Market Overview:
The global chemical mechanical polishing (CMP) head market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and wafers. In addition, the growing demand for advanced materials such as graphene and carbon nanotubes is also propelling the growth of this market. Based on type, the global CMP head market can be segmented into ceramics head, rubber head, and others. The ceramics head segment is expected to account for a major share of the global CMP head market in 2018. This segment is projected to grow at a high rate during the forecast period owing to its superior properties such as hardness and wear resistance. Based on application, the global CMP head market can be divided into wafers, substrates, and others segments.
Product Definition:
Chemical Mechanical Polishing (CMP) Head is a device that uses a chemical and mechanical process to polish the surface of a material. The importance of Chemical Mechanical Polishing (CMP) Head is that it can produce a very smooth surface on materials, which can be important for certain applications.
Ceramics Head:
Ceramics head is a term used for abrasive material that is made up of silicon dioxide and alumina. It's major applications are in the polishing of machined parts to give them a smooth finish. The other important application area includes grinding and sharpening of tooling components before they are used in manufacturing process or assembly operation.
Rubber Head:
Rubber head is a device that is used in chemical mechanical polishing (CMP) process to remove micro-scale defects from the surface of workpieces. The rubber head consists of soft rubber pads mounted on a metal or plastic stem. It uses compressed air or liquid nitrogen to apply pressure on the polishing pad, which in turn rubs against the workpiece surface and removes material via abrasion.
Application Insights:
The substrates segment led the global market in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for substrates from semiconductor and solar industries, which are majorly concentrated in Asia Pacific region.
Wafer was the largest application segment accounting for over 50% of total revenue share in 2017 owing to rising demand from semiconductor industry for high-quality silicon wafers that meet exacting specifications. Growing electronics industry coupled with technological advancements is expected to propel product demand over the forecast period.
Regional Analysis:
Asia Pacific dominated the global CMP head market in terms of revenue with a share of over 45% in 2017. This is attributed to growing semiconductor industry and increasing demand for polishing products from this region. The Asia Pacific was followed by North America, which accounted for a share of over 28% in 2017 owing to the presence of major players such as General Electric, Emerson Electric Co., and Siemens Healthineers AG. These companies are actively involved in R&D activities related to chemical mechanical polishing equipment, which will fuel regional growth during the forecast period.
The European market is anticipated to grow at an estimated CAGR exceeding 5% during the forecast period due to rising investments by various government organizations towards research & development activities within microelectronics and nanoelectronics sectors for developing innovative electronic devices with low cost & high efficiency levels.
Growth Factors:
- Increasing demand for miniaturization in semiconductor and electronics industry
- Rising demand for advanced 3D NAND flash memory
- Proliferation of new applications that require ultra-thin and smooth surfaces
- Growing popularity of CMP as a finishing step in nanotechnology fabrication
- Emergence of graphene and other two-dimensional materials
Scope Of The Report
Report Attributes
Report Details
Report Title
Chemical Mechanical Polishing (CMP) Head Market Research Report
By Type
Ceramics Head, Rubber Head, Others
By Application
Wafers, Substrates, Others
By Companies
EBARA, LOGITECH, Okamoto, Applied Materials
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
128
Number of Tables & Figures
90
Customization Available
Yes, the report can be customized as per your need.
Global Chemical Mechanical Polishing (CMP) Head Market Report Segments:
The global Chemical Mechanical Polishing (CMP) Head market is segmented on the basis of:
Types
Ceramics Head, Rubber Head, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafers, Substrates, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- EBARA
- LOGITECH
- Okamoto
- Applied Materials
Highlights of The Chemical Mechanical Polishing (CMP) Head Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Ceramics Head
- Rubber Head
- Others
- By Application:
- Wafers
- Substrates
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Chemical Mechanical Polishing (CMP) Head Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A CMP head is a type of tool used in the manufacturing process of semiconductor devices. It is a rotating disk with diamond-coated abrasive particles that removes material from the surface of a wafer.
Some of the major players in the chemical mechanical polishing (cmp) head market are EBARA, LOGITECH, Okamoto, Applied Materials.
The chemical mechanical polishing (cmp) head market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Chemical Mechanical Polishing (CMP) Head Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Chemical Mechanical Polishing (CMP) Head Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Chemical Mechanical Polishing (CMP) Head Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Chemical Mechanical Polishing (CMP) Head Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Chemical Mechanical Polishing (CMP) Head Market Size & Forecast, 2018-2028 4.5.1 Chemical Mechanical Polishing (CMP) Head Market Size and Y-o-Y Growth 4.5.2 Chemical Mechanical Polishing (CMP) Head Market Absolute $ Opportunity
Chapter 5 Global Chemical Mechanical Polishing (CMP) Head Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
5.2.1 Ceramics Head
5.2.2 Rubber Head
5.2.3 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Chemical Mechanical Polishing (CMP) Head Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
6.2.1 Wafers
6.2.2 Substrates
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Chemical Mechanical Polishing (CMP) Head Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Chemical Mechanical Polishing (CMP) Head Analysis and Forecast
9.1 Introduction
9.2 North America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
9.6.1 Ceramics Head
9.6.2 Rubber Head
9.6.3 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
9.10.1 Wafers
9.10.2 Substrates
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Chemical Mechanical Polishing (CMP) Head Analysis and Forecast
10.1 Introduction
10.2 Europe Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
10.6.1 Ceramics Head
10.6.2 Rubber Head
10.6.3 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
10.10.1 Wafers
10.10.2 Substrates
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Chemical Mechanical Polishing (CMP) Head Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
11.6.1 Ceramics Head
11.6.2 Rubber Head
11.6.3 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
11.10.1 Wafers
11.10.2 Substrates
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Chemical Mechanical Polishing (CMP) Head Analysis and Forecast
12.1 Introduction
12.2 Latin America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
12.6.1 Ceramics Head
12.6.2 Rubber Head
12.6.3 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
12.10.1 Wafers
12.10.2 Substrates
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Chemical Mechanical Polishing (CMP) Head Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Type
13.6.1 Ceramics Head
13.6.2 Rubber Head
13.6.3 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Chemical Mechanical Polishing (CMP) Head Market Size Forecast by Applications
13.10.1 Wafers
13.10.2 Substrates
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Chemical Mechanical Polishing (CMP) Head Market: Competitive Dashboard
14.2 Global Chemical Mechanical Polishing (CMP) Head Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 EBARA
14.3.2 LOGITECH
14.3.3 Okamoto
14.3.4 Applied Materials