Market Overview:
The global CoS die-bonder market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for CoS die-bonders in various applications such as SiPhotonics, optical device packaging, data communication / 5G, 3D sensor / LiDAR and augmented reality. Additionally, the growing demand for miniaturization and higher performance in electronic devices is also fueling the growth of the global CoS die-bonder market. However, high initial investment and lack of skilled labor are some of the major factors restraining the growth of this market.
Product Definition:
Die-bonding is the process of bonding two or more metal surfaces, usually by means of a molten alloy (solder), to create a permanent joint.
Fully Automatic:
Fully automatic CoS die-bonder is a high performance machine tool used for manufacturing semiconductor devices. The fully automatic CoS die-bonder can produce more than three wafers per month. It has the ability to perform various functions such as handling of different types of substrates, chamber cleaning, and material removal from the chamber wall without any manual intervention.
Semi Automatic:
Semi-automatic CoS die-bonder is a machine tool used for manufacturing semiconductor devices. It includes features such as high speed, high accuracy, and repeatability which are necessary to manufacture semiconductors with the help of few automated processes.
The major advantage of using semi automatic CoS die bander is that it reduces the time required to complete one unit by half and also helps in mass production.
Application Insights:
The SiPhotonics segment dominated the global CoS die-bonder market in terms of revenue in 2017. The growth can be attributed to the increasing demand for high-speed data transfer and communication services across various end-use industries such as IT & telecommunication, consumer electronics, healthcare and automotive. Moreover, a rise in R&D activities pertaining to optical devices is expected to boost product demand over the forecast period.
The 3D sensor/LiDAR segment is anticipated to witness significant growth over the forecast period owing to rising adoption of autonomous vehicles globally. To ensure safety while driving on blind turns or crosswalks with augmented reality LiDAR sensors are used by many car manufacturers which results in increased production volumes for these components globally thereby contributing towards market growth during this period.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period owing to rapid developments in telecommunication and IT sectors. The increasing demand for die-bonder co-packaging solutions in emerging economies, such as China and India, is also expected to drive growth over the next eight years.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to high product adoption across various application segments including data communication & 5G, 3D sensor/ LiDAR, optical devices packaging and SiPhotonics. The growing manufacturing sector across this region will further boost industry expansion during the forecast period.
Europe was valued at USD X million in 2017 due to high demand from end users for efficient die packaging solutions with advanced technologies such as laser cutting or water jet cutting that offer superior performance compared with traditional methods used by CoS Die Bonders Europe Ltd., which drives growth over the projected period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from automotive and medical industries
- Growing popularity of LED lighting
- Proliferation of smart devices and the Internet of Things (IoT)
- Technological advancements
Scope Of The Report
Report Attributes
Report Details
Report Title
CoS Die-Bonder Market Research Report
By Type
Fully Automatic, Semi Automatic
By Application
SiPhotonics, Optical Device Packaging, Data Communication / 5G, 3D Sensor / LiDAR, Augmented Reality
By Companies
ASM AMICRA Microtechnologies GmbH, MRSI Systems, Toray Engineering Co Ltd, Paroteq GmbH, Four Technos, Finetech, SMTnet, Ficon TEC Service GmbH, SET Corporation SA, Kaijo Corporation, Yuasa Electronics Co Ltd, Paroteq GmbH, Lumentum Holdings
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
223
Number of Tables & Figures
157
Customization Available
Yes, the report can be customized as per your need.
Global CoS Die-Bonder Market Report Segments:
The global CoS Die-Bonder market is segmented on the basis of:
Types
Fully Automatic, Semi Automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SiPhotonics, Optical Device Packaging, Data Communication / 5G, 3D Sensor / LiDAR, Augmented Reality
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASM AMICRA Microtechnologies GmbH
- MRSI Systems
- Toray Engineering Co Ltd
- Paroteq GmbH
- Four Technos
- Finetech
- SMTnet
- Ficon TEC Service GmbH
- SET Corporation SA
- Kaijo Corporation
- Yuasa Electronics Co Ltd
- Paroteq GmbH
- Lumentum Holdings
Highlights of The CoS Die-Bonder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi Automatic
- By Application:
- SiPhotonics
- Optical Device Packaging
- Data Communication / 5G
- 3D Sensor / LiDAR
- Augmented Reality
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the CoS Die-Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
CoS Die-Bonder is a tool that helps you die cut shapes out of cardstock quickly and easily. It has a built in blade that cuts through the paper easily, and it also has an easy to use die cutting wheel. This makes it perfect for creating quick and easy cards or other projects.
Some of the major companies in the cos die-bonder market are ASM AMICRA Microtechnologies GmbH, MRSI Systems, Toray Engineering Co Ltd, Paroteq GmbH, Four Technos, Finetech, SMTnet, Ficon TEC Service GmbH, SET Corporation SA, Kaijo Corporation, Yuasa Electronics Co Ltd, Paroteq GmbH, Lumentum Holdings.
The cos die-bonder market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 CoS Die-Bonder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 CoS Die-Bonder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 CoS Die-Bonder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the CoS Die-Bonder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global CoS Die-Bonder Market Size & Forecast, 2018-2028
4.5.1 CoS Die-Bonder Market Size and Y-o-Y Growth
4.5.2 CoS Die-Bonder Market Absolute $ Opportunity
Chapter 5 Global CoS Die-Bonder Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 CoS Die-Bonder Market Size Forecast by Type
5.2.1 Fully Automatic
5.2.2 Semi Automatic
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global CoS Die-Bonder Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 CoS Die-Bonder Market Size Forecast by Applications
6.2.1 SiPhotonics
6.2.2 Optical Device Packaging
6.2.3 Data Communication / 5G
6.2.4 3D Sensor / LiDAR
6.2.5 Augmented Reality
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global CoS Die-Bonder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 CoS Die-Bonder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America CoS Die-Bonder Analysis and Forecast
9.1 Introduction
9.2 North America CoS Die-Bonder Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America CoS Die-Bonder Market Size Forecast by Type
9.6.1 Fully Automatic
9.6.2 Semi Automatic
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America CoS Die-Bonder Market Size Forecast by Applications
9.10.1 SiPhotonics
9.10.2 Optical Device Packaging
9.10.3 Data Communication / 5G
9.10.4 3D Sensor / LiDAR
9.10.5 Augmented Reality
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe CoS Die-Bonder Analysis and Forecast
10.1 Introduction
10.2 Europe CoS Die-Bonder Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe CoS Die-Bonder Market Size Forecast by Type
10.6.1 Fully Automatic
10.6.2 Semi Automatic
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe CoS Die-Bonder Market Size Forecast by Applications
10.10.1 SiPhotonics
10.10.2 Optical Device Packaging
10.10.3 Data Communication / 5G
10.10.4 3D Sensor / LiDAR
10.10.5 Augmented Reality
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific CoS Die-Bonder Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific CoS Die-Bonder Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific CoS Die-Bonder Market Size Forecast by Type
11.6.1 Fully Automatic
11.6.2 Semi Automatic
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific CoS Die-Bonder Market Size Forecast by Applications
11.10.1 SiPhotonics
11.10.2 Optical Device Packaging
11.10.3 Data Communication / 5G
11.10.4 3D Sensor / LiDAR
11.10.5 Augmented Reality
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America CoS Die-Bonder Analysis and Forecast
12.1 Introduction
12.2 Latin America CoS Die-Bonder Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America CoS Die-Bonder Market Size Forecast by Type
12.6.1 Fully Automatic
12.6.2 Semi Automatic
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America CoS Die-Bonder Market Size Forecast by Applications
12.10.1 SiPhotonics
12.10.2 Optical Device Packaging
12.10.3 Data Communication / 5G
12.10.4 3D Sensor / LiDAR
12.10.5 Augmented Reality
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) CoS Die-Bonder Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) CoS Die-Bonder Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) CoS Die-Bonder Market Size Forecast by Type
13.6.1 Fully Automatic
13.6.2 Semi Automatic
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) CoS Die-Bonder Market Size Forecast by Applications
13.10.1 SiPhotonics
13.10.2 Optical Device Packaging
13.10.3 Data Communication / 5G
13.10.4 3D Sensor / LiDAR
13.10.5 Augmented Reality
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 CoS Die-Bonder Market: Competitive Dashboard
14.2 Global CoS Die-Bonder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASM AMICRA Microtechnologies GmbH
14.3.2 MRSI Systems
14.3.3 Toray Engineering Co Ltd
14.3.4 Paroteq GmbH
14.3.5 Four Technos
14.3.6 Finetech
14.3.7 SMTnet
14.3.8 Ficon TEC Service GmbH
14.3.9 SET Corporation SA
14.3.10 Kaijo Corporation
14.3.11 Yuasa Electronics Co Ltd
14.3.12 Paroteq GmbH
14.3.13 Lumentum Holdings
