Market Overview:
The global bonding metal wire market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor packaging and PCBs, and the growing trend of miniaturization in electronic devices. In terms of type, the aluminum bonding wires segment is expected to grow at a higher CAGR than other segments during the forecast period. This can be attributed to its properties such as low weight, high strength-to-weight ratio, and corrosion resistance. In terms of application, the PCB segment is expected to grow at a higher CAGR than other segments during the forecast period.
Product Definition:
Bonding metal wire is a welding process in which two pieces of metal are joined together by melting their surfaces and pressing them together. It is used to create strong, permanent joints between metals. The importance of bonding metal wire lies in its ability to create durable, reliable joints between different types of metals.
Aluminum Bonding Wires:
Aluminum bonding wires are used in the metal wire bonding market. It is a thin, aluminum-based alloy which has excellent electrical properties such as high resistivity and inductivity. Aluminum has low thermal expansion property; therefore it is used for making wires for heat sensitive applications such as semiconductors and printed circuit boards (PCB).
Copper Bonding Wires:
Copper bonding wires and it's usage in bonding metal wire market is a new term which came into existence only after the introduction of copper alloy wires. These are used for soldering purposes on account of their high thermal conductivity, low melting point, and ability to form strong bonds with metals. They have applications in electronics as well as electrical industries owing to properties such as small size (smaller than width of human hair), flexibility, lightweight along with resistance to corrosion & oxidation.
Application Insights:
PCB was the largest application segment in 2017 and is projected to maintain its dominance over the forecast period. Bonding wires are widely used in electronic packaging applications as they offer high thermal resistance, excellent electrical conductivity, and corrosion resistance. These products help reduce heat dissipation from chipsets by providing a path for dissipating energy through wire bonds.
The other application segment includes medical equipment & devices, aerospace & defense equipment, industrial machinery & tools assembly etc. In these industries metal wires are used to provide structural strength and durability to various components such as armsature of machines or robotic systems; hoses; gaskets; valves; pipes etc., which are made using plastic or composite materials because of their low weight compared to metals.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to rising investments in various industries such as electronics, automotive, and energy & power. In 2017, Asia Pacific accounted for a share of more than 50% of global manufacturing activities due to low labor costs and easy availability of land. These factors are anticipated to boost demand for electronic products in this region which will subsequently drive market growth over the next eight years.
Europe is also likely to witness significant growth during the same period owing to stringent regulations by regulatory bodies such as ECHA regarding environmental impacts caused during metal mining and smelting process along with strict laws against toxic materials used in manufacturing processes have resulted in favoring non-toxic alternatives like bonding metals wire that do not cause harm or adverse effects on surrounding areas or environment at large thus driving industry growth across this region as well.
Growth Factors:
- Increasing demand from the automotive and electrical industries for bonding metal wire
- Growing popularity of advanced composites and alloys in various end-use applications
- Rising investments in research and development activities for new bonding metal wire products
- Proliferation of automated manufacturing processes that require high-quality bonding metal wires
- Increasing demand from developing countries for lightweight, durable, and efficient bonded metals
Scope Of The Report
Report Attributes
Report Details
Report Title
Bonding Metal Wire Market Research Report
By Type
Aluminum Bonding Wires, Copper Bonding Wires, Others
By Application
Semiconductor Packaging, PCB, Other
By Companies
Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
191
Number of Tables & Figures
134
Customization Available
Yes, the report can be customized as per your need.
Global Bonding Metal Wire Market Report Segments:
The global Bonding Metal Wire market is segmented on the basis of:
Types
Aluminum Bonding Wires, Copper Bonding Wires, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor Packaging, PCB, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus
- Tanaka
- Sumitomo Metal Mining
- MK Electron
- AMETEK
- Doublink Solders
- Yantai Zhaojin Kanfort
- Tatsuta Electric Wire & Cable
- Kangqiang Electronics
- The Prince & Izant
Highlights of The Bonding Metal Wire Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Aluminum Bonding Wires
- Copper Bonding Wires
- Others
- By Application:
- Semiconductor Packaging
- PCB
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Bonding Metal Wire Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Bonding metal wire is a process of joining two pieces of metal by heating the wire and then pressing it into the other piece. The heat melts the wires together, making a strong bond.
Some of the major companies in the bonding metal wire market are Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant.
The bonding metal wire market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Bonding Metal Wire Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Bonding Metal Wire Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Bonding Metal Wire Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Bonding Metal Wire Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Bonding Metal Wire Market Size & Forecast, 2020-2028
4.5.1 Bonding Metal Wire Market Size and Y-o-Y Growth
4.5.2 Bonding Metal Wire Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Aluminum Bonding Wires
5.2.2 Copper Bonding Wires
5.2.3 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Semiconductor Packaging
6.2.2 PCB
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Bonding Metal Wire Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Bonding Metal Wire Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Aluminum Bonding Wires
9.6.2 Copper Bonding Wires
9.6.3 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Semiconductor Packaging
9.10.2 PCB
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Aluminum Bonding Wires
10.6.2 Copper Bonding Wires
10.6.3 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Semiconductor Packaging
10.10.2 PCB
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Aluminum Bonding Wires
11.6.2 Copper Bonding Wires
11.6.3 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Semiconductor Packaging
11.10.2 PCB
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Aluminum Bonding Wires
12.6.2 Copper Bonding Wires
12.6.3 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Semiconductor Packaging
12.10.2 PCB
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Aluminum Bonding Wires
13.6.2 Copper Bonding Wires
13.6.3 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Semiconductor Packaging
13.10.2 PCB
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Bonding Metal Wire Market: Competitive Dashboard
14.2 Global Bonding Metal Wire Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Heraeus
14.3.2 Tanaka
14.3.3 Sumitomo Metal Mining
14.3.4 MK Electron
14.3.5 AMETEK
14.3.6 Doublink Solders
14.3.7 Yantai Zhaojin Kanfort
14.3.8 Tatsuta Electric Wire & Cable
14.3.9 Kangqiang Electronics
14.3.10 The Prince & Izant
