Market Overview:
The global back end of the line semiconductor equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices across different applications, such as foundry, memory, and IDM. In addition, technological advancements in semiconductor manufacturing are also fueling the demand for back end of the line semiconductor equipment. Based on type, the global back end of the line semiconductor equipment market is segmented into CVD (chemical vapor deposition), CMP (chemical mechanical planarization), coater developer, PVD (physical vapor deposition), metal etching, stepper and wet station. Among these segments, CVD held a major share in 2017 and is expected to maintain its dominance during the forecast period as well. This can be attributed to increasing adoption of this technology for depositing thin films on wafers that helps improve device performance and yield. Based on application, foundry accounted for a major share in 2017.
Product Definition:
Back-end of the line semiconductor equipment refers to the final stage in the manufacturing process of integrated circuits (ICs). This equipment is used to test and package ICs, which are then ready for shipment to customers or distributors. The back-end of the line is a critical part of the semiconductor manufacturing process, as any defects in packaged ICs can have a significant impact on product quality and reliability.
CVD:
The global Coronavirus Disease (CVD) was declared a pandemic by the World Health Organization in February 2018. The virus is spread through air-borne droplets and contact with an infected person can result in infection, thus causing CVD. The coronavirus outbreak has had a significant economic impact on countries across the globe as well as different sectors including tourism, business, trade and transport.
CMP:
CMP is short for chip-to-chip. It is a technology used to transfer data between two chips on the same integrated circuit or substrate without using any wires. CMP uses high speed and low power wireless techniques such as RF, infrared, and optical signals for data transmission. CMP equipment has applications in telecommunication, consumer electronics, industrial systems & automation and other sectors which are covered in this study including telecom sector.
Application Insights:
The foundry application segment accounted for the largest revenue share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for semiconductor equipment by various end-use industries including automotive, medical, aerospace & defense and construction among others.
Memory application segment was the second largest revenue contributor in 2017 owing to its wide applications across different industry verticals such as consumer electronics, telecommunication among others. The equipment includes various devices such as EMI filters, power supplies that are used during production of electronic products which require high precision and quality control thus driving the market growth over recent years.
The integrated device manufacturing (IDM) application segment is expected witness significant growth on account of rising demand from original equipment manufacturers (OEMs).
Regional Analysis:
North America dominated the global market in 2017. The growth of this region can be attributed to the presence of a large number of semiconductor equipment manufacturers and suppliers in the U.S. Moreover, increasing demand for smartphones and digital devices has led to an increase in demand for B2B LELO systems as well as B2C LELS equipment used by mobile network operators (MNOs).
Asia Pacific is expected to emerge as the fastest-growing regional market over the forecast period owing to rapid industrialization along with supportive government initiatives aimed at boosting manufacturing output within China and India. Furthermore, rising disposable income coupled with growing consumer awareness regarding advanced technologies such as automation is anticipated to drive regional growth over the next eight years.
Growth Factors:
- Increasing demand for semiconductor devices from consumer electronics and automotive industries
- Rising demand for semiconductor wafers from the LED market
- Growing popularity of 3D printing technology in the semiconductor industry
- Proliferation of next-generation technologies, such as 5G and Internet of Things (IoT)
- Emergence of new applications, such as artificial intelligence (AI) and machine learning
Scope Of The Report
Report Attributes
Report Details
Report Title
Back End of the Line Semiconductor Equipment Market Research Report
By Type
CVD, CMP, Coater Developer, PVD, Metal Etching, Stepper, Wet Station
By Application
Foundry, Memory, IDM
By Companies
Applied Materials, ASML, KLA-Tencor, Tokyo Electron Limited (TEL)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
196
Number of Tables & Figures
138
Customization Available
Yes, the report can be customized as per your need.
Global Back End of the Line Semiconductor Equipment Market Report Segments:
The global Back End of the Line Semiconductor Equipment market is segmented on the basis of:
Types
CVD, CMP, Coater Developer, PVD, Metal Etching, Stepper, Wet Station
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Foundry, Memory, IDM
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Applied Materials
- ASML
- KLA-Tencor
- Tokyo Electron Limited (TEL)
Highlights of The Back End of the Line Semiconductor Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- CVD
- CMP
- Coater Developer
- PVD
- Metal Etching
- Stepper
- Wet Station
- By Application:
- Foundry
- Memory
- IDM
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Back End of the Line Semiconductor Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Back end of the line semiconductor equipment is used in the manufacturing process of semiconductors. This equipment includes machines that clean and sort materials, cut and shape them into chips, and package them into finished products.
Some of the key players operating in the back end of the line semiconductor equipment market are Applied Materials, ASML, KLA-Tencor, Tokyo Electron Limited (TEL).
The back end of the line semiconductor equipment market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Back End of the Line Semiconductor Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Back End of the Line Semiconductor Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Back End of the Line Semiconductor Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Back End of the Line Semiconductor Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Back End of the Line Semiconductor Equipment Market Size & Forecast, 2018-2028
4.5.1 Back End of the Line Semiconductor Equipment Market Size and Y-o-Y Growth
4.5.2 Back End of the Line Semiconductor Equipment Market Absolute $ Opportunity
Chapter 5 Global Back End of the Line Semiconductor Equipment Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Back End of the Line Semiconductor Equipment Market Size Forecast by Type
5.2.1 CVD
5.2.2 CMP
5.2.3 Coater Developer
5.2.4 PVD
5.2.5 Metal Etching
5.2.6 Stepper
5.2.7 Wet Station
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Back End of the Line Semiconductor Equipment Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
6.2.1 Foundry
6.2.2 Memory
6.2.3 IDM
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Back End of the Line Semiconductor Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Back End of the Line Semiconductor Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Back End of the Line Semiconductor Equipment Analysis and Forecast
9.1 Introduction
9.2 North America Back End of the Line Semiconductor Equipment Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Back End of the Line Semiconductor Equipment Market Size Forecast by Type
9.6.1 CVD
9.6.2 CMP
9.6.3 Coater Developer
9.6.4 PVD
9.6.5 Metal Etching
9.6.6 Stepper
9.6.7 Wet Station
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
9.10.1 Foundry
9.10.2 Memory
9.10.3 IDM
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Back End of the Line Semiconductor Equipment Analysis and Forecast
10.1 Introduction
10.2 Europe Back End of the Line Semiconductor Equipment Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Back End of the Line Semiconductor Equipment Market Size Forecast by Type
10.6.1 CVD
10.6.2 CMP
10.6.3 Coater Developer
10.6.4 PVD
10.6.5 Metal Etching
10.6.6 Stepper
10.6.7 Wet Station
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
10.10.1 Foundry
10.10.2 Memory
10.10.3 IDM
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Back End of the Line Semiconductor Equipment Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Back End of the Line Semiconductor Equipment Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Back End of the Line Semiconductor Equipment Market Size Forecast by Type
11.6.1 CVD
11.6.2 CMP
11.6.3 Coater Developer
11.6.4 PVD
11.6.5 Metal Etching
11.6.6 Stepper
11.6.7 Wet Station
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
11.10.1 Foundry
11.10.2 Memory
11.10.3 IDM
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Back End of the Line Semiconductor Equipment Analysis and Forecast
12.1 Introduction
12.2 Latin America Back End of the Line Semiconductor Equipment Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Back End of the Line Semiconductor Equipment Market Size Forecast by Type
12.6.1 CVD
12.6.2 CMP
12.6.3 Coater Developer
12.6.4 PVD
12.6.5 Metal Etching
12.6.6 Stepper
12.6.7 Wet Station
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
12.10.1 Foundry
12.10.2 Memory
12.10.3 IDM
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Back End of the Line Semiconductor Equipment Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Back End of the Line Semiconductor Equipment Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Back End of the Line Semiconductor Equipment Market Size Forecast by Type
13.6.1 CVD
13.6.2 CMP
13.6.3 Coater Developer
13.6.4 PVD
13.6.5 Metal Etching
13.6.6 Stepper
13.6.7 Wet Station
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Back End of the Line Semiconductor Equipment Market Size Forecast by Applications
13.10.1 Foundry
13.10.2 Memory
13.10.3 IDM
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Back End of the Line Semiconductor Equipment Market: Competitive Dashboard
14.2 Global Back End of the Line Semiconductor Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Applied Materials
14.3.2 ASML
14.3.3 KLA-Tencor
14.3.4 Tokyo Electron Limited (TEL)
