Market Overview:
The global dicing die-attach tape market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher packing density in semiconductor devices, rising demand for advanced packaging technologies, and growing trend of 3D ICs. In terms of type, the non-conductive type segment is expected to hold a larger share of the market during the forecast period owing to its low cost and easy handling properties. However, with advancements in technology, conductive type tapes are gaining popularity as they offer better electrical performance than their non-conductive counterparts.
Product Definition:
Die-attach tape is a type of adhesive tape used to attach semiconductor dies to substrates. It is also known as die bonding tape, die attach film, or chip bonding film. Die-attach tape is typically made from polyimide, but can also be made from other materials such as epoxy and acrylic.
Non-Conductive Type:
Non-conductive type is a new term in the industry and has been used for die attach tape mainly. It is also known as anti-static or dielectric tape. The major difference between these two types of tapes are that non-conductive type can withstand high voltage charges whereas, conductive type will allow charges to build up on it but cannot withstand high voltage charges.
Conductive Type:
Conductive type is a new term in the Dicing Die-Attach (DDA) market and it has been used to differentiate between two major types of products that are produced by cutting machines: non-conductive and conductive. The dielectric properties of the non-conductive material make them suitable for use as an insulating layer between metal tapes and dies, while the conductivity helps in maintaining electrical continuity across different materials during tape bonding.
Application Insights:
The demand for the die-attach tape in the global market is expected to be driven by its use in die attach procedures of integrated circuits. The growing demand for ICs is anticipated to drive product consumption over the forecast period. Die attach procedures are used to bond a substrate, such as a PCB, with an IC using thermal conductive paste or solder.
The usage of these tapes helps reduce heat transfer from the device and increases efficiency during soldering operations leading to increased adoption across end-use industries including automotive and electronics. These products also find applications in bonding various substrates that include metal, glass fiber reinforced plastic (GFRP), ceramic tiles and ceramics among others which require high thermal resistance between two surfaces bonded together.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period owing to rapid technological advancements and increasing demand for semiconductor devices. The presence of key electronic device manufacturers such as Samsung Electronics Co., Ltd.; Foxconn Technology Group; Wistron Corporation; and others are contributing towards market growth in this region.
The Asia Pacific was followed by Europe, which accounted for a revenue share of more than 20% in 2017 on account of high product demand from various end-use industries including electrical & electronics, automotive, computing & laptops, telecommunication among others. Increasing R&D activities coupled with rising industrialization is anticipated to fuel the regional market growth over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of wearable electronics
- Proliferation of 3D printing technology
- Increasing demand for semiconductor packaging materials
Scope Of The Report
Report Attributes
Report Details
Report Title
Dicing Die-Attach Tape Market Research Report
By Type
Non-Conductive Type, Conductive Type
By Application
Die to Substrate, Die to Die, Die to Die FOW
By Companies
LINTEC ADVANCED TECHNOLOGIES, NITTO DENKO, Furukawa, Henkel Adhesives, LG, AI Technology, Inc., Hitachi Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
154
Number of Tables & Figures
108
Customization Available
Yes, the report can be customized as per your need.
Global Dicing Die-Attach Tape Market Report Segments:
The global Dicing Die-Attach Tape market is segmented on the basis of:
Types
Non-Conductive Type, Conductive Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Die to Substrate, Die to Die, Die to Die FOW
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- LINTEC ADVANCED TECHNOLOGIES
- NITTO DENKO
- Furukawa
- Henkel Adhesives
- LG
- AI Technology, Inc.
- Hitachi Chemical
Highlights of The Dicing Die-Attach Tape Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Non-Conductive Type
- Conductive Type
- By Application:
- Die to Substrate
- Die to Die
- Die to Die FOW
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Dicing Die-Attach Tape Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Dicing die-attach tape is a type of adhesive tape that is used to attach dies to a workpiece. It has a strong adhesive and can hold die pieces together while they are being cut.
Some of the key players operating in the dicing die-attach tape market are LINTEC ADVANCED TECHNOLOGIES, NITTO DENKO, Furukawa, Henkel Adhesives, LG, AI Technology, Inc., Hitachi Chemical.
The dicing die-attach tape market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Dicing Die-Attach Tape Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Dicing Die-Attach Tape Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Dicing Die-Attach Tape Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Dicing Die-Attach Tape Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Dicing Die-Attach Tape Market Size & Forecast, 2018-2028
4.5.1 Dicing Die-Attach Tape Market Size and Y-o-Y Growth
4.5.2 Dicing Die-Attach Tape Market Absolute $ Opportunity
Chapter 5 Global Dicing Die-Attach Tape Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Dicing Die-Attach Tape Market Size Forecast by Type
5.2.1 Non-Conductive Type
5.2.2 Conductive Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Dicing Die-Attach Tape Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Dicing Die-Attach Tape Market Size Forecast by Applications
6.2.1 Die to Substrate
6.2.2 Die to Die
6.2.3 Die to Die FOW
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Dicing Die-Attach Tape Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Dicing Die-Attach Tape Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Dicing Die-Attach Tape Analysis and Forecast
9.1 Introduction
9.2 North America Dicing Die-Attach Tape Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Dicing Die-Attach Tape Market Size Forecast by Type
9.6.1 Non-Conductive Type
9.6.2 Conductive Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Dicing Die-Attach Tape Market Size Forecast by Applications
9.10.1 Die to Substrate
9.10.2 Die to Die
9.10.3 Die to Die FOW
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Dicing Die-Attach Tape Analysis and Forecast
10.1 Introduction
10.2 Europe Dicing Die-Attach Tape Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Dicing Die-Attach Tape Market Size Forecast by Type
10.6.1 Non-Conductive Type
10.6.2 Conductive Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Dicing Die-Attach Tape Market Size Forecast by Applications
10.10.1 Die to Substrate
10.10.2 Die to Die
10.10.3 Die to Die FOW
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Dicing Die-Attach Tape Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Dicing Die-Attach Tape Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Dicing Die-Attach Tape Market Size Forecast by Type
11.6.1 Non-Conductive Type
11.6.2 Conductive Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Dicing Die-Attach Tape Market Size Forecast by Applications
11.10.1 Die to Substrate
11.10.2 Die to Die
11.10.3 Die to Die FOW
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Dicing Die-Attach Tape Analysis and Forecast
12.1 Introduction
12.2 Latin America Dicing Die-Attach Tape Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Dicing Die-Attach Tape Market Size Forecast by Type
12.6.1 Non-Conductive Type
12.6.2 Conductive Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Dicing Die-Attach Tape Market Size Forecast by Applications
12.10.1 Die to Substrate
12.10.2 Die to Die
12.10.3 Die to Die FOW
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Dicing Die-Attach Tape Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Dicing Die-Attach Tape Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Dicing Die-Attach Tape Market Size Forecast by Type
13.6.1 Non-Conductive Type
13.6.2 Conductive Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Dicing Die-Attach Tape Market Size Forecast by Applications
13.10.1 Die to Substrate
13.10.2 Die to Die
13.10.3 Die to Die FOW
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Dicing Die-Attach Tape Market: Competitive Dashboard
14.2 Global Dicing Die-Attach Tape Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 LINTEC ADVANCED TECHNOLOGIES
14.3.2 NITTO DENKO
14.3.3 Furukawa
14.3.4 Henkel Adhesives
14.3.5 LG
14.3.6 AI Technology, Inc.
14.3.7 Hitachi Chemical
