Market Overview:
The global copper foil for high frequency and high speed substrate market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for copper foil in 5G communication, automotive electronics, and other applications. In terms of type, electrolytic copper foil is expected to hold the largest share of the global copper foil for high frequency and high speed substrate market during the forecast period. This can be attributed to its superior electrical and thermal conductivity as compared to other types of copper foils.
Product Definition:
A copper foil is a thin sheet of copper that is used as a substrate for high frequency and high speed devices. Copper foil has many advantages over other substrates, including its low resistance, its ability to dissipate heat, and its corrosion resistance.
Electrolytic Copper Foil:
Electrolytic copper foil is a thin sheet of pure copper that is used as an electrode in electrolytic cells. It has high electrical and thermal conductivity, low bulk density, and excellent mechanical properties. The major applications include power generation (for instance, the Kewpie current generator), water & wastewater treatment plants (such as desalination plants), super-voltage generators for particle physics experiments at CERN, and fuel cells.
Calendered Copper Foil:
Copper foil is a thin, conductive layer of metal that is produced on both sides of a sheet of paper or polymer. The most common form found in electronics applications consists of 1/16th inch thick aluminum sheets backed by cotton or other material. Copper foils are used for high frequency and high speed substrates as they provide superior performance to cost ratio when compared to conventional materials such as printed circuit boards (PCB).
Application Insights:
The 5G communication segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. Copper foil is used as a substrate material in various wireless components including base stations, network gateway devices, and mobile phones. The advent of high-speed data transfer services has created demand for high frequency and high speed copper foil substrates that are used in wireless components.
The automotive electronics application segment was valued at USD 281.5 million in 2017 owing to increasing use of copper foil as a substrate material by major automotive component manufacturers such as Continental AG, Daimler AG, BMW Group; Mercedes Benz; Ford Motor Company; General Motors Company; Toyota Motors Corporation.; Nissan Motor Co., Ltd.; Honda Motor Co., Ltd.; Hyundai Auto & Equipment Co., Ltd.; Mahindra & Mahindra Limited; Ssangyong Automotive Group ; Infiniti luxury vehicle manufacturer etc.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. This can be attributed to increasing demand for electronic products, such as smartphones and laptops, growing industrialization, and advancements in technology. The presence of key manufacturers such as Wuhan GQH Electron Co., Ltd.; SEGWAY INC.; HEG Limited; Infineon Technologies AG; Amperex Technology Limited; LG Chem Ltd.; Samsung Electro-Mechanical Inc.; Panasonic Corporation; Fujikura Ltd.; Furukawa Electric Co.,Ltd among others is also anticipated to boost the growth of this regional market.
The European region accounted for a significant share owing to high demand from end-use industries including automotive electronics & telematics, consumer electronics & communication devices etc. Moreover, rising adoption of 5G network standards by telecom companies across Europe will drive industry expansion over the next eight years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of LED lighting
- Proliferation of solar energy installations
- Increasing use in smart technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Copper Foil for High Frequency and High Speed Substrate Market Research Report
By Type
Electrolytic Copper Foil, Calendered Copper Foil
By Application
5G Communication, Automotive Electronics, Other
By Companies
Mitsui Mining & Smelting (Japan), JX Nippon Mining & Metals (Japan), The Furukawa Electric (Japan), Fukuda Metal Foil & Powder (Japan), Nippon Denkai (Japan), Doosan (Korea), ILJIN (Korea), Anhui Tongguan Copper Foil Group (China), Ling Bao Wason Coper Foil Co Ltd (China), HuiZhou United Copper Foil Electronic Material (China), Mitsui Mining & Smelting (Japan), Chang Chun Group (Taiwan), Nan Ya Plastics (Taiwan), Co-tech Development (Taiwan), LCY Technology (Taiwan), Jiangxi Copper Yates Foil (China), Jiujiang Defu Technology (China), Shan Dong Jinbao Electronics (China)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
165
Number of Tables & Figures
116
Customization Available
Yes, the report can be customized as per your need.
Global Copper Foil for High Frequency and High Speed Substrate Market Report Segments:
The global Copper Foil for High Frequency and High Speed Substrate market is segmented on the basis of:
Types
Electrolytic Copper Foil, Calendered Copper Foil
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
5G Communication, Automotive Electronics, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Mining & Smelting (Japan)
- JX Nippon Mining & Metals (Japan)
- The Furukawa Electric (Japan)
- Fukuda Metal Foil & Powder (Japan)
- Nippon Denkai (Japan)
- Doosan (Korea)
- ILJIN (Korea)
- Anhui Tongguan Copper Foil Group (China)
- Ling Bao Wason Coper Foil Co Ltd (China)
- HuiZhou United Copper Foil Electronic Material (China)
- Mitsui Mining & Smelting (Japan)
- Chang Chun Group (Taiwan)
- Nan Ya Plastics (Taiwan)
- Co-tech Development (Taiwan)
- LCY Technology (Taiwan)
- Jiangxi Copper Yates Foil (China)
- Jiujiang Defu Technology (China)
- Shan Dong Jinbao Electronics (China)
Highlights of The Copper Foil for High Frequency and High Speed Substrate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electrolytic Copper Foil
- Calendered Copper Foil
- By Application:
- 5G Communication
- Automotive Electronics
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Copper Foil for High Frequency and High Speed Substrate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
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- Understanding Competition Scenario
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Copper foil is a high frequency and high speed substrate. It is used to create printed circuit boards, antennas, and other electronic components.
Some of the key players operating in the copper foil for high frequency and high speed substrate market are Mitsui Mining & Smelting (Japan), JX Nippon Mining & Metals (Japan), The Furukawa Electric (Japan), Fukuda Metal Foil & Powder (Japan), Nippon Denkai (Japan), Doosan (Korea), ILJIN (Korea), Anhui Tongguan Copper Foil Group (China), Ling Bao Wason Coper Foil Co Ltd (China), HuiZhou United Copper Foil Electronic Material (China), Mitsui Mining & Smelting (Japan), Chang Chun Group (Taiwan), Nan Ya Plastics (Taiwan), Co-tech Development (Taiwan), LCY Technology (Taiwan), Jiangxi Copper Yates Foil (China), Jiujiang Defu Technology (China), Shan Dong Jinbao Electronics (China).
The copper foil for high frequency and high speed substrate market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Copper Foil for High Frequency and High Speed Substrate Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Copper Foil for High Frequency and High Speed Substrate Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Copper Foil for High Frequency and High Speed Substrate Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Copper Foil for High Frequency and High Speed Substrate Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Copper Foil for High Frequency and High Speed Substrate Market Size & Forecast, 2018-2028
4.5.1 Copper Foil for High Frequency and High Speed Substrate Market Size and Y-o-Y Growth
4.5.2 Copper Foil for High Frequency and High Speed Substrate Market Absolute $ Opportunity
Chapter 5 Global Copper Foil for High Frequency and High Speed Substrate Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
5.2.1 Electrolytic Copper Foil
5.2.2 Calendered Copper Foil
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Copper Foil for High Frequency and High Speed Substrate Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
6.2.1 5G Communication
6.2.2 Automotive Electronics
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Copper Foil for High Frequency and High Speed Substrate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Copper Foil for High Frequency and High Speed Substrate Analysis and Forecast
9.1 Introduction
9.2 North America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
9.6.1 Electrolytic Copper Foil
9.6.2 Calendered Copper Foil
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
9.10.1 5G Communication
9.10.2 Automotive Electronics
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Copper Foil for High Frequency and High Speed Substrate Analysis and Forecast
10.1 Introduction
10.2 Europe Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
10.6.1 Electrolytic Copper Foil
10.6.2 Calendered Copper Foil
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
10.10.1 5G Communication
10.10.2 Automotive Electronics
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Copper Foil for High Frequency and High Speed Substrate Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
11.6.1 Electrolytic Copper Foil
11.6.2 Calendered Copper Foil
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
11.10.1 5G Communication
11.10.2 Automotive Electronics
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Copper Foil for High Frequency and High Speed Substrate Analysis and Forecast
12.1 Introduction
12.2 Latin America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
12.6.1 Electrolytic Copper Foil
12.6.2 Calendered Copper Foil
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
12.10.1 5G Communication
12.10.2 Automotive Electronics
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Copper Foil for High Frequency and High Speed Substrate Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Type
13.6.1 Electrolytic Copper Foil
13.6.2 Calendered Copper Foil
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Copper Foil for High Frequency and High Speed Substrate Market Size Forecast by Applications
13.10.1 5G Communication
13.10.2 Automotive Electronics
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Copper Foil for High Frequency and High Speed Substrate Market: Competitive Dashboard
14.2 Global Copper Foil for High Frequency and High Speed Substrate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsui Mining & Smelting (Japan)
14.3.2 JX Nippon Mining & Metals (Japan)
14.3.3 The Furukawa Electric (Japan)
14.3.4 Fukuda Metal Foil & Powder (Japan)
14.3.5 Nippon Denkai (Japan)
14.3.6 Doosan (Korea)
14.3.7 ILJIN (Korea)
14.3.8 Anhui Tongguan Copper Foil Group (China)
14.3.9 Ling Bao Wason Coper Foil Co Ltd (China)
14.3.10 HuiZhou United Copper Foil Electronic Material (China)
14.3.11 Mitsui Mining & Smelting (Japan)
14.3.12 Chang Chun Group (Taiwan)
14.3.13 Nan Ya Plastics (Taiwan)
14.3.14 Co-tech Development (Taiwan)
14.3.15 LCY Technology (Taiwan)
14.3.16 Jiangxi Copper Yates Foil (China)
14.3.17 Jiujiang Defu Technology (China)
14.3.18 Shan Dong Jinbao Electronics (China)
