Market Overview:
The global CMP for wafer market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. In addition, the growing adoption of advanced packaging technologies is also contributing to the growth of this market.
Product Definition:
CMP is the process of mechanically polishing a semiconductor wafer. This removes material from the surface, and results in a very smooth surface finish. This is important because it allows for better electrical contact between devices on the wafer, and improves device performance.
CMP Pads:
CMP pads are the pieces of silicon rubber that come in direct contact with wafers during the CMP process. They are used to remove material from a wafer and they have different sizes depending on their applications. The most common types of CMP pads include small, medium and large which can be identified by their different shapes and sizes.
CMP Slurries:
CMP slurries are solutions used in CMP for wafer processing. They help to reduce the friction between wafers and the silicon during transfer and implantation. The primary function of a slurry is to keep the surface of one workpiece clean while it is being transported or installed on another by using a stream of liquid chemicals.
In CMP, there are two types of slurries that include dry.
Application Insights:
300 mm wafer CMP was the largest application segment in 2017 and is projected to maintain its lead over the forecast period. 300 mm wafers are used in various applications including data centers, smartphones, laptops, and other consumer electronics products. The demand for 300 mm chipsets is largely driven by their use in data centers as they offer higher processing speeds along with more cores per socket than 200mm chipsets do.
The 200mm market segment is expected to witness significant growth over the forecast period owing to its increasing adoption across multiple industry verticals such as cloud computing, big data analytics & storage systems among others. The growing adoption of 200mm technology can be attributed to factors such as increased performance requirements from end-users coupled with rising concerns regarding energy consumption and environmental issues among others.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for advanced semiconductor devices, particularly in China and India. In addition, rising investments by foreign players such as U.S.-based Micron Technology Inc.; Taiwan Semiconductor Manufacturing Company (TSMC); and Singapore-based MediaTek Inc.; are anticipated to fuel industry expansion over the next eight years.
The 300 mm wafer CMP market is projected to witness significant growth during the forecast period owing to technological advancements coupled with increased spending on research & development activities by manufacturers operating within this sector. Europe accounted for a significant share of revenue generated from 300 mm wafers produced globally due to high demand from microelectronics manufacturing companies located within this region, particularly Germany and France along with other Eastern European countries such as Poland, Russia etc.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics and telecommunications sectors
- Rising demand for miniaturized and more complex semiconductor devices
- Proliferation of new applications that require advanced semiconductor devices
- Growing number of fabless companies that need to outsource wafer fabrication services
- Advances in technology that improve the performance and reduce the cost of wafer fabrication
Scope Of The Report
Report Attributes
Report Details
Report Title
CMP for Wafer Market Research Report
By Type
CMP Pads, CMP Slurries
By Application
300 mm, 200 mm, Others
By Companies
CMC Materials, DuPont, Fujimi Incorporated, Air Products/Versum Materials, Hitachi Chemical, Saint-Gobain, Asahi Glass, Ace Nanochem, UWiZ Technology, WEC Group, Anji Microelectronics, Ferro Corporation, JSR Micro Korea Material Innovation, Soulbrain, KC Tech
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
178
Number of Tables & Figures
125
Customization Available
Yes, the report can be customized as per your need.
Global CMP for Wafer Market Report Segments:
The global CMP for Wafer market is segmented on the basis of:
Types
CMP Pads, CMP Slurries
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
300 mm, 200 mm, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- CMC Materials
- DuPont
- Fujimi Incorporated
- Air Products/Versum Materials
- Hitachi Chemical
- Saint-Gobain
- Asahi Glass
- Ace Nanochem
- UWiZ Technology
- WEC Group
- Anji Microelectronics
- Ferro Corporation
- JSR Micro Korea Material Innovation
- Soulbrain
- KC Tech
Highlights of The CMP for Wafer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- CMP Pads
- CMP Slurries
- By Application:
- 300 mm
- 200 mm
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the CMP for Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
CMP stands for chip-to-package. It is a manufacturing process that transfers chips from wafers to finished products.
Some of the major players in the cmp for wafer market are CMC Materials, DuPont, Fujimi Incorporated, Air Products/Versum Materials, Hitachi Chemical, Saint-Gobain, Asahi Glass, Ace Nanochem, UWiZ Technology, WEC Group, Anji Microelectronics, Ferro Corporation, JSR Micro Korea Material Innovation, Soulbrain, KC Tech.
The cmp for wafer market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 CMP for Wafer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 CMP for Wafer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 CMP for Wafer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the CMP for Wafer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global CMP for Wafer Market Size & Forecast, 2018-2028
4.5.1 CMP for Wafer Market Size and Y-o-Y Growth
4.5.2 CMP for Wafer Market Absolute $ Opportunity
Chapter 5 Global CMP for Wafer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 CMP for Wafer Market Size Forecast by Type
5.2.1 CMP Pads
5.2.2 CMP Slurries
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global CMP for Wafer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 CMP for Wafer Market Size Forecast by Applications
6.2.1 300 mm
6.2.2 200 mm
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global CMP for Wafer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 CMP for Wafer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America CMP for Wafer Analysis and Forecast
9.1 Introduction
9.2 North America CMP for Wafer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America CMP for Wafer Market Size Forecast by Type
9.6.1 CMP Pads
9.6.2 CMP Slurries
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America CMP for Wafer Market Size Forecast by Applications
9.10.1 300 mm
9.10.2 200 mm
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe CMP for Wafer Analysis and Forecast
10.1 Introduction
10.2 Europe CMP for Wafer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe CMP for Wafer Market Size Forecast by Type
10.6.1 CMP Pads
10.6.2 CMP Slurries
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe CMP for Wafer Market Size Forecast by Applications
10.10.1 300 mm
10.10.2 200 mm
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific CMP for Wafer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific CMP for Wafer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific CMP for Wafer Market Size Forecast by Type
11.6.1 CMP Pads
11.6.2 CMP Slurries
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific CMP for Wafer Market Size Forecast by Applications
11.10.1 300 mm
11.10.2 200 mm
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America CMP for Wafer Analysis and Forecast
12.1 Introduction
12.2 Latin America CMP for Wafer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America CMP for Wafer Market Size Forecast by Type
12.6.1 CMP Pads
12.6.2 CMP Slurries
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America CMP for Wafer Market Size Forecast by Applications
12.10.1 300 mm
12.10.2 200 mm
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) CMP for Wafer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) CMP for Wafer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) CMP for Wafer Market Size Forecast by Type
13.6.1 CMP Pads
13.6.2 CMP Slurries
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) CMP for Wafer Market Size Forecast by Applications
13.10.1 300 mm
13.10.2 200 mm
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 CMP for Wafer Market: Competitive Dashboard
14.2 Global CMP for Wafer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 CMC Materials
14.3.2 DuPont
14.3.3 Fujimi Incorporated
14.3.4 Air Products/Versum Materials
14.3.5 Hitachi Chemical
14.3.6 Saint-Gobain
14.3.7 Asahi Glass
14.3.8 Ace Nanochem
14.3.9 UWiZ Technology
14.3.10 WEC Group
14.3.11 Anji Microelectronics
14.3.12 Ferro Corporation
14.3.13 JSR Micro Korea Material Innovation
14.3.14 Soulbrain
14.3.15 KC Tech
