapes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 and United State Semiconductor Process Tapes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 and United State Semiconductor Process Tapes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the and United State Semiconductor Process Tapes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global and United State Semiconductor Process Tapes Market Size & Forecast, 2020-2028
4.5.1 and United State Semiconductor Process Tapes Market Size and Y-o-Y Growth
4.5.2 and United State Semiconductor Process Tapes Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 UV Tape
5.2.2 Non-UV Tape
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Back-grinding
6.2.2 Cutting
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global and United State Semiconductor Process Tapes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 and United State Semiconductor Process Tapes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 UV Tape
9.6.2 Non-UV Tape
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Back-grinding
9.10.2 Cutting
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 UV Tape
10.6.2 Non-UV Tape
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Back-grinding
10.10.2 Cutting
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 UV Tape
11.6.2 Non-UV Tape
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Back-grinding
11.10.2 Cutting
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 UV Tape
12.6.2 Non-UV Tape
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Back-grinding
12.10.2 Cutting
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 UV Tape
13.6.2 Non-UV Tape
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Back-grinding
13.10.2 Cutting
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 and United State Semiconductor Process Tapes Market: Competitive Dashboard
14.2 Global and United State Semiconductor Process Tapes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsui Chemicals Tohcello
14.3.2 Lintec
14.3.3 Denka
14.3.4 Nitto
14.3.5 Furukawa Electric
14.3.6 D&X
14.3.7 AI Technology
14.3.8 Taicang ZHANXIN Adhesive Materials Co
14.3.9 Shanghai Jingshen (Fine Coating) New Material Co
14.3.10 Shanghai Guk Tape Technology Co
14.3.11 Mitsui Chemicals Tohcello
14.3.12 Kunshan Boyi Xincheng Polymer Material Co
