Market Overview:
The global copper redistribution layer market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for copper redistribution layers in power ICs, microcontrollers, and other applications. In terms of type, the Cu RDL segment is expected to hold a major share of the global copper redistribution layer market during the forecast period. This can be attributed to its high thermal conductivity and low resistivity properties compared with other types of metal layers used in PCBs. In terms of application, the power IC segment is expected to hold a major share of the global copper redistribution layer market during the forecast period.
Product Definition:
A copper redistribution layer (CRL) is a substrate or PCB trace layer that is used to route traces between different areas of a PCB. The CRL also provides a low-impedance connection for routing signals between the board and the connector.
Cu RDL:
The Cu RDL is a thin copper film of about 0.1 to 1 nm thickness, which is applied between the dielectric layer and the wafer surface in DRAMs (Dynamic Random Access Memory). It helps in improving electrical performance by reducing capacitance and increasing conductivity of the wafer.
Cu/Ni/Au RDL:
Cu/Ni/Au RDL is a copper- nickel- silver alloy with composition of approximately 65% Copper, 20% Nickel and 15% Silver. It is used in applications such as printed circuit boards (PCB), electronics, solar panels and consumer durables owing to its superior properties including high conductivity, ductility and thermal stability.
Application Insights:
The power IC application segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. The segment copper redistribution layer market is expected to witness significant growth owing to its extensive use in various power applications such as motor drives, lighting, and other electronic equipment.
The microcontroller application segment was valued at USD 25.0 million in 2017 and is anticipated to grow at a CAGR of XX% from 2018 to 2030. Copper RDLs are used for decoupling capacitors that provide low-frequency noise immunity against signal input/output pins of integrated circuits which are used as controllers or processors on mobile phones, personal computers, industrial control systems etc. Other applications include consumer electronics (TV sets), medical equipment (x-ray machines), military & aerospace equipment (radar systems) etc.
Regional Analysis:
Asia Pacific dominated the global copper redistribution layer market in 2016 and is expected to continue its dominance over the forecast period. The presence of key electronic manufacturers such as Samsung Electronics Co., Ltd.; Sony Corporation; LG Electronics Inc.; and Fujifilm Holdings Corporation has driven the regional market growth. Copper distribution lines find application in various end-use industries such as consumer electronics, automotive, industrial applications, computing etc.
The Asia Pacific region is characterized by a large number of smartphone users who are increasingly adopting 4G enabled smartphones with high speed internet facilities. This trend is anticipated to increase demand for advanced power management solutions for enhanced battery life enhancement features on mobile phones thereby driving product demand over the forecast period.
North America accounted for a significant share owing to growing technological advancements coupled with an increasing focus on reducing energy consumption associated with electronic devices especially laptops.
Growth Factors:
- Increasing demand for copper in various end-use industries such as electrical and electronics, construction, transportation, and others is expected to drive the growth of copper redistribution layer market over the forecast period.
- Rising awareness about the benefits of using copper redistribution layer in electronic devices is another key factor that is anticipated to fuel the growth of this market in near future.
- Growing demand for miniaturization and higher performance in electronic devices is also projected to propel the growth of copper redistribution layer market during forecast period.
- Technological advancements taking place across different industry verticals are also expected to create new opportunities for players operating in this market over next few years.
Scope Of The Report
Report Attributes
Report Details
Report Title
Copper Redistribution Layer Market Research Report
By Type
Cu RDL, Cu/Ni/Au RDL
By Application
Power IC, Microcontroller, Other
By Companies
DuPont, Chipbond Technology Corporation, MagnaChip Semiconductor, Powertech Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
122
Number of Tables & Figures
86
Customization Available
Yes, the report can be customized as per your need.
Global Copper Redistribution Layer Market Report Segments:
The global Copper Redistribution Layer market is segmented on the basis of:
Types
Cu RDL, Cu/Ni/Au RDL
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Power IC, Microcontroller, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DuPont
- Chipbond Technology Corporation
- MagnaChip Semiconductor
- Powertech Technology
Highlights of The Copper Redistribution Layer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Cu RDL
- Cu/Ni/Au RDL
- By Application:
- Power IC
- Microcontroller
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Copper Redistribution Layer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Copper Redistribution Layer (CRL) is a layer of copper that is used to improve the performance of copper-based networks. CRLs are often placed on top of fiber optic cables in order to boost network speeds and reliability.
Some of the major companies in the copper redistribution layer market are DuPont, Chipbond Technology Corporation, MagnaChip Semiconductor, Powertech Technology.
The copper redistribution layer market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Copper Redistribution Layer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Copper Redistribution Layer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Copper Redistribution Layer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Copper Redistribution Layer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Copper Redistribution Layer Market Size & Forecast, 2020-2028
4.5.1 Copper Redistribution Layer Market Size and Y-o-Y Growth
4.5.2 Copper Redistribution Layer Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Cu RDL
5.2.2 Cu/Ni/Au RDL
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Power IC
6.2.2 Microcontroller
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Copper Redistribution Layer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Copper Redistribution Layer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Cu RDL
9.6.2 Cu/Ni/Au RDL
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Power IC
9.10.2 Microcontroller
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Cu RDL
10.6.2 Cu/Ni/Au RDL
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Power IC
10.10.2 Microcontroller
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Cu RDL
11.6.2 Cu/Ni/Au RDL
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Power IC
11.10.2 Microcontroller
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Cu RDL
12.6.2 Cu/Ni/Au RDL
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Power IC
12.10.2 Microcontroller
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Cu RDL
13.6.2 Cu/Ni/Au RDL
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Power IC
13.10.2 Microcontroller
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Copper Redistribution Layer Market: Competitive Dashboard
14.2 Global Copper Redistribution Layer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DuPont
14.3.2 Chipbond Technology Corporation
14.3.3 MagnaChip Semiconductor
14.3.4 Powertech Technology
