Market Overview:
The global die attach film market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher integration in semiconductor devices, rising demand for advanced packaging solutions, and growing trend of 3D ICs. In terms of type, the non-conductive type segment is expected to hold a larger share of the market during the forecast period owing to its low cost and high reliability. However, with advancements in technology, conductive type films are gaining traction as they offer better electrical performance than traditional non-conductive films. In terms of application, die attach film is used in three primary applications: die to substrate; die to die; and film on wire bonding. The largest application segment is Die To Substrate due which held more than 60% share of the total market revenue in 2017.
Product Definition:
Die attach film is a thin, transparent adhesive film used to attach dies to a printing plate. The adhesive on the die attach film helps keep the die in place during the printing process, ensuring accurate and consistent printing.
Non-Conductive Type:
Non-Conductive Type, also known as die attach film is a type of packaging material that is widely used in the semiconductor industry. It protects sensitive electronic parts from coming in contact with each other as well as from external environmental factors such as magnetic fields and electric fields.
The non-conductive type market for die attach film can be segmented on the basis of application into consumer electronics & appliances, automotive & transportation and industrial equipment among others.
Conductive Type:
Conductive types are the metalized polymer films that are attached to the wafer during die attach. The main function of these films is to provide an electrical connection between pads on a wafer and circuits in a package. They also help in providing thermal conductivity between different components of a device, thus improving performance and reducing power consumption.
Application Insights:
The demand for the product in die to substrate application is expected to register a CAGR of XX% from 2018 to 2030 owing to increasing use of the product in manufacturing integrated circuits and other semiconductors. The growth can be attributed to factors such as growing demand for electronic devices, technological advancements and government initiatives that support innovation in the electronics industry.
The market is categorized based on die attach film application into die attach film Die To Substrate, Die To Die, And Film On Wire Application. In 2017, die attach filmDie To Substrate held the largest share of over 70%. This can be attributed due its high preference by device manufacturers as it provides excellent thermal management properties along with enhanced reliability and quality when attached onto dies or substrates during packaging process or before sending them for testing purposes.
Regional Analysis:
Asia Pacific dominated the global die attach film market in terms of revenue with a share of over 45.0% in 2017. This is attributed to increasing electronic manufacturing in countries such as China, India, and Japan. The region is expected to continue its dominance over the forecast period owing to growing demand for consumer electronics and automotive components among others.
The growth can also be attributed to increasing investments from multinational companies such as Samsung Electronics Co., Ltd., LG Chem Inc., and Sony Corporation amongst others that are investing heavily across Asia Pacific region for production expansion purposes coupled with low labor cost associated with Die Attach Films (DAT) industry within this region which makes it an ideal place for investment opportunities especially when compared against other developed regions globally.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of 3D printing technology
- Proliferation of mobile devices and the Internet of Things (IoT)
- Emergence of new applications
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Attach Film Market Research Report
By Type
Non-Conductive Type, Conductive Type
By Application
Die to Substrate, Die to Die, Film on Wire
By Companies
Furukawa, Henkel Adhesives, LG, AI Technology, Nitto, LINTEC Corporation, Hitachi Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
149
Number of Tables & Figures
105
Customization Available
Yes, the report can be customized as per your need.
Global Die Attach Film Market Report Segments:
The global Die Attach Film market is segmented on the basis of:
Types
Non-Conductive Type, Conductive Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Die to Substrate, Die to Die, Film on Wire
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Furukawa
- Henkel Adhesives
- LG
- AI Technology
- Nitto
- LINTEC Corporation
- Hitachi Chemical
Highlights of The Die Attach Film Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Non-Conductive Type
- Conductive Type
- By Application:
- Die to Substrate
- Die to Die
- Film on Wire
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Attach Film Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die Attach Film is a film production company based in Berlin, Germany. The company was founded by filmmakers Tobias Lindner and Stefanie Schwarzkopf in 2013. Die Attach Film produces feature films, short films, and documentaries.
Some of the key players operating in the die attach film market are Furukawa, Henkel Adhesives, LG, AI Technology, Nitto, LINTEC Corporation, Hitachi Chemical.
The die attach film market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Die Attach Film Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Die Attach Film Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Die Attach Film Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Die Attach Film Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Die Attach Film Market Size & Forecast, 2020-2028
4.5.1 Die Attach Film Market Size and Y-o-Y Growth
4.5.2 Die Attach Film Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Non-Conductive Type
5.2.2 Conductive Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Die to Substrate
6.2.2 Die to Die
6.2.3 Film on Wire
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Die Attach Film Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Die Attach Film Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Non-Conductive Type
9.6.2 Conductive Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Die to Substrate
9.10.2 Die to Die
9.10.3 Film on Wire
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Non-Conductive Type
10.6.2 Conductive Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Die to Substrate
10.10.2 Die to Die
10.10.3 Film on Wire
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Non-Conductive Type
11.6.2 Conductive Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Die to Substrate
11.10.2 Die to Die
11.10.3 Film on Wire
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Non-Conductive Type
12.6.2 Conductive Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Die to Substrate
12.10.2 Die to Die
12.10.3 Film on Wire
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Non-Conductive Type
13.6.2 Conductive Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Die to Substrate
13.10.2 Die to Die
13.10.3 Film on Wire
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Die Attach Film Market: Competitive Dashboard
14.2 Global Die Attach Film Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Furukawa
14.3.2 Henkel Adhesives
14.3.3 LG
14.3.4 AI Technology
14.3.5 Nitto
14.3.6 LINTEC Corporation
14.3.7 Hitachi Chemical
