Market Overview:
The global bonding ribbons market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for bonding ribbons in automotive electronics, consumer electronics, power supplies, computing, and industry applications. In addition, the growing demand for bonding ribbons in military/aerospace and other applications is also contributing to the growth of the global bonding ribbons market. Based on type, the global bonding ribbons market can be segmented into gold bonding ribbon, copper bonding ribbon, silver binding ribbon Palladium coated copper binding ribbon), and others.
Product Definition:
Bonding Ribbons are thin, flexible ribbons used to bond the edges of two pieces of material together. They are often used in fabric construction, where they are sandwiched between the fabrics and then sewn or glued in place. Bonding Ribbons help to prevent fraying and make a stronger seam.
Gold Bonding Ribbons:
Gold bonding ribbons are used in the packaging industry for labeling or printing on various containers and products. It is also used as a decorative element in the packaging industry. The growth of this market can be attributed to factors such as increasing demand from emerging economies, rising disposable income, and changing lifestyles of consumers which have led to an increase in consumption patterns for personal care products such as cosmetics & toiletries.
Copper Bonding Ribbons:
Copper bonding ribbons are thin, flexible copper wires that are wound into a tight spiral and then laminated with plastic. The end of the ribbon is sealed by soldering or by heat-sealing. Copper bonding ribbons can be used for several applications in electronics such as wire bonders, cable laminates, printed circuit boards (PCB), and others.
Application Insights:
The automotive electronics application segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. Automotive electronic components are sensitive to heat, moisture, and other environmental factors. They can be damaged by exposure to such elements. The gold bonding ribbons are widely used in this industry as they provide excellent thermal conductivity which helps prevent damage of components caused by overheating or corrosion due to moisture penetration into electronic parts.
The consumer electronics application segment is expected witness a CAGR of XX% from 2018 to 2030 owing primarilyto increasing demand for high-tech products coupled with rising disposable income levels across various regions including Asia Pacific and North America.
Regional Analysis:
North America dominated the global market in 2017. The region is expected to witness a growth rate of 5.6% over the forecast period, owing to increasing demand for electronic products and growing automotive industry in Mexico and Canada. Europe is also anticipated to be one of the key regional markets over the next eight years due to high product demand from various application segments including consumer electronics, computing, automotive electronics & power supplies.
Asia Pacific is projected to register significant growth during the forecast period owing to rising investments by foreign companies in India and China on account of low labor costs as compared with other regions coupled with favorable government policies regarding FDI/MNCs are some factors that have contributed towards rapid industrialization across these countries which has led towards increased product demand across several industries such as aerospace & defense, manufacturing equipment etc.
Growth Factors:
- Increasing demand from end-use industries such as automotive, construction, and electrical & electronics
- Rising popularity of bonding ribbons in Asia Pacific region
- Growing demand for high-performance bonding ribbons
- Technological advancements in bonding ribbon manufacturing process
- Rising trend of miniaturization in electronic devices
Scope Of The Report
Report Attributes
Report Details
Report Title
Bonding Ribbons Market Research Report
By Type
Gold Bonding Ribbons, Copper Bonding Ribbons, Silver Bonding Ribbons, Palladium Coated Copper Bonding Ribbons, Others
By Application
Automotive Electronics, Consumer Electronics, Power Supplies, Computing, Industry, Military/Aerospace, Others
By Companies
Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Heraeus
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
153
Number of Tables & Figures
108
Customization Available
Yes, the report can be customized as per your need.
Global Bonding Ribbons Market Report Segments:
The global Bonding Ribbons market is segmented on the basis of:
Types
Gold Bonding Ribbons, Copper Bonding Ribbons, Silver Bonding Ribbons, Palladium Coated Copper Bonding Ribbons, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Power Supplies, Computing, Industry, Military/Aerospace, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus
- Tanaka
- Sumitomo Metal Mining
- MK Electron
- AMETEK
- Doublink Solders
- Yantai Zhaojin Kanfort
- Tatsuta Electric Wire & Cable
- Kangqiang Electronics
- The Prince & Izant
- Heraeus
Highlights of The Bonding Ribbons Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Gold Bonding Ribbons
- Copper Bonding Ribbons
- Silver Bonding Ribbons
- Palladium Coated Copper Bonding Ribbons
- Others
- By Application:
- Automotive Electronics
- Consumer Electronics
- Power Supplies
- Computing
- Industry
- Military/Aerospace
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Bonding Ribbons Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Bonding ribbons are a type of adhesive that is used to attach two pieces of material together. They are often used in the construction industry, where they are used to connect metal plates or sheets. Bonding ribbons can also be found in other applications, such as packaging and manufacturing.
Some of the key players operating in the bonding ribbons market are Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Heraeus.
The bonding ribbons market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Bonding Ribbons Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Bonding Ribbons Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Bonding Ribbons Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Bonding Ribbons Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Bonding Ribbons Market Size & Forecast, 2018-2028
4.5.1 Bonding Ribbons Market Size and Y-o-Y Growth
4.5.2 Bonding Ribbons Market Absolute $ Opportunity
Chapter 5 Global Bonding Ribbons Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Bonding Ribbons Market Size Forecast by Type
5.2.1 Gold Bonding Ribbons
5.2.2 Copper Bonding Ribbons
5.2.3 Silver Bonding Ribbons
5.2.4 Palladium Coated Copper Bonding Ribbons
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Bonding Ribbons Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Bonding Ribbons Market Size Forecast by Applications
6.2.1 Automotive Electronics
6.2.2 Consumer Electronics
6.2.3 Power Supplies
6.2.4 Computing
6.2.5 Industry
6.2.6 Military/Aerospace
6.2.7 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Bonding Ribbons Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Bonding Ribbons Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Bonding Ribbons Analysis and Forecast
9.1 Introduction
9.2 North America Bonding Ribbons Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Bonding Ribbons Market Size Forecast by Type
9.6.1 Gold Bonding Ribbons
9.6.2 Copper Bonding Ribbons
9.6.3 Silver Bonding Ribbons
9.6.4 Palladium Coated Copper Bonding Ribbons
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Bonding Ribbons Market Size Forecast by Applications
9.10.1 Automotive Electronics
9.10.2 Consumer Electronics
9.10.3 Power Supplies
9.10.4 Computing
9.10.5 Industry
9.10.6 Military/Aerospace
9.10.7 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Bonding Ribbons Analysis and Forecast
10.1 Introduction
10.2 Europe Bonding Ribbons Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Bonding Ribbons Market Size Forecast by Type
10.6.1 Gold Bonding Ribbons
10.6.2 Copper Bonding Ribbons
10.6.3 Silver Bonding Ribbons
10.6.4 Palladium Coated Copper Bonding Ribbons
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Bonding Ribbons Market Size Forecast by Applications
10.10.1 Automotive Electronics
10.10.2 Consumer Electronics
10.10.3 Power Supplies
10.10.4 Computing
10.10.5 Industry
10.10.6 Military/Aerospace
10.10.7 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Bonding Ribbons Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Bonding Ribbons Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Bonding Ribbons Market Size Forecast by Type
11.6.1 Gold Bonding Ribbons
11.6.2 Copper Bonding Ribbons
11.6.3 Silver Bonding Ribbons
11.6.4 Palladium Coated Copper Bonding Ribbons
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Bonding Ribbons Market Size Forecast by Applications
11.10.1 Automotive Electronics
11.10.2 Consumer Electronics
11.10.3 Power Supplies
11.10.4 Computing
11.10.5 Industry
11.10.6 Military/Aerospace
11.10.7 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Bonding Ribbons Analysis and Forecast
12.1 Introduction
12.2 Latin America Bonding Ribbons Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Bonding Ribbons Market Size Forecast by Type
12.6.1 Gold Bonding Ribbons
12.6.2 Copper Bonding Ribbons
12.6.3 Silver Bonding Ribbons
12.6.4 Palladium Coated Copper Bonding Ribbons
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Bonding Ribbons Market Size Forecast by Applications
12.10.1 Automotive Electronics
12.10.2 Consumer Electronics
12.10.3 Power Supplies
12.10.4 Computing
12.10.5 Industry
12.10.6 Military/Aerospace
12.10.7 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Bonding Ribbons Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Bonding Ribbons Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Bonding Ribbons Market Size Forecast by Type
13.6.1 Gold Bonding Ribbons
13.6.2 Copper Bonding Ribbons
13.6.3 Silver Bonding Ribbons
13.6.4 Palladium Coated Copper Bonding Ribbons
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Bonding Ribbons Market Size Forecast by Applications
13.10.1 Automotive Electronics
13.10.2 Consumer Electronics
13.10.3 Power Supplies
13.10.4 Computing
13.10.5 Industry
13.10.6 Military/Aerospace
13.10.7 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Bonding Ribbons Market: Competitive Dashboard
14.2 Global Bonding Ribbons Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Heraeus
14.3.2 Tanaka
14.3.3 Sumitomo Metal Mining
14.3.4 MK Electron
14.3.5 AMETEK
14.3.6 Doublink Solders
14.3.7 Yantai Zhaojin Kanfort
14.3.8 Tatsuta Electric Wire & Cable
14.3.9 Kangqiang Electronics
14.3.10 The Prince & Izant
14.3.11 Heraeus
