Market Overview:
The global BGA solder spheres market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturized and high-density electronic devices, and the growing trend of using lead-free solder spheres. In terms of type, the lead solder sphere segment is expected to hold a larger share of the global BGA solder sphere market during the forecast period. This can be attributed to their low melting point and superior electrical conductivity as compared to lead-free solder spheres.
Product Definition:
BGA solder spheres are small, round balls of solder that are used to attach a BGA chip to a printed circuit board (PCB). They are typically made from lead-free alloys and have a diameter of approximately 0.8 mm.
The use of BGA solder spheres is important because they provide an efficient and reliable way to attach the chip to the PCB. The balls distribute the heat evenly across the surface of the chip, which helps prevent damage and allows for better thermal dissipation.
Lead Solder Spheres:
Lead solder spheres are used in the lead-free soldering process. They are small, hollow balls made from pure tin and have a diameter of approximately 0.6mm. Lead solder spheres can be used with both Sn-Bi alloy andSn-Pb alloy solders as they have high melting points ranging between 260°C to 270 °C.
Lead Free Solder Spheres:
Lead free solder spheres are specially designed for high-density circuit boards. These solder spheres have a lower melting point and they allow better contact between the soldering iron and the PCB surface, which results in improved thermal management during soldering. Lead free solder spheres also provide mechanical stability to the lead-free assembly due to its enhanced mechanical strength properties as compared to traditional leaded assemblies.
Application Insights:
Lead-free solder spheres are majorly used in BGA and CSP & WLCSP applications. The growing demand for lead-free products in consumer electronics, especially mobile phones, is expected to drive the segment growth over the forecast period. Moreover, increasing use of BGA components in communication equipment such as cell phones and modems is anticipated to fuel the demand for solder balls during the study period.
Flip-chip solder sphere has been witnessing significant growth due to its rising adoption across various end-use industries including telecommunication equipment and personal computers among others. Increasing number of FlipChip integrated circuits (ICs) have been driving their sales which eventually benefits market growth across geographies over a span of time.
Regional Analysis:
Asia Pacific is expected to be the fastest growing regional market with a CAGR of XX% from 2018 to 2030 owing to increasing demand for electronic devices in this region. Increasing population and rising living standards have resulted in an increase in the number of consumer electronics products, which will drive the growth further. The presence of key manufacturers such as Infineon technologies; Qualcomm Inc.; Broadcom Inc.; and Texas Instruments has led to high product penetration across this region, thereby driving its demand over the forecast period.
Europe was estimated as one of the largest markets for BGA solder spheres due to stringent regulations regarding environmental impact associated with manufacturing processes adopted by various companies manufacturing electronic components such as semiconductors and chipsets used in computer systems etc.
Growth Factors:
- Increasing demand from the automotive and consumer electronics industries
- Growing popularity of miniaturized and high-density electronic devices
- Rising demand for lead-free solder spheres
- Proliferation of advanced packaging technologies
- Stringent environmental regulations
Scope Of The Report
Report Attributes
Report Details
Report Title
BGA Solder Spheres Market Research Report
By Type
Lead Solder Spheres, Lead Free Solder Spheres
By Application
BGA, CSP & WLCSP, Flip-Chip, Others
By Companies
Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Senju Metal
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
183
Number of Tables & Figures
129
Customization Available
Yes, the report can be customized as per your need.
Global BGA Solder Spheres Market Report Segments:
The global BGA Solder Spheres market is segmented on the basis of:
Types
Lead Solder Spheres, Lead Free Solder Spheres
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
BGA, CSP & WLCSP, Flip-Chip, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Nippon Micrometal
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology
- Senju Metal
Highlights of The BGA Solder Spheres Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Solder Spheres
- Lead Free Solder Spheres
- By Application:
- BGA
- CSP & WLCSP
- Flip-Chip
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the BGA Solder Spheres Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
BGA solder spheres are small, round balls of solder that are used to join electronic components together. They are made from a metal such as lead or tin and have a diameter of about 0.5 inches (12.7 mm).
Some of the major companies in the bga solder spheres market are Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Senju Metal.
The bga solder spheres market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 BGA Solder Spheres Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 BGA Solder Spheres Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 BGA Solder Spheres Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the BGA Solder Spheres Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global BGA Solder Spheres Market Size & Forecast, 2018-2028
4.5.1 BGA Solder Spheres Market Size and Y-o-Y Growth
4.5.2 BGA Solder Spheres Market Absolute $ Opportunity
Chapter 5 Global BGA Solder Spheres Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 BGA Solder Spheres Market Size Forecast by Type
5.2.1 Lead Solder Spheres
5.2.2 Lead Free Solder Spheres
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global BGA Solder Spheres Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 BGA Solder Spheres Market Size Forecast by Applications
6.2.1 BGA
6.2.2 CSP & WLCSP
6.2.3 Flip-Chip
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global BGA Solder Spheres Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 BGA Solder Spheres Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America BGA Solder Spheres Analysis and Forecast
9.1 Introduction
9.2 North America BGA Solder Spheres Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America BGA Solder Spheres Market Size Forecast by Type
9.6.1 Lead Solder Spheres
9.6.2 Lead Free Solder Spheres
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America BGA Solder Spheres Market Size Forecast by Applications
9.10.1 BGA
9.10.2 CSP & WLCSP
9.10.3 Flip-Chip
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe BGA Solder Spheres Analysis and Forecast
10.1 Introduction
10.2 Europe BGA Solder Spheres Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe BGA Solder Spheres Market Size Forecast by Type
10.6.1 Lead Solder Spheres
10.6.2 Lead Free Solder Spheres
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe BGA Solder Spheres Market Size Forecast by Applications
10.10.1 BGA
10.10.2 CSP & WLCSP
10.10.3 Flip-Chip
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific BGA Solder Spheres Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific BGA Solder Spheres Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific BGA Solder Spheres Market Size Forecast by Type
11.6.1 Lead Solder Spheres
11.6.2 Lead Free Solder Spheres
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific BGA Solder Spheres Market Size Forecast by Applications
11.10.1 BGA
11.10.2 CSP & WLCSP
11.10.3 Flip-Chip
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America BGA Solder Spheres Analysis and Forecast
12.1 Introduction
12.2 Latin America BGA Solder Spheres Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America BGA Solder Spheres Market Size Forecast by Type
12.6.1 Lead Solder Spheres
12.6.2 Lead Free Solder Spheres
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America BGA Solder Spheres Market Size Forecast by Applications
12.10.1 BGA
12.10.2 CSP & WLCSP
12.10.3 Flip-Chip
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) BGA Solder Spheres Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) BGA Solder Spheres Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) BGA Solder Spheres Market Size Forecast by Type
13.6.1 Lead Solder Spheres
13.6.2 Lead Free Solder Spheres
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) BGA Solder Spheres Market Size Forecast by Applications
13.10.1 BGA
13.10.2 CSP & WLCSP
13.10.3 Flip-Chip
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 BGA Solder Spheres Market: Competitive Dashboard
14.2 Global BGA Solder Spheres Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Senju Metal
14.3.2 DS HiMetal
14.3.3 MKE
14.3.4 YCTC
14.3.5 Nippon Micrometal
14.3.6 Accurus
14.3.7 PMTC
14.3.8 Shanghai hiking solder material
14.3.9 Shenmao Technology
14.3.10 Senju Metal
