Market Overview:
The global BGA solder ball market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturized and high-density electronic devices, and the growing trend of lead-free soldering. The global BGA solder ball market by type is segmented into lead solder balls and lead free solder balls. The lead free solder ball segment is expected to grow at a higher CAGR than the lead solder ball segment during the forecast period. This can be attributed to the increasing demand for environmentally friendly products and regulations mandating use of lead-free solders. The global BGA Solder Ball Market by application is divided into Lead-Free BGAs Package and Lead BGAs Package segments. The Lead Free BGAs Package segment is projected to grow at a higher rate than the Lead BGAs Package duringthe forecast period, owingto increased adoption of these packages in consumer electronics applications such as smartphones, tablets, laptops, etc.
Product Definition:
A solder ball is a small, spherical mass of solder. BGA solder balls are used to attach integrated circuits (ICs) to circuit boards. They provide a reliable connection and help distribute the heat from the ICs evenly across the circuit board.
Lead Solder Ball:
Lead solder ball is a type of electronic component that is used to join two or more printed circuit boards. It consists of an inner core made up of lead and an outer shell made from plastic. The plastic shell acts as a mold which holds the molten pooling solder in its place, while the lead fillings act as soldering irons to join the PCBs.
Lead Free Solder Ball:
Lead free solder ball is a special type of soldering equipment which contains no lead. It is majorly used in Ball Grid Array (BGA) applications. BGA package consists of multiple small electrical components that are packed together and require specific types of soldering techniques for the installation process.
Application Insights:
The lead-free BGA package segment accounted for the largest revenue share of over 60% in 2017. The demand is expected to be driven by its use in high-end smartphones, tablets and laptops from major manufacturers such as Apple Inc., Lenovo, HP Inc., Dell Technologies, and Xiaomi Corporation. In addition, this solder ball is used for assembling printed circuit boards (PCB) that are employed in various electronic products such as mobile phones and computers.
Lead BGA package segment is projected to witness significant growth over the forecast period owing to increasing adoption of these packages by original equipment manufacturers (OEMs). These packages offer several benefits including low power consumption along with enhanced thermal management capabilities which help reduce heat generation within a device thus lowering operational costs associated with manufacturing devices. Furthermore, they also provide improved signal quality along with enhanced thermal management capabilities which help reduce heat generation within a device thus lowering operational costs associated with manufacturing devices.
Regional Analysis:
Asia Pacific is expected to be the fastest growing regional market with a CAGR of XX% from 2018 to 2030 owing to increasing demand for electronic devices in this region. The growth can be attributed to the presence of large electronics manufacturing companies such as Wintec Corporation, Quanta Computer Inc., and Hon Hai Precision Industry Company Ltd. (also known as Foxconn) in this region which is responsible for manufacturing various electronic products including smartphones, laptops, personal computers etc.
North America and Europe are also anticipated to witness significant growth over the forecast period owing both regions being major contributors towards technological advancements across all industries including electronics industry resulting into high demand for BGA packages in these regions especially within end-use industries such as aerospace & defense.
Growth Factors:
- Increasing demand from the automotive and consumer electronics industries
- Growing popularity of miniaturized and high-density electronic devices
- Proliferation of advanced packaging technologies
- Rising demand for lead-free solder balls
- Stringent environmental regulations
Scope Of The Report
Report Attributes
Report Details
Report Title
BGA Solder Ball Market Research Report
By Type
Lead Solder Ball, Lead Free Solder Ball
By Application
Lead-Free BGA Package, Lead BGA Package
By Companies
Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Nippon Micrometal, Indium Corporation, Senju Metal, SK Hynix, MacDermid Alpha Electronics Solutions
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
129
Number of Tables & Figures
91
Customization Available
Yes, the report can be customized as per your need.
Global BGA Solder Ball Market Report Segments:
The global BGA Solder Ball market is segmented on the basis of:
Types
Lead Solder Ball, Lead Free Solder Ball
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Lead-Free BGA Package, Lead BGA Package
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology
- Nippon Micrometal
- Indium Corporation
- Senju Metal
- SK Hynix
- MacDermid Alpha Electronics Solutions
Highlights of The BGA Solder Ball Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Solder Ball
- Lead Free Solder Ball
- By Application:
- Lead-Free BGA Package
- Lead BGA Package
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the BGA Solder Ball Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
BGA solder balls are small, round pieces of solder that are used to attach components together on a circuit board. They are made out of a metal such as lead or tin and have a ball-shaped head.
Some of the major players in the bga solder ball market are Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Nippon Micrometal, Indium Corporation, Senju Metal, SK Hynix, MacDermid Alpha Electronics Solutions.
The bga solder ball market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 BGA Solder Ball Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 BGA Solder Ball Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 BGA Solder Ball Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the BGA Solder Ball Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global BGA Solder Ball Market Size & Forecast, 2018-2028
4.5.1 BGA Solder Ball Market Size and Y-o-Y Growth
4.5.2 BGA Solder Ball Market Absolute $ Opportunity
Chapter 5 Global BGA Solder Ball Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 BGA Solder Ball Market Size Forecast by Type
5.2.1 Lead Solder Ball
5.2.2 Lead Free Solder Ball
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global BGA Solder Ball Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 BGA Solder Ball Market Size Forecast by Applications
6.2.1 Lead-Free BGA Package
6.2.2 Lead BGA Package
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global BGA Solder Ball Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 BGA Solder Ball Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America BGA Solder Ball Analysis and Forecast
9.1 Introduction
9.2 North America BGA Solder Ball Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America BGA Solder Ball Market Size Forecast by Type
9.6.1 Lead Solder Ball
9.6.2 Lead Free Solder Ball
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America BGA Solder Ball Market Size Forecast by Applications
9.10.1 Lead-Free BGA Package
9.10.2 Lead BGA Package
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe BGA Solder Ball Analysis and Forecast
10.1 Introduction
10.2 Europe BGA Solder Ball Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe BGA Solder Ball Market Size Forecast by Type
10.6.1 Lead Solder Ball
10.6.2 Lead Free Solder Ball
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe BGA Solder Ball Market Size Forecast by Applications
10.10.1 Lead-Free BGA Package
10.10.2 Lead BGA Package
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific BGA Solder Ball Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific BGA Solder Ball Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific BGA Solder Ball Market Size Forecast by Type
11.6.1 Lead Solder Ball
11.6.2 Lead Free Solder Ball
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific BGA Solder Ball Market Size Forecast by Applications
11.10.1 Lead-Free BGA Package
11.10.2 Lead BGA Package
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America BGA Solder Ball Analysis and Forecast
12.1 Introduction
12.2 Latin America BGA Solder Ball Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America BGA Solder Ball Market Size Forecast by Type
12.6.1 Lead Solder Ball
12.6.2 Lead Free Solder Ball
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America BGA Solder Ball Market Size Forecast by Applications
12.10.1 Lead-Free BGA Package
12.10.2 Lead BGA Package
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) BGA Solder Ball Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) BGA Solder Ball Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) BGA Solder Ball Market Size Forecast by Type
13.6.1 Lead Solder Ball
13.6.2 Lead Free Solder Ball
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) BGA Solder Ball Market Size Forecast by Applications
13.10.1 Lead-Free BGA Package
13.10.2 Lead BGA Package
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 BGA Solder Ball Market: Competitive Dashboard
14.2 Global BGA Solder Ball Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Senju Metal
14.3.2 DS HiMetal
14.3.3 MKE
14.3.4 YCTC
14.3.5 Accurus
14.3.6 PMTC
14.3.7 Shanghai hiking solder material
14.3.8 Shenmao Technology
14.3.9 Nippon Micrometal
14.3.10 Indium Corporation
14.3.11 Senju Metal
14.3.12 SK Hynix
14.3.13 MacDermid Alpha Electronics Solutions
