Market Overview:
The global die attach adhesive market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for semiconductor packaging and SMT assembly applications. Die attach adhesive is used in the assembly of semiconductor devices and electronic circuits. It helps in bonding the chip or die to a substrate, which improves the performance and reliability of the device. Die attach adhesive paste, film, and wire are some of the major types available in this market. Die attach adhesive paste is widely used due to its low cost and easy handling properties. It also offers good thermal conductivity and high bond strength between die and substrate materials.
Product Definition:
Die attach adhesive is a bonding agent used to adhere semiconductor dies to their respective substrates. Die attach adhesive is an important component in the fabrication of semiconductor devices, as it ensures that the dies are securely attached and electrically connected to their respective substrates.
Die Attach Paste:
Die attach paste is a high-performance, two-component epoxy system that bonds metal or plastic substrates to both surfaces of the substrate. It offers several advantages over other bonding solutions such as low viscosity and higher thermal resistance. Die Attach Paste also provides clean removal with minimal residue when compared to other products in the market such as cyanoacrylates and polyurethane adhesives.
Die Attach Film:
Die Attach film is a type of synthetic paper tape used in the packaging industry. It is also known as thermal transfer paper or heat-sensitive paper and it can be categorized under polyester films. Die attach film has high demand in various end-use industries such as food & beverage, pharmaceuticals, electronics, and others which include personal care products packaging among others.
Application Insights:
The semiconductor packaging segment accounted for the largest revenue share of over 30.0% in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to factors such as high demand for advanced products with enhanced performance, rising R&D expenditure on new product development by manufacturers, and increasing focus on die attach as a means of improving yield.
SMT assembly is one of the fastest growing application segments owing to several advantages offered by die attach adhesive including improved thermal management, low-cost production methods compared to wire bonders or leaded tapes, and higher packing density resulting in smaller footprints when compared with traditional PCB assembly techniques.
Regional Analysis:
Asia Pacific dominated the global die attach adhesive market in 2017. The region is expected to continue its dominance over the forecast period as well. This can be attributed to increasing demand for electronic products, such as mobiles, laptops, tablets and personal computers from developing countries like China and India. In addition, rising investments by foreign players in this region are anticipated to fuel industry growth over the next eight years.
The European market accounted for a significant share of global revenue in 2017 owing to high demand from several major application industries including automotive.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: Die attach adhesive is used to connect the semiconductor die to the substrate, and its performance is critical in ensuring the reliability of electronic devices. As consumer demand for smaller and more powerful electronics continues to grow, the need for high-quality die attach adhesive will also increase.
- Rising demand from automotive industry: The automotive industry is one of the largest consumers of electronic components, and as it continues to grow, so too will its demand for reliable die attach adhesive.
- Growing popularity of LED lighting: LEDs are becoming increasingly popular due to their energy efficiency and long lifespan, which has led to a surge in their use in both residential and commercial applications. As this trend continues, the market for LED lighting will grow rapidly, driving up demand for die attach adhesive products as well.
- Proliferation of mobile devices: With over 2 billion active mobile device users worldwide, there is a large and growing market potential for companies that can provide innovative solutions that improve device performance or reduce manufacturing costs. Die attach adhesive products that meet these needs are likely to see strong growth in coming years as more manufacturers adopt them into their production lines.. 5) Technological advancements: The development of new adhesives technologies – such as those that allow higher bonding strength at lower temperatures – can help boost growth prospects for the dieattach adhesive market by making it easier and cheaperto manufacture high-quality electronics products
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Attach Adhesive Market Research Report
By Type
Die Attach Paste, Die Attach Film, Die Attach Wire
By Application
SMT Assembly, Semiconductor Packaging
By Companies
Senju (SMIC), Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, TONGFANG TECH, Heraeu, Sumitomo Bakelite, AIM, Senju (SMIC), Asahi Solder, Kyocera, Shanghai Jinji, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, Palomar Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
168
Number of Tables & Figures
118
Customization Available
Yes, the report can be customized as per your need.
Global Die Attach Adhesive Market Report Segments:
The global Die Attach Adhesive market is segmented on the basis of:
Types
Die Attach Paste, Die Attach Film, Die Attach Wire
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju (SMIC)
- Alpha Assembly Solutions
- Shenmao Technology
- Henkel
- Shenzhen Weite New Material
- Indium
- TONGFANG TECH
- Heraeu
- Sumitomo Bakelite
- AIM
- Senju (SMIC)
- Asahi Solder
- Kyocera
- Shanghai Jinji
- NAMICS
- Hitachi Chemical
- Nordson EFD
- Dow
- Inkron
- Palomar Technologies
Highlights of The Die Attach Adhesive Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Die Attach Paste
- Die Attach Film
- Die Attach Wire
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Attach Adhesive Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die Attach adhesive is a type of adhesive that is used to attach materials together. It is often used in the construction industry, where it is used to attach metal plates to other metal plates or sheets. Die Attach adhesive can also be used in the manufacturing industry, where it is often used toattach parts together during production.
Some of the major players in the die attach adhesive market are Senju (SMIC), Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, TONGFANG TECH, Heraeu, Sumitomo Bakelite, AIM, Senju (SMIC), Asahi Solder, Kyocera, Shanghai Jinji, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, Palomar Technologies.
The die attach adhesive market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Die Attach Adhesive Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Die Attach Adhesive Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Die Attach Adhesive Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Die Attach Adhesive Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Die Attach Adhesive Market Size & Forecast, 2018-2028
4.5.1 Die Attach Adhesive Market Size and Y-o-Y Growth
4.5.2 Die Attach Adhesive Market Absolute $ Opportunity
Chapter 5 Global Die Attach Adhesive Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Die Attach Adhesive Market Size Forecast by Type
5.2.1 Die Attach Paste
5.2.2 Die Attach Film
5.2.3 Die Attach Wire
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Die Attach Adhesive Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Die Attach Adhesive Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Die Attach Adhesive Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Die Attach Adhesive Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Die Attach Adhesive Analysis and Forecast
9.1 Introduction
9.2 North America Die Attach Adhesive Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Die Attach Adhesive Market Size Forecast by Type
9.6.1 Die Attach Paste
9.6.2 Die Attach Film
9.6.3 Die Attach Wire
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Die Attach Adhesive Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Die Attach Adhesive Analysis and Forecast
10.1 Introduction
10.2 Europe Die Attach Adhesive Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Die Attach Adhesive Market Size Forecast by Type
10.6.1 Die Attach Paste
10.6.2 Die Attach Film
10.6.3 Die Attach Wire
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Die Attach Adhesive Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Die Attach Adhesive Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Die Attach Adhesive Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Die Attach Adhesive Market Size Forecast by Type
11.6.1 Die Attach Paste
11.6.2 Die Attach Film
11.6.3 Die Attach Wire
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Die Attach Adhesive Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Die Attach Adhesive Analysis and Forecast
12.1 Introduction
12.2 Latin America Die Attach Adhesive Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Die Attach Adhesive Market Size Forecast by Type
12.6.1 Die Attach Paste
12.6.2 Die Attach Film
12.6.3 Die Attach Wire
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Die Attach Adhesive Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Die Attach Adhesive Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Die Attach Adhesive Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Die Attach Adhesive Market Size Forecast by Type
13.6.1 Die Attach Paste
13.6.2 Die Attach Film
13.6.3 Die Attach Wire
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Die Attach Adhesive Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Die Attach Adhesive Market: Competitive Dashboard
14.2 Global Die Attach Adhesive Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Senju (SMIC)
14.3.2 Alpha Assembly Solutions
14.3.3 Shenmao Technology
14.3.4 Henkel
14.3.5 Shenzhen Weite New Material
14.3.6 Indium
14.3.7 TONGFANG TECH
14.3.8 Heraeu
14.3.9 Sumitomo Bakelite
14.3.10 AIM
14.3.11 Senju (SMIC)
14.3.12 Asahi Solder
14.3.13 Kyocera
14.3.14 Shanghai Jinji
14.3.15 NAMICS
14.3.16 Hitachi Chemical
14.3.17 Nordson EFD
14.3.18 Dow
14.3.19 Inkron
14.3.20 Palomar Technologies
