Market Overview:
The global die bonding paste market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor packaging and automotive applications, and the growing trend of miniaturization in electronic devices. In terms of type, the no-clean pastes segment is expected to lead the market during the forecast period, owing to its low environmental impact and compatibility with a wide range of substrates.
Product Definition:
Die bonding paste is a material that is used to bond two or more surfaces together. It can be used to attach die to a substrate, or to attach two substrates together. The paste acts as an adhesive, and helps to create a strong bond between the surfaces.
No-Clean Pastes:
No-Clean pastes are specialty surface preparation chemicals that are used to eliminate the contamination and enhance the adhesion of materials such as metals, ceramics or glass on surfaces. These products have applications in various end-use industries including automotive, aerospace & defense and electronics among others.
Rosin Based Pastes:
The rosin-based pastes are used as die bonding paste in the production of semiconductors and electronic components. The product is manufactured from pine resin, which is extracted from the needles of pine trees. Rosin-based products have high demand in Asia Pacific due to low cost compared to other substitutes such as phenolic impregnated or polyimide based products.
The market for rosin based pastes.
Application Insights:
The semiconductor packaging segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. The growth can be attributed to factors such as high demand for die bonders due to increasing number of SMT assembly activities. Die bonding is a popular technique used by electronic component manufacturers because it offers higher reliability than soldering, while reducing time required for assembly.
SMT or surface-mount technology uses small components that are mounted on a printed circuit board (PCB) using solderless connections called SMT leads or pins. Surface mount devices have smaller footprints and consume less PCB space than conventional through-hole components do, which makes them highly suitable in modern multi-layer PCBs with limited space available between layers. Die bonding increases overall reliability of these small parts since they are attached using strong adhesives that cannot easily be detached without breaking the device into pieces first.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand from end-use industries such as automotive, electronics, medical devices, etc. China emerged as a major consumer and producer in this region owing to low manufacturing cost coupled with easy availability of labor & raw materials.
The growing population coupled with rapid urbanization has led to increased construction activities across Asia Pacific which is anticipated would have a positive impact on product demand over the forecast period. In addition, rising disposable income will also contribute towards regional growth during the same period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of LED lighting
- Proliferation of 3D printing technology
- Increasing demand for semiconductor devices
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Bonding Paste Market Research Report
By Type
No-Clean Pastes, Rosin Based Pastes, Water Soluble Pastes, Others
By Application
SMT Assembly, Semiconductor Packaging, Automotive, Medical, Others
By Companies
SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, TONGFANG TECH, Heraeu, Sumitomo Bakelite, AIM, Tamura, Asahi Solder, Kyocera, Shanghai Jinji, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, Palomar Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
187
Number of Tables & Figures
131
Customization Available
Yes, the report can be customized as per your need.
Global Die Bonding Paste Market Report Segments:
The global Die Bonding Paste market is segmented on the basis of:
Types
No-Clean Pastes, Rosin Based Pastes, Water Soluble Pastes, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging, Automotive, Medical, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SMIC
- Alpha Assembly Solutions
- Shenmao Technology
- Henkel
- Shenzhen Weite New Material
- Indium
- TONGFANG TECH
- Heraeu
- Sumitomo Bakelite
- AIM
- Tamura
- Asahi Solder
- Kyocera
- Shanghai Jinji
- NAMICS
- Hitachi Chemical
- Nordson EFD
- Dow
- Inkron
- Palomar Technologies
Highlights of The Die Bonding Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- No-Clean Pastes
- Rosin Based Pastes
- Water Soluble Pastes
- Others
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Automotive
- Medical
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Bonding Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die Bonding Paste is a type of adhesive that is used to join two pieces of metal. It is made from a mixture of epoxy and hardener, which are then mixed together and applied to the surfaces to be bonded. Die Bonding Paste can be used in a variety of applications, including manufacturing, construction, and engineering.
Some of the key players operating in the die bonding paste market are SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, TONGFANG TECH, Heraeu, Sumitomo Bakelite, AIM, Tamura, Asahi Solder, Kyocera, Shanghai Jinji, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, Palomar Technologies.
The die bonding paste market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Die Bonding Paste Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Die Bonding Paste Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Die Bonding Paste Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Die Bonding Paste Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Die Bonding Paste Market Size & Forecast, 2020-2028
4.5.1 Die Bonding Paste Market Size and Y-o-Y Growth
4.5.2 Die Bonding Paste Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 No-Clean Pastes
5.2.2 Rosin Based Pastes
5.2.3 Water Soluble Pastes
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.2.3 Automotive
6.2.4 Medical
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Die Bonding Paste Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Die Bonding Paste Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 No-Clean Pastes
9.6.2 Rosin Based Pastes
9.6.3 Water Soluble Pastes
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.10.3 Automotive
9.10.4 Medical
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 No-Clean Pastes
10.6.2 Rosin Based Pastes
10.6.3 Water Soluble Pastes
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.10.3 Automotive
10.10.4 Medical
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 No-Clean Pastes
11.6.2 Rosin Based Pastes
11.6.3 Water Soluble Pastes
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.10.3 Automotive
11.10.4 Medical
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 No-Clean Pastes
12.6.2 Rosin Based Pastes
12.6.3 Water Soluble Pastes
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.10.3 Automotive
12.10.4 Medical
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 No-Clean Pastes
13.6.2 Rosin Based Pastes
13.6.3 Water Soluble Pastes
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.10.3 Automotive
13.10.4 Medical
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Die Bonding Paste Market: Competitive Dashboard
14.2 Global Die Bonding Paste Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 SMIC
14.3.2 Alpha Assembly Solutions
14.3.3 Shenmao Technology
14.3.4 Henkel
14.3.5 Shenzhen Weite New Material
14.3.6 Indium
14.3.7 TONGFANG TECH
14.3.8 Heraeu
14.3.9 Sumitomo Bakelite
14.3.10 AIM
14.3.11 Tamura
14.3.12 Asahi Solder
14.3.13 Kyocera
14.3.14 Shanghai Jinji
14.3.15 NAMICS
14.3.16 Hitachi Chemical
14.3.17 Nordson EFD
14.3.18 Dow
14.3.19 Inkron
14.3.20 Palomar Technologies
