Market Overview:
The global chip scale package (CSP) market is expected to grow at a CAGR of 9.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for miniaturized and high-performance electronic devices. Additionally, the growing trend of Internet of Things (IoT) is also fueling the growth of this market. The flip chip chip scale package (FCCSP) segment is expected to grow at a CAGR of 10% from 2018 to 2030, while the wire bonding chip scale package (WBCSP) segment is projected to grow at a CAGR of 8% during the same period. The wafer level chip scale package (WLCSP) segment is estimated to account for majority share in terms of revenue in 2018 and it is projected that this trend will continue during the forecast period as well. This can be attributed due its advantages such as low profile, small form factor, and high performance over other types available in the market. In terms of application, consumer electronics accounted for majority share in 2017 and it is estimated that this trend will continue duringthe forecast period as well owingto increase demand for miniaturized devices such as smartphones, tablets PCs etc., from consumers across different regions worldwide .
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Product Definition:
Chip scale package (CSP) is a packaging technology that packages integrated circuits in miniature form. The use of CSP can greatly reduce the size of an electronic device.
Flip Chip Chip Scale Package (FCCSP):
Flip chip chip scale package is a new packaging technology that was introduced by Intel Corporation in the year 2015. It is an advanced packaging technique which helps in reducing the size of ICs and enhance their performance. This technology has been commercialized by Intel Corporation under its brand name “FCCSP”, which stands for Flip Chip Chip Scale Package.
Wire Bonding Chip Scale Package (WBCSP):
Wire bonding chip scale package (WBCSP) is a packaging technology that involves the use of wire bonders to assemble integrated circuits on substrates. The technology provides high thermal conductivity, low inter-package coupling capacitance, and small package size as compared to ball grid array (BGA) which makes it an ideal choice for applications requiring high thermal performance.
Application Insights:
The consumer electronics segment accounted for the largest market share in 2017 and is anticipated to continue its dominance over the forecast period. The growing demand for small form factor plug-in devices, which consume less power has been a key factor driving CSPs in this application segment. Furthermore, rising demand for smart wearables and home appliances is expected to fuel industry growth over the coming years.
The computer application segment was valued at USD 1,000.0 million in 2017 owing to increasing use of CSPs within microcontrollers and programmable chipsets used across various end-use industries such as healthcare, automotive electronics & semiconductor etcetera. Moreover, miniaturization of electronic components along with advanced packaging solutions has enabled their integration into smaller spaces that were earlier occupied by larger components resulting in increased product adoption across numerous applications areas such as telecommunication systems & equipment among others worldwide.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for small, low-power, and high-performance electronics devices. China is a major contributor to regional growth owing to presence of large manufacturing base for consumer electronics products such as smartphones and laptops coupled with rapid adoption of new technologies such as 3D printing.
The Asia Pacific region has witnessed significant investments from foreign players looking at lucrative opportunities in this region along with growing demand from end users for miniaturized electronic devices that consume less power supply but deliver same or better performance than larger counterparts. This factor is also expected to drive regional CSP market over the forecast period.
North America accounted for a significant share in global revenue due towards presence of key industry participants such as Maxim Integrated Products Inc.; Texas Instruments; Infineon Technologies; Skyworks Solutions Inc.; Broadcom Inc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The Chip Scale Package (CSP) market is driven by the increasing demand for miniaturization in electronic devices. With the advancement of technology, there is an increased demand for smaller and more powerful electronic devices. This has led to a growing demand for Chip Scale Packages, which offer high performance in a small form factor.
- Growing popularity of wearable electronics: The growth of the wearable electronics market is another major driver for the Chip Scale Package (CSP) market. Wearable electronics are becoming increasingly popular due to their portability and convenience. This has led to an increase in the demand for small and power-efficient components, such as Chip Scale Packages.
- Proliferation of Internet of Things (IoT): The proliferation of IoT is another key driver for the Chip Scale Package (CSP) market . With billions of connected devices, there is a growing need for miniature components that can handle large amounts of data processing quickly and efficiently .ChipScalePackages are well-suitedfor this task , making them idealfor IoT applications .
Scope Of The Report
Report Attributes
Report Details
Report Title
Chip Scale Package (CSP) Market Research Report
By Type
Flip Chip Chip Scale Package (FCCSP), Wire Bonding Chip Scale Package (WBCSP), Wafer Level Chip Scale Package (WLCSP), Others
By Application
Consumer Electronics, Computers, Telecommunication, Automotive Electronics, Industrial, Healthcare, Others
By Companies
Samsung Electro-Mechanics, KLA-Tencor, TSMC, Amkor Technology, ASE Group, Cohu, Semiconductor Technologies & Instruments (STI), STATS ChipPAC, China Wafer Level CSP Co.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
228
Number of Tables & Figures
160
Customization Available
Yes, the report can be customized as per your need.
Global Chip Scale Package (CSP) Market Report Segments:
The global Chip Scale Package (CSP) market is segmented on the basis of:
Types
Flip Chip Chip Scale Package (FCCSP), Wire Bonding Chip Scale Package (WBCSP), Wafer Level Chip Scale Package (WLCSP), Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Computers, Telecommunication, Automotive Electronics, Industrial, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Samsung Electro-Mechanics
- KLA-Tencor
- TSMC
- Amkor Technology
- ASE Group
- Cohu
- Semiconductor Technologies & Instruments (STI)
- STATS ChipPAC
- China Wafer Level CSP Co.
 Market Overview.svg)
Highlights of The Chip Scale Package (CSP) Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Flip Chip Chip Scale Package (FCCSP)
- Wire Bonding Chip Scale Package (WBCSP)
- Wafer Level Chip Scale Package (WLCSP)
- Others
- By Application:
- Consumer Electronics
- Computers
- Telecommunication
- Automotive Electronics
- Industrial
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Chip Scale Package (CSP) Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Chip scale package (CSP) is a packaging technology that uses small chips to create electronic devices. CSP allows for smaller and more efficient electronics, which can lead to improved performance and reduced costs.
Some of the key players operating in the chip scale package (csp) market are Samsung Electro-Mechanics, KLA-Tencor, TSMC, Amkor Technology, ASE Group, Cohu, Semiconductor Technologies & Instruments (STI), STATS ChipPAC, China Wafer Level CSP Co..
The chip scale package (csp) market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Chip Scale Package (CSP) Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Chip Scale Package (CSP) Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Chip Scale Package (CSP) Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Chip Scale Package (CSP) Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Chip Scale Package (CSP) Market Size & Forecast, 2018-2028
4.5.1 Chip Scale Package (CSP) Market Size and Y-o-Y Growth
4.5.2 Chip Scale Package (CSP) Market Absolute $ Opportunity
Chapter 5 Global Chip Scale Package (CSP) Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Chip Scale Package (CSP) Market Size Forecast by Type
5.2.1 Flip Chip Chip Scale Package (FCCSP)
5.2.2 Wire Bonding Chip Scale Package (WBCSP)
5.2.3 Wafer Level Chip Scale Package (WLCSP)
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Chip Scale Package (CSP) Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Chip Scale Package (CSP) Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Computers
6.2.3 Telecommunication
6.2.4 Automotive Electronics
6.2.5 Industrial
6.2.6 Healthcare
6.2.7 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Chip Scale Package (CSP) Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Chip Scale Package (CSP) Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Chip Scale Package (CSP) Analysis and Forecast
9.1 Introduction
9.2 North America Chip Scale Package (CSP) Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Chip Scale Package (CSP) Market Size Forecast by Type
9.6.1 Flip Chip Chip Scale Package (FCCSP)
9.6.2 Wire Bonding Chip Scale Package (WBCSP)
9.6.3 Wafer Level Chip Scale Package (WLCSP)
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Chip Scale Package (CSP) Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Computers
9.10.3 Telecommunication
9.10.4 Automotive Electronics
9.10.5 Industrial
9.10.6 Healthcare
9.10.7 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Chip Scale Package (CSP) Analysis and Forecast
10.1 Introduction
10.2 Europe Chip Scale Package (CSP) Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Chip Scale Package (CSP) Market Size Forecast by Type
10.6.1 Flip Chip Chip Scale Package (FCCSP)
10.6.2 Wire Bonding Chip Scale Package (WBCSP)
10.6.3 Wafer Level Chip Scale Package (WLCSP)
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Chip Scale Package (CSP) Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Computers
10.10.3 Telecommunication
10.10.4 Automotive Electronics
10.10.5 Industrial
10.10.6 Healthcare
10.10.7 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Chip Scale Package (CSP) Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Chip Scale Package (CSP) Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Chip Scale Package (CSP) Market Size Forecast by Type
11.6.1 Flip Chip Chip Scale Package (FCCSP)
11.6.2 Wire Bonding Chip Scale Package (WBCSP)
11.6.3 Wafer Level Chip Scale Package (WLCSP)
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Chip Scale Package (CSP) Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Computers
11.10.3 Telecommunication
11.10.4 Automotive Electronics
11.10.5 Industrial
11.10.6 Healthcare
11.10.7 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Chip Scale Package (CSP) Analysis and Forecast
12.1 Introduction
12.2 Latin America Chip Scale Package (CSP) Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Chip Scale Package (CSP) Market Size Forecast by Type
12.6.1 Flip Chip Chip Scale Package (FCCSP)
12.6.2 Wire Bonding Chip Scale Package (WBCSP)
12.6.3 Wafer Level Chip Scale Package (WLCSP)
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Chip Scale Package (CSP) Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Computers
12.10.3 Telecommunication
12.10.4 Automotive Electronics
12.10.5 Industrial
12.10.6 Healthcare
12.10.7 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Chip Scale Package (CSP) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Chip Scale Package (CSP) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Chip Scale Package (CSP) Market Size Forecast by Type
13.6.1 Flip Chip Chip Scale Package (FCCSP)
13.6.2 Wire Bonding Chip Scale Package (WBCSP)
13.6.3 Wafer Level Chip Scale Package (WLCSP)
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Chip Scale Package (CSP) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Computers
13.10.3 Telecommunication
13.10.4 Automotive Electronics
13.10.5 Industrial
13.10.6 Healthcare
13.10.7 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Chip Scale Package (CSP) Market: Competitive Dashboard
14.2 Global Chip Scale Package (CSP) Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Samsung Electro-Mechanics
14.3.2 KLA-Tencor
14.3.3 TSMC
14.3.4 Amkor Technology
14.3.5 ASE Group
14.3.6 Cohu
14.3.7 Semiconductor Technologies & Instruments (STI)
14.3.8 STATS ChipPAC
14.3.9 China Wafer Level CSP Co.
