Market Overview:
The global automatic dicing system market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth of the market can be attributed to the increasing demand for semiconductor wafers and cutting hard materials, precision metal parts, ceramic components and MEMS. In addition, the growing demand for advanced electronic devices is also contributing to the growth of this market.
Product Definition:
An automatic dicing system is a machine that uses a diamond blade to cut semiconductor wafers into small pieces. The importance of an automatic dicing system is that it allows for the efficient and consistent cutting of semiconductor wafers into small pieces, which is necessary for many semiconductor applications.
Semi-automatic Dicing System:
Semi-automatic dicing system is used for cutting fruits and vegetables into uniform pieces. It is also known as manual or semi-automated equipment. This equipment has a number of advantages over the fully automatic systems such as less human intervention, low cost, and high efficiency which makes it suitable to be used in developing countries like India where labor costs are comparatively lower than developed countries.
Fully-automatic Dicing System:
Fully-automatic dicing system is used in automatic dicing system. It's a fully automatic process that requires no human intervention during the entire production cycle. Fully-automatic systems are designed to handle both large and small quantities of vegetables with high speed, accuracy, and minimal waste.
The fully-automatic dicing systems produce exact sizes of vegetables/fruits without any noticeable flaws such as bruises or blemishes which ensures premium quality final product for the end consumer.
Application Insights:
The others application segment includes dicing of plastics, engineering polymers and glass. Dicing of plastics is used to produce smaller pieces which are suitable for manufacturing consumer goods. Engineering polymers such as carbon fiber and aramid fiber are cut into small enough pieces so that they can be processed using traditional machinery. Dicing of glass is used to produce small enough chips so that they can be mounted in electronics devices or used in building materials. The aforementioned applications include cutting precision metal parts, ceramic components and microelectronics wafer or hard materials respectively.
Dicing semiconductor wafers & hard materials was the largest application segment accounting for a market share of over 40% in 2017 owing to its increasing use across several industries including medical, military & aerospace.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing market, registering a CAGR of XX% during the forecast period. The growth can be attributed to increasing demand for electronic products in countries such as China and India along with rising investments in semiconductor industry by various governments across these nations. Furthermore, growing automation and technological advancements are also expected to drive the regional market over the next eight years.
The European automatic dicing system market is anticipated to witness steady growth owing to its well-established electronics sector that has been making high demands of semiconductors across Europe for decades now.
Growth Factors:
- Increasing demand for semiconductor devices in automotive and consumer electronics industries
- Growing number of fabless companies and contract manufacturers
- Proliferation of 3D IC technology
- Rising demand for miniaturized and high-performance semiconductor devices
- Emergence of new applications such as Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Automatic Dicing System Market Research Report
By Type
Semi-automatic Dicing System, Fully-automatic Dicing System
By Application
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Ceramic Components, Dicing MEMS, Others
By Companies
DISCO, TOKYO SEIMITSU, Advanced Dicing Technologies (ADT), UKAM Industrial Superhard Tools, Dynatex International, Loadpoint, NPMT (NPM)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
141
Number of Tables & Figures
99
Customization Available
Yes, the report can be customized as per your need.
Global Automatic Dicing System Market Report Segments:
The global Automatic Dicing System market is segmented on the basis of:
Types
Semi-automatic Dicing System, Fully-automatic Dicing System
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Ceramic Components, Dicing MEMS, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DISCO
- TOKYO SEIMITSU
- Advanced Dicing Technologies (ADT)
- UKAM Industrial Superhard Tools
- Dynatex International
- Loadpoint
- NPMT (NPM)
Highlights of The Automatic Dicing System Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-automatic Dicing System
- Fully-automatic Dicing System
- By Application:
- Dicing Semiconductor Wafers and Cutting Hard Materials
- Cutting Precision Metal Parts
- Dicing Ceramic Components
- Dicing MEMS
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Automatic Dicing System Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
An Automatic Dicing System (ADS) is a computerized system that automatically divides and distributes work among multiple processors. The purpose of an ADS is to improve the efficiency and throughput of a data processing operation by dividing the workload among multiple processors.
Some of the key players operating in the automatic dicing system market are DISCO, TOKYO SEIMITSU, Advanced Dicing Technologies (ADT), UKAM Industrial Superhard Tools, Dynatex International, Loadpoint, NPMT (NPM).
The automatic dicing system market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Automatic Dicing System Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Automatic Dicing System Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Automatic Dicing System Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Automatic Dicing System Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Automatic Dicing System Market Size & Forecast, 2018-2028
4.5.1 Automatic Dicing System Market Size and Y-o-Y Growth
4.5.2 Automatic Dicing System Market Absolute $ Opportunity
Chapter 5 Global Automatic Dicing System Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Automatic Dicing System Market Size Forecast by Type
5.2.1 Semi-automatic Dicing System
5.2.2 Fully-automatic Dicing System
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Automatic Dicing System Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Automatic Dicing System Market Size Forecast by Applications
6.2.1 Dicing Semiconductor Wafers and Cutting Hard Materials
6.2.2 Cutting Precision Metal Parts
6.2.3 Dicing Ceramic Components
6.2.4 Dicing MEMS
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Automatic Dicing System Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Automatic Dicing System Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Automatic Dicing System Analysis and Forecast
9.1 Introduction
9.2 North America Automatic Dicing System Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Automatic Dicing System Market Size Forecast by Type
9.6.1 Semi-automatic Dicing System
9.6.2 Fully-automatic Dicing System
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Automatic Dicing System Market Size Forecast by Applications
9.10.1 Dicing Semiconductor Wafers and Cutting Hard Materials
9.10.2 Cutting Precision Metal Parts
9.10.3 Dicing Ceramic Components
9.10.4 Dicing MEMS
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Automatic Dicing System Analysis and Forecast
10.1 Introduction
10.2 Europe Automatic Dicing System Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Automatic Dicing System Market Size Forecast by Type
10.6.1 Semi-automatic Dicing System
10.6.2 Fully-automatic Dicing System
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Automatic Dicing System Market Size Forecast by Applications
10.10.1 Dicing Semiconductor Wafers and Cutting Hard Materials
10.10.2 Cutting Precision Metal Parts
10.10.3 Dicing Ceramic Components
10.10.4 Dicing MEMS
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Automatic Dicing System Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Automatic Dicing System Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Automatic Dicing System Market Size Forecast by Type
11.6.1 Semi-automatic Dicing System
11.6.2 Fully-automatic Dicing System
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Automatic Dicing System Market Size Forecast by Applications
11.10.1 Dicing Semiconductor Wafers and Cutting Hard Materials
11.10.2 Cutting Precision Metal Parts
11.10.3 Dicing Ceramic Components
11.10.4 Dicing MEMS
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Automatic Dicing System Analysis and Forecast
12.1 Introduction
12.2 Latin America Automatic Dicing System Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Automatic Dicing System Market Size Forecast by Type
12.6.1 Semi-automatic Dicing System
12.6.2 Fully-automatic Dicing System
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Automatic Dicing System Market Size Forecast by Applications
12.10.1 Dicing Semiconductor Wafers and Cutting Hard Materials
12.10.2 Cutting Precision Metal Parts
12.10.3 Dicing Ceramic Components
12.10.4 Dicing MEMS
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Automatic Dicing System Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Automatic Dicing System Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Automatic Dicing System Market Size Forecast by Type
13.6.1 Semi-automatic Dicing System
13.6.2 Fully-automatic Dicing System
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Automatic Dicing System Market Size Forecast by Applications
13.10.1 Dicing Semiconductor Wafers and Cutting Hard Materials
13.10.2 Cutting Precision Metal Parts
13.10.3 Dicing Ceramic Components
13.10.4 Dicing MEMS
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Automatic Dicing System Market: Competitive Dashboard
14.2 Global Automatic Dicing System Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DISCO
14.3.2 TOKYO SEIMITSU
14.3.3 Advanced Dicing Technologies (ADT)
14.3.4 UKAM Industrial Superhard Tools
14.3.5 Dynatex International
14.3.6 Loadpoint
14.3.7 NPMT (NPM)
