Market Overview:
The global die bonding paste adhesive market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor packaging and LED/optoelectronics applications. In terms of type, the conductive segment is expected to grow at a higher CAGR than the non-conductive segment during the forecast period. This can be attributed to the growing demand for advanced packaging technologies, which require high-performance adhesives with good electrical conductivity. In terms of application, SMT assemblies are expected to account for a major share of the global die bonding paste adhesive market in 2018.
Product Definition:
Die Bonding Paste Adhesive is a type of adhesive that is used to bond two or more objects together. This type of adhesive is important because it can create a strong bond between two objects, which can help to keep them together.
Conductive:
Conductive is a paste-like material that can be applied to the wafer during die bonding. It allows for higher current density and improved performance of the device. The material has applications in various industries such as consumer electronics, automotive, telecommunication, etc.
The global conductive market size was valued at USD 1.6 billion in 2015.
Non-conductive:
Non-conductive materials are used in die bonding paste adhesive to provide insulation between circuit layers and the package. Paste is applied on both surfaces of a PCB, where then they are brought together by heat. The two PCBs do not make good electrical contact due to paste residues and other contaminants that get in the way of proper conduction.
Application Insights:
SMT assembly was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. SMT as a class of electronic devices has grown significantly in recent years owing to their rising use in various applications such as data communication, consumer electronics, medical equipment and others. The demand for high-quality Bonding Paste Adhesive (BPA) products used for SMT assembly is anticipated to drive growth over the forecast period.
The semiconductor packaging segment held a significant share of 9% in terms of revenue on account of growing die size & complexity along with increasing number & size of bond pads on integrated circuits which require precise alignment for optimum performance. Semiconductor manufacturers are continuously striving towards smaller geometries while packing more features onto an integrated circuit chip which requires highly aligned components during fabrication processes using photoresist techniques that aid Die Bonding Paste Adhesives (DBPAs).
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand from end-use industries such as electronics, automotive, medical devices, etc. China led the Asia Pacific die bonding paste adhesive industry owing to presence of numerous electronic manufacturing companies in this country.
The Latin American market for die bonding paste adhesives is also anticipated to witness significant growth over the coming years due to rapid development in various end-use sectors such as aerospace & defense and electrical & electronics among others. Increasing number of electronic component manufacturers based out of Brazil is also likely to boost product demand within this region during the forecast period.
Europe was estimated at USD X million in 2017.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: Die bonding paste adhesive is used to connect the semiconductor die to the substrate. This helps in reducing the size of electronic devices and increases their efficiency.
- Growing demand for advanced packaging technologies: Die bonding paste adhesive is used in various advanced packaging technologies such as wafer-level packaging, 3D ICs, and 2.5D/3D integration. This is driving the growth of the market.
- Rising demand from automotive industry: The automotive industry is one of the major consumers of die bonding paste adhesive owing to its use in various applications such as engine control units (ECUs), airbag sensors, and anti-lock braking systems (ABS).
- Increasing investments by leading players: Leading players are investing heavily in research and development activities to develop innovative products that can cater to the needs of different end-use industries. This is helping them expand their customer base and strengthen their position in the market.
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Bonding Paste Adhesive Market Research Report
By Type
Conductive, Non-conductive
By Application
SMT Assemblies, Semiconductor Packaging, LED/Optoelectronics, Others
By Companies
Indium, Henkel Adhesives, Alpha Assembly Solutions, Sumitomo Bakelite, Asahi Solder, AI Technology, Showa Denko Materials (America) Inc., Tamura, Nordson EFD, Shenmao Technology, Indium, AIM, Heraeu, DoW, SMIC (Senju Metal Industry Co.)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
176
Number of Tables & Figures
124
Customization Available
Yes, the report can be customized as per your need.
Global Die Bonding Paste Adhesive Market Report Segments:
The global Die Bonding Paste Adhesive market is segmented on the basis of:
Types
Conductive, Non-conductive
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assemblies, Semiconductor Packaging, LED/Optoelectronics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Indium
- Henkel Adhesives
- Alpha Assembly Solutions
- Sumitomo Bakelite
- Asahi Solder
- AI Technology
- Showa Denko Materials (America) Inc.
- Tamura
- Nordson EFD
- Shenmao Technology
- Indium
- AIM
- Heraeu
- DoW
- SMIC (Senju Metal Industry Co.)
Highlights of The Die Bonding Paste Adhesive Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Conductive
- Non-conductive
- By Application:
- SMT Assemblies
- Semiconductor Packaging
- LED/Optoelectronics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Bonding Paste Adhesive Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die Bonding Paste is a type of adhesive that is used to join two pieces of wood together. It is made from a mixture of epoxy and hardener, which allows it to adhere to both the wood surface and the other object being attached.
Some of the major companies in the die bonding paste adhesive market are Indium, Henkel Adhesives, Alpha Assembly Solutions, Sumitomo Bakelite, Asahi Solder, AI Technology, Showa Denko Materials (America) Inc., Tamura, Nordson EFD, Shenmao Technology, Indium, AIM, Heraeu, DoW, SMIC (Senju Metal Industry Co.).
The die bonding paste adhesive market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Die Bonding Paste Adhesive Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Die Bonding Paste Adhesive Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Die Bonding Paste Adhesive Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Die Bonding Paste Adhesive Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Die Bonding Paste Adhesive Market Size & Forecast, 2018-2028
4.5.1 Die Bonding Paste Adhesive Market Size and Y-o-Y Growth
4.5.2 Die Bonding Paste Adhesive Market Absolute $ Opportunity
Chapter 5 Global Die Bonding Paste Adhesive Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Die Bonding Paste Adhesive Market Size Forecast by Type
5.2.1 Conductive
5.2.2 Non-conductive
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Die Bonding Paste Adhesive Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Die Bonding Paste Adhesive Market Size Forecast by Applications
6.2.1 SMT Assemblies
6.2.2 Semiconductor Packaging
6.2.3 LED/Optoelectronics
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Die Bonding Paste Adhesive Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Die Bonding Paste Adhesive Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Die Bonding Paste Adhesive Analysis and Forecast
9.1 Introduction
9.2 North America Die Bonding Paste Adhesive Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Die Bonding Paste Adhesive Market Size Forecast by Type
9.6.1 Conductive
9.6.2 Non-conductive
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Die Bonding Paste Adhesive Market Size Forecast by Applications
9.10.1 SMT Assemblies
9.10.2 Semiconductor Packaging
9.10.3 LED/Optoelectronics
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Die Bonding Paste Adhesive Analysis and Forecast
10.1 Introduction
10.2 Europe Die Bonding Paste Adhesive Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Die Bonding Paste Adhesive Market Size Forecast by Type
10.6.1 Conductive
10.6.2 Non-conductive
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Die Bonding Paste Adhesive Market Size Forecast by Applications
10.10.1 SMT Assemblies
10.10.2 Semiconductor Packaging
10.10.3 LED/Optoelectronics
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Die Bonding Paste Adhesive Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Die Bonding Paste Adhesive Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Die Bonding Paste Adhesive Market Size Forecast by Type
11.6.1 Conductive
11.6.2 Non-conductive
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Die Bonding Paste Adhesive Market Size Forecast by Applications
11.10.1 SMT Assemblies
11.10.2 Semiconductor Packaging
11.10.3 LED/Optoelectronics
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Die Bonding Paste Adhesive Analysis and Forecast
12.1 Introduction
12.2 Latin America Die Bonding Paste Adhesive Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Die Bonding Paste Adhesive Market Size Forecast by Type
12.6.1 Conductive
12.6.2 Non-conductive
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Die Bonding Paste Adhesive Market Size Forecast by Applications
12.10.1 SMT Assemblies
12.10.2 Semiconductor Packaging
12.10.3 LED/Optoelectronics
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Die Bonding Paste Adhesive Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Die Bonding Paste Adhesive Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Die Bonding Paste Adhesive Market Size Forecast by Type
13.6.1 Conductive
13.6.2 Non-conductive
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Die Bonding Paste Adhesive Market Size Forecast by Applications
13.10.1 SMT Assemblies
13.10.2 Semiconductor Packaging
13.10.3 LED/Optoelectronics
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Die Bonding Paste Adhesive Market: Competitive Dashboard
14.2 Global Die Bonding Paste Adhesive Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Indium
14.3.2 Henkel Adhesives
14.3.3 Alpha Assembly Solutions
14.3.4 Sumitomo Bakelite
14.3.5 Asahi Solder
14.3.6 AI Technology
14.3.7 Showa Denko Materials (America) Inc.
14.3.8 Tamura
14.3.9 Nordson EFD
14.3.10 Shenmao Technology
14.3.11 Indium
14.3.12 AIM
14.3.13 Heraeu
14.3.14 DoW
14.3.15 SMIC (Senju Metal Industry Co.)
