Market Overview:
The global CIS assembly testing market is expected to grow at a CAGR of 6.5% from 2018 to 2030. The market growth is attributed to the increasing demand for CIS packaging and testing in automotive, security, and cell phone applications. North America accounted for the largest share of the global CIS assembly testing market in 2017, followed by Europe and Asia Pacific. However, Asia Pacific is expected to witness the highest growth during the forecast period owing to the growing demand for CIS packaging and testing in automotive and cell phone applications.
Product Definition:
CIS Assembly Testing is the process of verifying that a CIS product meets its specified requirements. The importance of CIS Assembly Testing is that it ensures that a product functions as intended and does not contain any defects.
Automotive CIS Packaging and Testing:
Automotive CIS Packaging and Testing, it's usage.
*** Introduction of Automotive-CIS (Customer Information System) packaging has been growing at a steady pace. The primary function of automotive-CIS is to provide vehicle owners with tools that enable them to maintain their vehicles.
Security CIS Packaging and Testing:
Security CIS Packaging and Testing (SIPT) is a software testing method that ensures the security of critical information systems. SIPT helps in preventing data loss by providing assurance to the business that information system will be free from vulnerabilities during its deployment and operation.
Application Insights:
Automotive on-board testing emerged as the dominant application segment in the global market and accounted for over 40% of the overall revenue share in 2017. The growth can be attributed to a rise in demand for advanced and complex vehicles with enhanced safety features. Onboard testing involves various functionalities such as engine, drivetrain, airbag deployment, tire inflation monitoring among others.
The security monitoring segment is expected to grow at a significant rate over the forecast period owing to an increase in demand from governments worldwide for ensuring stringent security measures at sensitive locations such as airports and government buildings among others. Cell phone CIS packaging & testing also held considerable market share owing to its rising usage globally across multiple applications including mobile payment systems like Apple PayTM, Samsung PayTM etc., e-commerce transactions etc.
Regional Analysis:
The market in the Asia Pacific region is expected to grow at a significant rate over the forecast period. The growth can be attributed to increasing demand for security testing of consumer electronics and automobiles in countries such as China, India, and South Korea. In addition, rising investments by governments of various countries are anticipated to boost demand for monitoring systems across several sectors including defense & security, healthcare & medical among others.
North America was estimated as the second-largest regional market in 2017 owing to high penetration rates of advanced technologies such as 4G/LTE connectivity and Wi-Fi enabled devices among consumers. Moreover, presence of key automobile manufacturers including General Motors Company; Ford Motor Company; Tesla Inc.; Volkswagen Group; Fiat Chrysler Automobiles N.V.; BMW AG amongst others is also likely to fuel growth over the next eight years or so till 2030 AD (Yearly Averages).
Growth Factors:
- Increasing demand for miniaturization in electronic products
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing demand for automotive electronics
- Rising demand from the medical device industry
- Increased focus on quality and reliability in electronic products
Scope Of The Report
Report Attributes
Report Details
Report Title
CIS Assembly Testing Market Research Report
By Type
Automotive CIS Packaging and Testing, Security CIS Packaging and Testing, Cell Phone CIS Packaging and Testing
By Application
Automotive Onboard, Security Monitoring, Cell Phone
By Companies
JCET Group, Tong Hsing Electronic Industries, China Wafer Level CSP Co, Tianshui Huatian Technology, Forcera Materials Co., Ltd, King Yuan Electronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
209
Number of Tables & Figures
147
Customization Available
Yes, the report can be customized as per your need.
Global CIS Assembly Testing Market Report Segments:
The global CIS Assembly Testing market is segmented on the basis of:
Types
Automotive CIS Packaging and Testing, Security CIS Packaging and Testing, Cell Phone CIS Packaging and Testing
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Onboard, Security Monitoring, Cell Phone
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- JCET Group
- Tong Hsing Electronic Industries
- China Wafer Level CSP Co
- Tianshui Huatian Technology
- Forcera Materials Co., Ltd
- King Yuan Electronics
Highlights of The CIS Assembly Testing Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Automotive CIS Packaging and Testing
- Security CIS Packaging and Testing
- Cell Phone CIS Packaging and Testing
- By Application:
- Automotive Onboard
- Security Monitoring
- Cell Phone
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the CIS Assembly Testing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
CIS Assembly Testing is a process that verifies the assembly and functionality of computer systems. CIS Assembly Testing can be used to test the integrity of software, hardware, firmware, and other components.
Some of the major companies in the cis assembly testing market are JCET Group, Tong Hsing Electronic Industries, China Wafer Level CSP Co, Tianshui Huatian Technology, Forcera Materials Co., Ltd, King Yuan Electronics.
The cis assembly testing market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 CIS Assembly Testing Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 CIS Assembly Testing Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 CIS Assembly Testing Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the CIS Assembly Testing Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global CIS Assembly Testing Market Size & Forecast, 2018-2028
4.5.1 CIS Assembly Testing Market Size and Y-o-Y Growth
4.5.2 CIS Assembly Testing Market Absolute $ Opportunity
Chapter 5 Global CIS Assembly Testing Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 CIS Assembly Testing Market Size Forecast by Type
5.2.1 Automotive CIS Packaging and Testing
5.2.2 Security CIS Packaging and Testing
5.2.3 Cell Phone CIS Packaging and Testing
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global CIS Assembly Testing Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 CIS Assembly Testing Market Size Forecast by Applications
6.2.1 Automotive Onboard
6.2.2 Security Monitoring
6.2.3 Cell Phone
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global CIS Assembly Testing Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 CIS Assembly Testing Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America CIS Assembly Testing Analysis and Forecast
9.1 Introduction
9.2 North America CIS Assembly Testing Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America CIS Assembly Testing Market Size Forecast by Type
9.6.1 Automotive CIS Packaging and Testing
9.6.2 Security CIS Packaging and Testing
9.6.3 Cell Phone CIS Packaging and Testing
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America CIS Assembly Testing Market Size Forecast by Applications
9.10.1 Automotive Onboard
9.10.2 Security Monitoring
9.10.3 Cell Phone
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe CIS Assembly Testing Analysis and Forecast
10.1 Introduction
10.2 Europe CIS Assembly Testing Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe CIS Assembly Testing Market Size Forecast by Type
10.6.1 Automotive CIS Packaging and Testing
10.6.2 Security CIS Packaging and Testing
10.6.3 Cell Phone CIS Packaging and Testing
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe CIS Assembly Testing Market Size Forecast by Applications
10.10.1 Automotive Onboard
10.10.2 Security Monitoring
10.10.3 Cell Phone
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific CIS Assembly Testing Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific CIS Assembly Testing Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific CIS Assembly Testing Market Size Forecast by Type
11.6.1 Automotive CIS Packaging and Testing
11.6.2 Security CIS Packaging and Testing
11.6.3 Cell Phone CIS Packaging and Testing
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific CIS Assembly Testing Market Size Forecast by Applications
11.10.1 Automotive Onboard
11.10.2 Security Monitoring
11.10.3 Cell Phone
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America CIS Assembly Testing Analysis and Forecast
12.1 Introduction
12.2 Latin America CIS Assembly Testing Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America CIS Assembly Testing Market Size Forecast by Type
12.6.1 Automotive CIS Packaging and Testing
12.6.2 Security CIS Packaging and Testing
12.6.3 Cell Phone CIS Packaging and Testing
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America CIS Assembly Testing Market Size Forecast by Applications
12.10.1 Automotive Onboard
12.10.2 Security Monitoring
12.10.3 Cell Phone
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) CIS Assembly Testing Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) CIS Assembly Testing Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) CIS Assembly Testing Market Size Forecast by Type
13.6.1 Automotive CIS Packaging and Testing
13.6.2 Security CIS Packaging and Testing
13.6.3 Cell Phone CIS Packaging and Testing
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) CIS Assembly Testing Market Size Forecast by Applications
13.10.1 Automotive Onboard
13.10.2 Security Monitoring
13.10.3 Cell Phone
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 CIS Assembly Testing Market: Competitive Dashboard
14.2 Global CIS Assembly Testing Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 JCET Group
14.3.2 Tong Hsing Electronic Industries
14.3.3 China Wafer Level CSP Co
14.3.4 Tianshui Huatian Technology
14.3.5 Forcera Materials Co., Ltd
14.3.6 King Yuan Electronics
