Market Overview:
The global coater and developer for wafer processing market is expected to grow at a CAGR of 6.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for advanced packages, high viscosity and spin-on hard mask, EUV process, and other applications. Asia Pacific is expected to be the fastest-growing region during the forecast period.
Product Definition:
A coater and developer is a device used in semiconductor manufacturing to apply a thin film of material, called a coating, to the surface of a silicon wafer. The coating can be used to change the properties of the wafer surface, for example by increasing its reflectivity or making it more hydrophobic.
Fully Automatic:
Fully automatic wafer processing systems are used to process silicon chips in a continuous and uninterrupted manner. Fully automatic systems have the ability to perform repetitive tasks with high efficiency. The fully automatic coating & developing equipment market is expected to witness significant growth over the forecast period owing to its increasing usage in semiconductor, LED and solar industries.
Semi-Automatic:
Semi-automatic is a tool that can be used to coat and develop wafers in the semiconductor industry. It is an alternative for automatic processing systems.
The major advantage of using semi-automatic system over the automatic one, is that it requires lesser investment in terms of installation cost and maintenance cost. Also, it offers flexibility to change tasks among operators which are not possible with the help of an automatic system as there are no operator switches available at such places.
Application Insights:
The other application segment, which includes EUV exposure and hot isostatic pressing (HIP), held the largest market share of over 40% in 2017. The rising demand for advanced packages is expected to be the key factor driving the product demand over the forecast period. Advanced packages are used for packaging various components including micro-electromechanical systems (MEMS), integrated circuits, and photomasks during semiconductor production using extreme ultra-violet (EUV) radiation.
Hot isostatic pressing (HIP) process demands a fully automatic coater with high precision dispensing equipment that can deliver an accurate amount of pressure at a specific location on each component within seconds.
Regional Analysis:
Asia Pacific dominated the global coater and developer for wafer processing market in 2017. The growth is attributed to the presence of key players such as Kanto Corporation, SEGWAY INC., and Hamamatsu Photonics K.K., which are engaged in manufacturing equipment used for patterning semiconductor devices at various stages of fabrication process. Moreover, increasing demand for advanced semiconductor products along with rapid industrialization has led to an increase in investments by various public & private entities that would propel market growth over the forecast period.
The Asia Pacific region is expected to witness significant growth owing to a large number of electronic device manufacturers located across China, Taiwan, South Korea, Japan among other Asian countries who are adopting advanced technologies such as EUV technology at a faster pace compared with their counterparts around the world thereby driving regional product demand over the forecast period.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of 6.7 billion by 2020. This growth can be attributed to the increasing demand for semiconductor devices across various applications such as consumer electronics, automotive, industrial and medical sectors.
- Rising demand for miniaturized and energy-efficient electronic devices: With the growing trend of miniaturization and increased focus on energy efficiency in electronic devices, the need for advanced wafer processing technologies is also rising significantly. This is driving the adoption of coater and developer equipment among chipmakers worldwide.
- Proliferation of 3D IC technology: The proliferation of 3D IC technology is another major factor that is driving the growth of coater and developer market for wafer processing globally. 3D ICs are stacked chips that offer several advantages over traditional 2D chips such as improved performance, reduced power consumption and higher packing density etcetera . As a result, there has been an increase in demand for coater and developer equipment that can handle 3D ICs effectively from chipmakers worldwide..
Scope Of The Report
Report Attributes
Report Details
Report Title
Coater and Developer for Wafer Processing Market Research Report
By Type
Fully Automatic, Semi-Automatic
By Application
Advanced Packages, High Viscosity and Spin-on Hard Mask, EUV Process, Other
By Companies
TEL (Tokyo Electron Limited), SÜSS MicroTec, Litho Tech Japan Corporation, TAZMO, SCREEN Semiconductor Solutions, Osiris International, S-Cubed, Spintrac Systems, C＆D Semiconductor, amcoss GmbH, TEL (Tokyo Electron Limited), ACM Research, LithExx-Systems GmbH, EVG, SAWATEC AG, Kingsemi
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
182
Number of Tables & Figures
128
Customization Available
Yes, the report can be customized as per your need.
Global Coater and Developer for Wafer Processing Market Report Segments:
The global Coater and Developer for Wafer Processing market is segmented on the basis of:
Types
Fully Automatic, Semi-Automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Advanced Packages, High Viscosity and Spin-on Hard Mask, EUV Process, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TEL (Tokyo Electron Limited)
- SÜSS MicroTec
- Litho Tech Japan Corporation
- TAZMO
- SCREEN Semiconductor Solutions
- Osiris International
- S-Cubed
- Spintrac Systems
- C＆D Semiconductor
- amcoss GmbH
- TEL (Tokyo Electron Limited)
- ACM Research
- LithExx-Systems GmbH
- EVG
- SAWATEC AG
- Kingsemi
Highlights of The Coater and Developer for Wafer Processing Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi-Automatic
- By Application:
- Advanced Packages
- High Viscosity and Spin-on Hard Mask
- EUV Process
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Coater and Developer for Wafer Processing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Coater and Developer are tools used in the semiconductor industry to deposit a thin film of material on a substrate.
Some of the key players operating in the coater and developer for wafer processing market are TEL (Tokyo Electron Limited), SœSS MicroTec, Litho Tech Japan Corporation, TAZMO, SCREEN Semiconductor Solutions, Osiris International, S-Cubed, Spintrac Systems, C＆D Semiconductor, amcoss GmbH, TEL (Tokyo Electron Limited), ACM Research, LithExx-Systems GmbH, EVG, SAWATEC AG, Kingsemi.
The coater and developer for wafer processing market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Coater and Developer for Wafer Processing Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Coater and Developer for Wafer Processing Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Coater and Developer for Wafer Processing Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Coater and Developer for Wafer Processing Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Coater and Developer for Wafer Processing Market Size & Forecast, 2018-2028
4.5.1 Coater and Developer for Wafer Processing Market Size and Y-o-Y Growth
4.5.2 Coater and Developer for Wafer Processing Market Absolute $ Opportunity
Chapter 5 Global Coater and Developer for Wafer Processing Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Coater and Developer for Wafer Processing Market Size Forecast by Type
5.2.1 Fully Automatic
5.2.2 Semi-Automatic
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Coater and Developer for Wafer Processing Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Coater and Developer for Wafer Processing Market Size Forecast by Applications
6.2.1 Advanced Packages
6.2.2 High Viscosity and Spin-on Hard Mask
6.2.3 EUV Process
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Coater and Developer for Wafer Processing Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Coater and Developer for Wafer Processing Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Coater and Developer for Wafer Processing Analysis and Forecast
9.1 Introduction
9.2 North America Coater and Developer for Wafer Processing Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Coater and Developer for Wafer Processing Market Size Forecast by Type
9.6.1 Fully Automatic
9.6.2 Semi-Automatic
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Coater and Developer for Wafer Processing Market Size Forecast by Applications
9.10.1 Advanced Packages
9.10.2 High Viscosity and Spin-on Hard Mask
9.10.3 EUV Process
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Coater and Developer for Wafer Processing Analysis and Forecast
10.1 Introduction
10.2 Europe Coater and Developer for Wafer Processing Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Coater and Developer for Wafer Processing Market Size Forecast by Type
10.6.1 Fully Automatic
10.6.2 Semi-Automatic
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Coater and Developer for Wafer Processing Market Size Forecast by Applications
10.10.1 Advanced Packages
10.10.2 High Viscosity and Spin-on Hard Mask
10.10.3 EUV Process
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Coater and Developer for Wafer Processing Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Coater and Developer for Wafer Processing Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Coater and Developer for Wafer Processing Market Size Forecast by Type
11.6.1 Fully Automatic
11.6.2 Semi-Automatic
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Coater and Developer for Wafer Processing Market Size Forecast by Applications
11.10.1 Advanced Packages
11.10.2 High Viscosity and Spin-on Hard Mask
11.10.3 EUV Process
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Coater and Developer for Wafer Processing Analysis and Forecast
12.1 Introduction
12.2 Latin America Coater and Developer for Wafer Processing Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Coater and Developer for Wafer Processing Market Size Forecast by Type
12.6.1 Fully Automatic
12.6.2 Semi-Automatic
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Coater and Developer for Wafer Processing Market Size Forecast by Applications
12.10.1 Advanced Packages
12.10.2 High Viscosity and Spin-on Hard Mask
12.10.3 EUV Process
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Coater and Developer for Wafer Processing Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Coater and Developer for Wafer Processing Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Coater and Developer for Wafer Processing Market Size Forecast by Type
13.6.1 Fully Automatic
13.6.2 Semi-Automatic
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Coater and Developer for Wafer Processing Market Size Forecast by Applications
13.10.1 Advanced Packages
13.10.2 High Viscosity and Spin-on Hard Mask
13.10.3 EUV Process
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Coater and Developer for Wafer Processing Market: Competitive Dashboard
14.2 Global Coater and Developer for Wafer Processing Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 TEL (Tokyo Electron Limited)
14.3.2 SÜSS MicroTec
14.3.3 Litho Tech Japan Corporation
14.3.4 TAZMO
14.3.5 SCREEN Semiconductor Solutions
14.3.6 Osiris International
14.3.7 S-Cubed
14.3.8 Spintrac Systems
14.3.9 C＆D Semiconductor
14.3.10 amcoss GmbH
14.3.11 TEL (Tokyo Electron Limited)
14.3.12 ACM Research
14.3.13 LithExx-Systems GmbH
14.3.14 EVG
14.3.15 SAWATEC AG
14.3.16 Kingsemi
