Market Overview:
The global dicing die bonding films market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. In addition, the growing trend of 3D printing is also contributing to the growth of this market. Based on type, the global dicing die bonding films market can be segmented into UV curing type and normal type. The UV curing type segment is expected to grow at a higher CAGR than the normal type segment during the forecast period from 2018 to 2030. This can be attributed to its properties such as high bond strength, low shrinkage, and superior thermal stability that make it suitable for use in various applications such as chip-to-chip, chip-to-substrate, and others. Based on application, the global dicing die bonding films market can be divided into three segments: chip-to-chip, chip-to substrate (C2S), and others (including flip chips). The chip-to -chip application segment is projected to register highest CAGR during 2018–2030 owing high adoption rate in consumer electronics sector across different regions globally .
Product Definition:
Dicing Die Bonding Films are thin, adhesive films that are used to bond diced semiconductor wafers together. This helps to create a more stable and consistent product, and also makes it easier to handle the individual wafers.
UV Curing Type:
UV curing type is a new concept in the Dicing Die Bonding Films market. It utilizes Ultraviolet (UV) light to cure the polymer resin which then sets into a rigid shape. The process takes less time than other traditional drying methods and has no requirement of external heat or pressure, making it safer for use in high volume production lines.
Normal Type:
Normal type is a method of manufacturing films by the double roll process. In this process, two film sheets are wound together to form a single layer and then the edge of one sheet is sealed to form an enclosed bond area. The other sheet forms the outside bond area. This method produces normal polyethylene terephthalate (PET) resin films having excellent clarity and transparency as well as high tensile strength properties for use in packaging applications such as bottles or containers.
Application Insights:
The others application segment held the largest market share in 2017. The other applications include chip to substrate, die to die and wafer bonding. Wafer bonding is expected to be the fastest growing application over the forecast period owing to its increasing use in high-density chips and flexible substrates for electronic devices.
Chip-to-chip dicing films are used for reducing interconnection distances between different chips or between a chip and an integrated circuit board (ICB). These products are also used for packaging of microcontrollers, programmable timer/oscillators, digital signal processors (DSPs), etc., which require small size compared with conventional ICs.
Chip on glass (COG) is another popular product among various manufacturers as it provides thermal management benefits along with mechanical strength required for handling large size dies while maintaining low costs associated with COG production process.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for advanced electronic devices in countries such as China, India, and Japan. In addition, rising investments by semiconductor manufacturers in developing countries of Asia Pacific are anticipated to fuel market growth over the next eight years.
The industry is witnessing a shift from traditional UV curing methods due to their harmful effects on workers’ eyes and skin. As a result of this changeover, chip makers are also shifting towards more efficient dicing processes that require less time and cost than conventional ones do; thereby driving demand across several industries in Asia Pacific region.
North America accounted for 23% share of global revenue in 2017 owing to high product consumption by various end-use industries such as medical & healthcare (18%), consumer electronics (13%) etc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of LED lighting
- Proliferation of 3D printing technology
- Increasing demand for semiconductor devices
Scope Of The Report
Report Attributes
Report Details
Report Title
Dicing Die Bonding Films Market Research Report
By Type
UV Curing Type, Normal Type
By Application
Chip to Chip, Chip to Substrate, Others
By Companies
Hitachi Chemical, Promex, Furukawa, LINTEC, Nitto, Henkel, Hitachi Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
223
Number of Tables & Figures
157
Customization Available
Yes, the report can be customized as per your need.
Global Dicing Die Bonding Films Market Report Segments:
The global Dicing Die Bonding Films market is segmented on the basis of:
Types
UV Curing Type, Normal Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Chip to Chip, Chip to Substrate, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Hitachi Chemical
- Promex
- Furukawa
- LINTEC
- Nitto
- Henkel
- Hitachi Chemical
Highlights of The Dicing Die Bonding Films Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Curing Type
- Normal Type
- By Application:
- Chip to Chip
- Chip to Substrate
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Dicing Die Bonding Films Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Dicing die bonding films is a process where small pieces of film are cut from a roll and then bonded together. This creates a very strong bond between the two pieces of film, which can be used to create products such as displays or packaging.
Some of the major players in the dicing die bonding films market are Hitachi Chemical, Promex, Furukawa, LINTEC, Nitto, Henkel, Hitachi Chemical.
The dicing die bonding films market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Dicing Die Bonding Films Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Dicing Die Bonding Films Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Dicing Die Bonding Films Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Dicing Die Bonding Films Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Dicing Die Bonding Films Market Size & Forecast, 2018-2028
4.5.1 Dicing Die Bonding Films Market Size and Y-o-Y Growth
4.5.2 Dicing Die Bonding Films Market Absolute $ Opportunity
Chapter 5 Global Dicing Die Bonding Films Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Dicing Die Bonding Films Market Size Forecast by Type
5.2.1 UV Curing Type
5.2.2 Normal Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Dicing Die Bonding Films Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Dicing Die Bonding Films Market Size Forecast by Applications
6.2.1 Chip to Chip
6.2.2 Chip to Substrate
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Dicing Die Bonding Films Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Dicing Die Bonding Films Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Dicing Die Bonding Films Analysis and Forecast
9.1 Introduction
9.2 North America Dicing Die Bonding Films Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Dicing Die Bonding Films Market Size Forecast by Type
9.6.1 UV Curing Type
9.6.2 Normal Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Dicing Die Bonding Films Market Size Forecast by Applications
9.10.1 Chip to Chip
9.10.2 Chip to Substrate
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Dicing Die Bonding Films Analysis and Forecast
10.1 Introduction
10.2 Europe Dicing Die Bonding Films Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Dicing Die Bonding Films Market Size Forecast by Type
10.6.1 UV Curing Type
10.6.2 Normal Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Dicing Die Bonding Films Market Size Forecast by Applications
10.10.1 Chip to Chip
10.10.2 Chip to Substrate
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Dicing Die Bonding Films Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Dicing Die Bonding Films Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Dicing Die Bonding Films Market Size Forecast by Type
11.6.1 UV Curing Type
11.6.2 Normal Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Dicing Die Bonding Films Market Size Forecast by Applications
11.10.1 Chip to Chip
11.10.2 Chip to Substrate
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Dicing Die Bonding Films Analysis and Forecast
12.1 Introduction
12.2 Latin America Dicing Die Bonding Films Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Dicing Die Bonding Films Market Size Forecast by Type
12.6.1 UV Curing Type
12.6.2 Normal Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Dicing Die Bonding Films Market Size Forecast by Applications
12.10.1 Chip to Chip
12.10.2 Chip to Substrate
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Dicing Die Bonding Films Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Dicing Die Bonding Films Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Dicing Die Bonding Films Market Size Forecast by Type
13.6.1 UV Curing Type
13.6.2 Normal Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Dicing Die Bonding Films Market Size Forecast by Applications
13.10.1 Chip to Chip
13.10.2 Chip to Substrate
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Dicing Die Bonding Films Market: Competitive Dashboard
14.2 Global Dicing Die Bonding Films Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Hitachi Chemical
14.3.2 Promex
14.3.3 Furukawa
14.3.4 LINTEC
14.3.5 Nitto
14.3.6 Henkel
14.3.7 Hitachi Chemical
