Market Overview:
The global copper wire bonding ICs market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for copper wire bonding ICs in consumer electronics, automotive, healthcare, military and defense, aviation and other applications. In terms of type, ball-ball bonds are the most popular type of copper wire bonding ICs and are expected to hold a dominant share in the market during the forecast period. However, wedge-wedge bonds are projected to grow at a higher CAGR than ball-ball bonds during the forecast period owing to their advantages such as low contact resistance and high reliability over traditional ball-ball bonded joints.
Product Definition:
A copper wire bonding IC is a type of integrated circuit that is used to create electrical connections between various components on a printed circuit board. Copper wire bonding ICs are important because they provide an efficient and reliable way to connect electronic components, which helps to ensure that the circuit board functions properly.
Ball-Ball Bonds:
Ball-ball bonds are a special type of wire bond used in integrated circuits (ICs) where the balls on either end of the wire are in contact with each other. The most common application is to connect power and ground wires for an IC, but it can also be used for any two wires that make good electrical contact.
Wedge-Wedge Bonds:
Wedge-wedge bonds are a special type of wire bond in which two wires are connected by using three or more wires. The number of the additional wires used to make a wedge depends on the type of ICs that are being packaged.
The figure above represents an example of wedge-wedge bond, where four leads (two from each side) come out from one lead and go towards another lead (in this case, it is going towards GND).
Application Insights:
The consumer electronics segment accounted for the largest revenue share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. Copper wire bonding ICs are used in various consumer electronic products such as smartphones, laptops, tablets, smart wearables and home appliances that require high performance and quality connections. The increasing use of these devices has led to an increase in demand for efficient manufacturing processes that reduce costs as well as time consumption while reducing wastage.
Copper wire bonding ICs help manufacturers design cost-effective production lines by providing solutions pertaining to automated assembly process with high yield and low scrap rate per unit area among others factors driving their demand across multiple applications segments including automotive, healthcare & medical equipment & systems, military & defense along with other niche markets such as aviation electronics or industrial automation systems etcetera.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region is home to several emerging economies, including China, India, and Japan. Increasing demand for consumer electronics across these countries has resulted in increased copper wire bonding requirements as well. In addition, rapid growth of industries such as healthcare & medical devices and automotive is also likely to drive product demand over the coming years.
The U.S., being one of the largest consumer markets for automobiles across North America has witnessed a surge in automobile production since 2016; however this industry faces stiff competition from low-cost producers based out of Mexico who offer vehicles at competitive prices with better features & characteristics than those offered by leading U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of wearable electronics
- Proliferation of the Internet of Things (IoT)
- Increased investment in semiconductor manufacturing
Scope Of The Report
Report Attributes
Report Details
Report Title
Copper Wire Bonding ICs Market Research Report
By Type
Ball-Ball Bonds, Wedge-Wedge Bonds, Ball-Wedge Bonds
By Application
Consumer Electronics, Automotive, Healthcare, Military And Defense, Aviation, Others
By Companies
Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution, Lattice Semiconductor, Infineon Technologies, KEMET, Quik-Pak, Freescale Semiconductor, TANAKA HOLDINGS, Fujitsu
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
243
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Copper Wire Bonding ICs Market Report Segments:
The global Copper Wire Bonding ICs market is segmented on the basis of:
Types
Ball-Ball Bonds, Wedge-Wedge Bonds, Ball-Wedge Bonds
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive, Healthcare, Military And Defense, Aviation, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Freescale Semiconductor
- Micron Technology
- Cirrus Logic
- Fairchild Semiconductor
- Maxim
- Integrated Silicon Solution
- Lattice Semiconductor
- Infineon Technologies
- KEMET
- Quik-Pak
- Freescale Semiconductor
- TANAKA HOLDINGS
- Fujitsu
Highlights of The Copper Wire Bonding ICs Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Ball-Ball Bonds
- Wedge-Wedge Bonds
- Ball-Wedge Bonds
- By Application:
- Consumer Electronics
- Automotive
- Healthcare
- Military And Defense
- Aviation
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Copper Wire Bonding ICs Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Copper wire bonding ICs are integrated circuits that use copper wires to connect the components on the chip. Copper wire bonding is a more efficient way to connect components than traditional methods, such as using solder. This allows for faster and more reliable connections between chips.
Some of the major players in the copper wire bonding ics market are Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution, Lattice Semiconductor, Infineon Technologies, KEMET, Quik-Pak, Freescale Semiconductor, TANAKA HOLDINGS, Fujitsu.
The copper wire bonding ics market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Copper Wire Bonding ICs Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Copper Wire Bonding ICs Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Copper Wire Bonding ICs Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Copper Wire Bonding ICs Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Copper Wire Bonding ICs Market Size & Forecast, 2018-2028
4.5.1 Copper Wire Bonding ICs Market Size and Y-o-Y Growth
4.5.2 Copper Wire Bonding ICs Market Absolute $ Opportunity
Chapter 5 Global Copper Wire Bonding ICs Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Copper Wire Bonding ICs Market Size Forecast by Type
5.2.1 Ball-Ball Bonds
5.2.2 Wedge-Wedge Bonds
5.2.3 Ball-Wedge Bonds
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Copper Wire Bonding ICs Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Copper Wire Bonding ICs Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive
6.2.3 Healthcare
6.2.4 Military And Defense
6.2.5 Aviation
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Copper Wire Bonding ICs Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Copper Wire Bonding ICs Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Copper Wire Bonding ICs Analysis and Forecast
9.1 Introduction
9.2 North America Copper Wire Bonding ICs Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Copper Wire Bonding ICs Market Size Forecast by Type
9.6.1 Ball-Ball Bonds
9.6.2 Wedge-Wedge Bonds
9.6.3 Ball-Wedge Bonds
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Copper Wire Bonding ICs Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive
9.10.3 Healthcare
9.10.4 Military And Defense
9.10.5 Aviation
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Copper Wire Bonding ICs Analysis and Forecast
10.1 Introduction
10.2 Europe Copper Wire Bonding ICs Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Copper Wire Bonding ICs Market Size Forecast by Type
10.6.1 Ball-Ball Bonds
10.6.2 Wedge-Wedge Bonds
10.6.3 Ball-Wedge Bonds
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Copper Wire Bonding ICs Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive
10.10.3 Healthcare
10.10.4 Military And Defense
10.10.5 Aviation
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Copper Wire Bonding ICs Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Copper Wire Bonding ICs Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Copper Wire Bonding ICs Market Size Forecast by Type
11.6.1 Ball-Ball Bonds
11.6.2 Wedge-Wedge Bonds
11.6.3 Ball-Wedge Bonds
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Copper Wire Bonding ICs Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive
11.10.3 Healthcare
11.10.4 Military And Defense
11.10.5 Aviation
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Copper Wire Bonding ICs Analysis and Forecast
12.1 Introduction
12.2 Latin America Copper Wire Bonding ICs Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Copper Wire Bonding ICs Market Size Forecast by Type
12.6.1 Ball-Ball Bonds
12.6.2 Wedge-Wedge Bonds
12.6.3 Ball-Wedge Bonds
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Copper Wire Bonding ICs Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive
12.10.3 Healthcare
12.10.4 Military And Defense
12.10.5 Aviation
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Copper Wire Bonding ICs Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Copper Wire Bonding ICs Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Copper Wire Bonding ICs Market Size Forecast by Type
13.6.1 Ball-Ball Bonds
13.6.2 Wedge-Wedge Bonds
13.6.3 Ball-Wedge Bonds
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Copper Wire Bonding ICs Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive
13.10.3 Healthcare
13.10.4 Military And Defense
13.10.5 Aviation
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Copper Wire Bonding ICs Market: Competitive Dashboard
14.2 Global Copper Wire Bonding ICs Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Freescale Semiconductor
14.3.2 Micron Technology
14.3.3 Cirrus Logic
14.3.4 Fairchild Semiconductor
14.3.5 Maxim
14.3.6 Integrated Silicon Solution
14.3.7 Lattice Semiconductor
14.3.8 Infineon Technologies
14.3.9 KEMET
14.3.10 Quik-Pak
14.3.11 Freescale Semiconductor
14.3.12 TANAKA HOLDINGS
14.3.13 Fujitsu
