Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Ballast ICs Market by Type (Surface Mount, Through Hole), By Application (Automotive, Consumer Electronics, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Ballast ICs Market by Type (Surface Mount, Through Hole), By Application (Automotive, Consumer Electronics, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 230513 4200 Electronics & Semiconductor 377 228 Pages 4.6 (32)
                                          

Market Overview:


The global ballast ICs market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for energy-efficient lighting solutions and the growing adoption of LED lighting. In addition, the increasing demand for smart lighting solutions is also contributing to the growth of this market. The global ballast ICs market can be segmented on the basis of type into surface mount and through hole ballast ICs. The surface mount segment is expected to grow at a higher CAGR than the through hole segment during the forecast period from 2018 to 2030. This can be attributed to its smaller form factor, which makes it suitable for use in compact devices such as smartphones and tablets. On the basis of application,the global ballast ICs market can be divided into automotive, consumer electronics, and others segments.


Global Ballast ICs Industry Outlook


Product Definition:


A ballast IC is a chip that regulates power to an electronic device. It ensures that the device receives a consistent amount of power, even when the supply voltage fluctuates. This is important for devices that require a stable power supply, such as LEDs or LCDs.


Surface Mount:


Surface Mount is a type of integrated circuit (IC) packaging in which the components are laid out in a grid on a single piece of silicon or plastic. The surface mount technology has been around for more than half a century and has changed very little since its inception. It is one of the oldest forms of chip packaging, along with through-hole and ball grid array (BGA) technologies.


Through Hole:


The through hole is the part of a drill bit that is inserted into the semiconductor to remove its cover. The size of the drill bit depends on two factors, first, how much current can safely flow through the device and second, how deep do you want to go? The smaller the drill bit is in comparison with chip size; current will have less chance to get out of control and it will be easier for manufacturing processes as there are more chances for things going wrong.


Application Insights:


Automotive was the largest application segment in 2017 and will continue to be so over the forecast period. Ballast ICs are used in various automotive applications such as headlamps, interior lighting, exterior lighting, powertrain control systems and body electronics. The growing importance of advanced driver-assistance systems (ADAS) is expected to drive the demand for ballast integrated circuits (BICs) over the forecast period.


The consumer electronics segment is anticipated to witness a CAGR of XX% from 2018 to 2030 owing to increasing use of ballast integrated chipsets in smart wearables such as fitness bands and smartwatches coupled with growing demand for LED TVs and other displays that use high brightness LEDs for better picture quality.


Regional Analysis:


North America dominated the global market in 2017. The region is expected to maintain its position during the forecast period. This can be attributed to increasing investments in new construction projects and favorable government initiatives for manufacturing electric vehicles, which will drive product demand over the next eight years.


Asia Pacific is anticipated to witness significant growth over the coming years owing to rising demand from end-use industries such as consumer electronics, automotive and others. Increasing disposable income of consumers coupled with rapid urbanization across emerging economies including China and India are some of the major factors driving regional growth.


Growth Factors:


  • Increasing demand for energy-efficient lighting solutions
  • Rising demand from the automotive sector
  • Growing popularity of LED lighting
  • Proliferation of smart buildings and IoT devices
  • Stringent government regulations on energy consumption

Scope Of The Report

Report Attributes

Report Details

Report Title

Ballast ICs Market Research Report

By Type

Surface Mount, Through Hole

By Application

Automotive, Consumer Electronics, Others

By Companies

TI, Infineon Technologies, STMicroelectronics, Intermatic, On Semiconductor, NXP Semiconductors, Analog Devices, TI

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

228

Number of Tables & Figures

160

Customization Available

Yes, the report can be customized as per your need.


Global Ballast ICs Market Report Segments:

The global Ballast ICs market is segmented on the basis of:

Types

Surface Mount, Through Hole

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Automotive, Consumer Electronics, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. TI
  2. Infineon Technologies
  3. STMicroelectronics
  4. Intermatic
  5. On Semiconductor
  6. NXP Semiconductors
  7. Analog Devices
  8. TI

Global Ballast ICs Market Overview


Highlights of The Ballast ICs Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Surface Mount
    2. Through Hole
  1. By Application:

    1. Automotive
    2. Consumer Electronics
    3. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Ballast ICs Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Ballast ICs Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Ballast ICs are a type of integrated circuit that is used to control the power and signal flow in electric vehicles. They are also known as voltage regulators, and they help to maintain the correct voltage levels in an electric vehicle's battery pack.

Some of the major players in the ballast ics market are TI, Infineon Technologies, STMicroelectronics, Intermatic, On Semiconductor, NXP Semiconductors, Analog Devices, TI.

The ballast ics market is expected to register a CAGR of 5.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Ballast ICs Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Ballast ICs Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Ballast ICs Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Ballast ICs Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Ballast ICs Market Size & Forecast, 2018-2028       4.5.1 Ballast ICs Market Size and Y-o-Y Growth       4.5.2 Ballast ICs Market Absolute $ Opportunity

Chapter 5 Global Ballast ICs Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2 Ballast ICs Market Size Forecast by Type
      5.2.1 Surface Mount
      5.2.2 Through Hole
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global Ballast ICs Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2 Ballast ICs Market Size Forecast by Applications
      6.2.1 Automotive
      6.2.2 Consumer Electronics
      6.2.3 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Ballast ICs Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Ballast ICs Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America Ballast ICs Analysis and Forecast
   9.1 Introduction
   9.2 North America Ballast ICs Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America Ballast ICs Market Size Forecast by Type
      9.6.1 Surface Mount
      9.6.2 Through Hole
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America Ballast ICs Market Size Forecast by Applications
      9.10.1 Automotive
      9.10.2 Consumer Electronics
      9.10.3 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe Ballast ICs Analysis and Forecast
   10.1 Introduction
   10.2 Europe Ballast ICs Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe Ballast ICs Market Size Forecast by Type
      10.6.1 Surface Mount
      10.6.2 Through Hole
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe Ballast ICs Market Size Forecast by Applications
      10.10.1 Automotive
      10.10.2 Consumer Electronics
      10.10.3 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific Ballast ICs Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific Ballast ICs Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific Ballast ICs Market Size Forecast by Type
      11.6.1 Surface Mount
      11.6.2 Through Hole
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific Ballast ICs Market Size Forecast by Applications
      11.10.1 Automotive
      11.10.2 Consumer Electronics
      11.10.3 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America Ballast ICs Analysis and Forecast
   12.1 Introduction
   12.2 Latin America Ballast ICs Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America Ballast ICs Market Size Forecast by Type
      12.6.1 Surface Mount
      12.6.2 Through Hole
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America Ballast ICs Market Size Forecast by Applications
      12.10.1 Automotive
      12.10.2 Consumer Electronics
      12.10.3 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA) Ballast ICs Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA) Ballast ICs Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA) Ballast ICs Market Size Forecast by Type
      13.6.1 Surface Mount
      13.6.2 Through Hole
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA) Ballast ICs Market Size Forecast by Applications
      13.10.1 Automotive
      13.10.2 Consumer Electronics
      13.10.3 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Ballast ICs Market: Competitive Dashboard
   14.2 Global Ballast ICs Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 TI
      14.3.2 Infineon Technologies
      14.3.3 STMicroelectronics
      14.3.4 Intermatic
      14.3.5 On Semiconductor
      14.3.6 NXP Semiconductors
      14.3.7 Analog Devices
      14.3.8 TI

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