Market Overview:
The global bonding wire packaging material market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for bonding wire packaging material from various end-use industries, such as automotive, electronics, and others. In terms of type, the gold segment is projected to lead the global bonding wire packaging material market during the forecast period. This growth can be attributed to its properties such as high conductivity and low resistance. In terms of application, the packaging segment is projected to lead the global bonding wire packaging material market during the forecast period.
Product Definition:
Bonding wire packaging material is a material used to package bonding wire. It is important because it protects the bonding wire from damage and ensures that it arrives at its destination in the same condition as when it was manufactured.
Gold:
Gold is a soft, yellowish-white metal. It is usually found in mineral deposits of the Auriferous Gold District which comprises of rivers placer gold, placers (refining gold from ore), and hard rock mining. The major sources of supply for the market are South Africa, Australia & New Zealand, China & India and Russia.
Palladium-Coated Copper (PCC):
Palladium-coated copper (PCC) is a special type of wire that has been coated with a thin layer of palladium. The primary function of PCC is to provide an additional barrier to the copper from external environment. Palladium does not participate in chemical reaction with the bonding wire, which makes it inert and suitable for use as coating material on the surface of bonding wires.
Application Insights:
The packaging application segment led the global market in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for flexible packaging solutions, which offer enhanced mechanical properties and high-temperature resistance.
Packaging products include food & beverage, medical devices, personal care products among others. The rising importance of hygiene in various economies including India, China and Brazil is expected to drive the demand for packaged drinking water over the coming years as well as increase spending on sanitary products such as diapers across all genders by 2050%. These factors are likely to fuel product demand during the forecast period.
Other applications include electrical & electronics assembly where bonding wires find application in lamination processes used for PCB assembly or laminating films used for picture frame manufacturing among others.
Regional Analysis:
Asia Pacific is anticipated to be the fastest-growing region over the forecast period owing to rapid industrialization and increasing foreign investments in countries such as China, India, Thailand, Vietnam and Indonesia. The growing end-use industries coupled with rising packaging material consumption is expected to drive demand for global bonding wire packaging material market over the forecast period.
The growth of key end-use industries such as electrical & electronics; medical devices; automotive will have a positive impact on industry growth. In addition, favorable regulations aimed at promoting domestic manufacturing are likely to provide further impetus for industry expansion.
North America was estimated as one of the largest markets for global bonding wire packaging material with a revenue share of around 11% in 2017 owing to high product demand from several major end-user industries including medical devices and automotive among others.
Growth Factors:
- Increasing demand from the automotive industry for bonding wire packaging material as it is used in the production of various car parts.
- Growing demand for electronic devices, which will lead to an increase in the use of bonding wire packaging material in these devices.
- Rising popularity of lightweight and fuel-efficient vehicles, which will result in an increase in demand for bonding wire packaging material from the automotive industry.
- Rapid growth of the semiconductor industry, as this will lead to an increase in demand for bonding wire packaging material from this sector.
Scope Of The Report
Report Attributes
Report Details
Report Title
Bonding Wire Packaging Material Market Research Report
By Type
Gold, Palladium-Coated Copper (PCC), Copper, Silver
By Application
Packaging, Others
By Companies
Alpha Packaging, APEX Plastics, Amcor, TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, MK Electron, AMETEK, EMMTECH, Inseto, Alpha Packaging, Sumitomo Metal Mining, Tatsuta Electric Wire & Cable
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
149
Number of Tables & Figures
105
Customization Available
Yes, the report can be customized as per your need.
Global Bonding Wire Packaging Material Market Report Segments:
The global Bonding Wire Packaging Material market is segmented on the basis of:
Types
Gold, Palladium-Coated Copper (PCC), Copper, Silver
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Packaging, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Alpha Packaging
- APEX Plastics
- Amcor
- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron
- AMETEK
- EMMTECH
- Inseto
- Alpha Packaging
- Sumitomo Metal Mining
- Tatsuta Electric Wire & Cable
Highlights of The Bonding Wire Packaging Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Gold
- Palladium-Coated Copper (PCC)
- Copper
- Silver
- By Application:
- Packaging
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Bonding Wire Packaging Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Bonding wire packaging material is a type of plastic that is used to seal products. It is made up of small, thin wires that are tightly bound together. Bonding wire packaging material can be used to create boxes, bottles, and other containers.
Some of the major players in the bonding wire packaging material market are Alpha Packaging, APEX Plastics, Amcor, TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, MK Electron, AMETEK, EMMTECH, Inseto, Alpha Packaging, Sumitomo Metal Mining, Tatsuta Electric Wire & Cable.
The bonding wire packaging material market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Bonding Wire Packaging Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Bonding Wire Packaging Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Bonding Wire Packaging Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Bonding Wire Packaging Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Bonding Wire Packaging Material Market Size & Forecast, 2018-2028
4.5.1 Bonding Wire Packaging Material Market Size and Y-o-Y Growth
4.5.2 Bonding Wire Packaging Material Market Absolute $ Opportunity
Chapter 5 Global Bonding Wire Packaging Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Bonding Wire Packaging Material Market Size Forecast by Type
5.2.1 Gold
5.2.2 Palladium-Coated Copper (PCC)
5.2.3 Copper
5.2.4 Silver
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Bonding Wire Packaging Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Bonding Wire Packaging Material Market Size Forecast by Applications
6.2.1 Packaging
6.2.2 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Bonding Wire Packaging Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Bonding Wire Packaging Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Bonding Wire Packaging Material Analysis and Forecast
9.1 Introduction
9.2 North America Bonding Wire Packaging Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Bonding Wire Packaging Material Market Size Forecast by Type
9.6.1 Gold
9.6.2 Palladium-Coated Copper (PCC)
9.6.3 Copper
9.6.4 Silver
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Bonding Wire Packaging Material Market Size Forecast by Applications
9.10.1 Packaging
9.10.2 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Bonding Wire Packaging Material Analysis and Forecast
10.1 Introduction
10.2 Europe Bonding Wire Packaging Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Bonding Wire Packaging Material Market Size Forecast by Type
10.6.1 Gold
10.6.2 Palladium-Coated Copper (PCC)
10.6.3 Copper
10.6.4 Silver
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Bonding Wire Packaging Material Market Size Forecast by Applications
10.10.1 Packaging
10.10.2 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Bonding Wire Packaging Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Bonding Wire Packaging Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Bonding Wire Packaging Material Market Size Forecast by Type
11.6.1 Gold
11.6.2 Palladium-Coated Copper (PCC)
11.6.3 Copper
11.6.4 Silver
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Bonding Wire Packaging Material Market Size Forecast by Applications
11.10.1 Packaging
11.10.2 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Bonding Wire Packaging Material Analysis and Forecast
12.1 Introduction
12.2 Latin America Bonding Wire Packaging Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Bonding Wire Packaging Material Market Size Forecast by Type
12.6.1 Gold
12.6.2 Palladium-Coated Copper (PCC)
12.6.3 Copper
12.6.4 Silver
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Bonding Wire Packaging Material Market Size Forecast by Applications
12.10.1 Packaging
12.10.2 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Bonding Wire Packaging Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Bonding Wire Packaging Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Bonding Wire Packaging Material Market Size Forecast by Type
13.6.1 Gold
13.6.2 Palladium-Coated Copper (PCC)
13.6.3 Copper
13.6.4 Silver
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Bonding Wire Packaging Material Market Size Forecast by Applications
13.10.1 Packaging
13.10.2 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Bonding Wire Packaging Material Market: Competitive Dashboard
14.2 Global Bonding Wire Packaging Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Alpha Packaging
14.3.2 APEX Plastics
14.3.3 Amcor
14.3.4 TANAKA Precious Metals
14.3.5 Heraeus Deutschland
14.3.6 California Fine Wire
14.3.7 MK Electron
14.3.8 AMETEK
14.3.9 EMMTECH
14.3.10 Inseto
14.3.11 Alpha Packaging
14.3.12 Sumitomo Metal Mining
14.3.13 Tatsuta Electric Wire & Cable
